Mobile Devices

Amphenol designs and manufactures an extensive range of interconnect products, antennas and electromechanical components found in a wide array of mobile computing devices. Amphenol’s capability for high-volume production of these technically demanding, miniaturized products, combined with our speed of new product introduction, are critical drivers of our long-term success in this market. Our solutions address consumer electronics, e-readers, laptops, mobile phones, mobile phone accessories, mobile computing devices, smartphones, tablets, ultrabooks and wearable and hearable devices.

Visit our global sites to learn more: Amphenol Mobile Consumer Products

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Product 2.2-5 Connector Series
2.2-5 Connector Series
Amphenol RF's line of 2.2-5 connectors is a lightweight and compact version of the 4.3-10 connector series, designed to accommodate various cable types.

Product 4.3-10 Connector Series
4.3-10 Connector Series
Amphenol RF offers a full range of 4.3-10 connectors and adapters, which are engineered for the wireless market and are ideal for applications requiring low passive intermodulation, or PIM.

Product AgilBrick™ 1.27mm Board-to-Board Header G802
AgilBrick™ 1.27mm Board-to-Board Header G802
AgilBrick™ 1.27mm Board-to-Board Header G802 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.

Product AgilBrick™ 2.00mm Board-to-Board Header G825
AgilBrick™ 2.00mm Board-to-Board Header G825
AgilBrick™ 2.00mm Board-to-Board Header G825 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.

Product AgilBrick™ 2.54mm Board-to-Board Header G800
AgilBrick™ 2.54mm Board-to-Board Header G800
AgilBrick™ 2.54mm Board-to-Board Header G800 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.

Product AgilLink™ 2.00mm Wire-to-Board Header G823
AgilLink™ 2.00mm Wire-to-Board Header G823
AgilLink™ 2.00mm Wire-to-Board Header G823 Series is the most common solution for transferring power and signal. It can mate with both wire-to-board and board-to-board applications. This series can carry a maximum current rating of 4A. Amphenol ICC offers a comprehensive range of these headers including, V/T DIP, V/T SMT, R/A DIP to meet various customer requirements.

Product BergStak® 0.50mm Mezzanine Connector
BergStak® 0.50mm Mezzanine Connector
The BergStak® product range is expanded to include 0.5mm mezzanine connectors. Available in 3mm to 6mm stack height options in 0.5mm increments, this connector is offered in 10 to 60 positions in 10 position increments. Designed with scoop-proof housing the terminals are protected from damage when parts are mated.

Product BergStak® FX10 0.50mm Board-to-Board Connector
BergStak® FX10 0.50mm Board-to-Board Connector
FCI Basics BergStak® product range is expanded to include a 0.50 mm BergStak® FX10 board-to-board connector known for its fast data transmission and high signal quality. This connector is offered in 144 positions and is available in 4.30mm and 6.00mm stack height options. BergStak® FX10 supports speed performance up to 15Gb/s+ and is available in vertical SMT configuration.

Product BergStak® Lite 0.80mm Board-to-Board Connector
BergStak® Lite 0.80mm Board-to-Board Connector
Amphenol's BergStak® Lite 0.8mm is a comprehensive, versatile, and flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 4 sizes up to 100 positions. This is an economical version that uses Gold Flash plating that can meet up to 50 mating cycles while extending the mechanical advantage of the standard BergStak® 0.80mm.

Product BTFW Floating Board To Board
BTFW Floating Board To Board
The BTFW Series is a floating board-to-board connector system consisting of plugs and receptacles with two rows of staggered contacts on 1.00mm (0.039in.) centerlines. This connector system is designed for applications that require high density, and high reliability interconnects with higher pin counts and surface mount termination, such as audio-video (AV) and navigation systems in automobiles.

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