NeXLev® High-Density Mezzanine Connector

Amphenol's NeXLev high-density parallel board connector is the solution to meet increasing bandwidth demands in mezzanine applications.

Features

• 125 micron co-planarity
• 57 real signals per linear centimeter (145 signals per inch)
• 20 stacking heights from 10-33mm

Specifications

• Performance — NeXLev handles data rates up to 12 Gb/s.
• High-Density — Single-ended: Up to 57 real signals per linear centimeter (145 signals per linear inch.) or differential: 29 differential pairs per linear centimeter (73 differential pairs per linear inch.)
• Reliability — NeXLev features rugged wafer construction and a compliant BGA-style attachment.
• Flexibility — NeXLev allows you to partition your system in different ways, optimizing performance while you design for manufacturability.
• Available Stacking Heights: NeXLev is available in mated heights from 10-33mm; offered in 100, 200, and 300 position modules.

Flexibility for optimized solutions

• Today’s daughtercards can contain thousands of components, increasing the potential for low production yields. NeXLev helps you alleviate that risk by reducing the overall complexity of your cards. Using NeXLev, you can relocate high pin count devices onto a mezzanine or module card to simplify board routing without compromising system performance. This creates islands of high density for scalable processing, memory modules, or interfacing I/O cabling modules. Placing these high-density, high thermal mass devices on a module also allows you to optimize your surface mount processes, resulting in improved yields, and reduced overall cost.
• NeXLev not only improves the design of new systems, it can be used to upgrade existing systems. Use it to plug in new high-featured mezzanine cards to an existing system or add more processors or memory in the form of module cards.