Amphenol is one of the world’s largest designers, manufacturers and marketers of connectors and interconnect systems, antennas solutions, sensors and high-speed cable. Our connector and connector system solutions include fiber optic interconnect, harsh environment interconnect, high-speed interconnect, power interconnect, power distribution and busbars and radio frequency (RF) interconnect products. Our sensors and sensor-based product solutions include gas and moisture sensors, level sensors, position sensor, pressure sensors, temperature sensors and vibration sensors. Our value-added cable assemblies include cable assemblies and harnesses, cable management products and backplane interconnect systems. Our cable solutions include coaxial cable, power cable and specialty cable. We also provide combiner/splitter products, flexible and rigid printed circuit boards, hinges and molded parts.
Electrical installation for buses, special vehicles, machines (construction and agricultural), marine, and rolling stock (low and high voltage).
Traditional and CAN-based installation (power, signal, communication wires, and cables), with various means of protection.
Wired Control Panels are used in the cockpit or in the avionic bay. Features are done through wired electromechanical components such as toggle, rotary, breakers, indicators. They may incorporate a Front Face Panel with lighted legends, touches. We hold Part21G and PART145 certificates for production & maintenance. We support product design and certification by delivering full documentation.
Small to large and low to complex wire harness assemblies with up to 1000 circuits, for on-road and off-road specialty vehicles and military ground vehicles. Production volumes range from low to high volume and include ultra-low prototypes and quick turn requirements. Applications include over-molding. Production resources are in the U.S. and Mexico. We have ITAR certification and DoD MLAs.
Tecvox supplies Qi-certified Wireless charging solutions to global vehicular OEMs with both passive and actively cooled solutions providing optimum performance and charging experience. Our products are homologated in over 120 countries and can provide RFID protection, foreign obstacle detection, NFC, CAN and LIN communication, antenna coupling, and phone as key features.
WireLock® is a 1.80mm pitch wire-to-board connector system. Its compact design addresses the growing need for space-saving automotive-grade connectors. WireLock® is a double row connector system offering four coding types with different colors.
This series is economical PCB terminal blocks, which mainly take 2P/3P as the base pole and can be combined into any desired pole according to customers' requirements. With anti-vibration characteristics, flexible and convenient connection mode. Space 2.50mm-10.16mm, product design in line with IEC/EN60998, IEC/EN60947-7-4, UL1059, CSA C2.22 No.158, and other international standards.
FCI Basics 1.20mm wire-to-board connector system is low profile and compact with 3, 4, and 6 pin counts. The plug and receptacle use a frictional mating method enabling up to 20 mating cycles.
The enclosed receptacle makes sure that the side entry matings are secure in tight spaces. Additional polarized key slots prevent any misalignment between the plug and receptacle.
FCI Basics 1.25mm wire-to-board connector system is designed for a wide variety of applications in Industrial, Automotive, and Consumer markets. The comprehensive range consists of terminals, crimp housings, and PCB headers in straight and RA, SMT, and through-hole configurations. It is available in 2 to 15 circuits in a single row. 1.25mm WTB solution conforms to the EU Industry Safety Standard.
Designed to secure and guidewire bundles throughout an aircraft, Amphenol Air LB France's wiring accessories are designed with strength, stability, and weight reduction in mind. They come in a large variety of sizes, shapes, and materials. They are able to support large bundles and high-stress requirements.
Applied to Smart Home - Thermostat.
Compatible with PCB sockets, providing a variety of wiring methods.
Socket with tenon fixed can be provided for matching.
DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS
X2's upgraded platform maintains backward mating interface compatibility with existing XCede® products while offering new backplane configurations. Mid-plane-based orthogonal solutions are available for 6-Pair along with the others, supporting both 85Ω and 100Ω to meet a wide variety of application needs, including Ethernet and PCI.
The XCede® I/O interconnect system is comprised of a 32-position, variable pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The XCede® I/O connector supports next-generation 100G+ applications and transmits up to 25 Gbps/serial-lane.
DESIGNED TO ACHIEVE 32G DATA RATE REQUIREMENTS
XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backward mating interface compatibility with existing XCede products.
ENABLING FUTURE DATA RATES
While maintaining the same mating interfaces, this connector design provides designers with readily available 85Ω and 100Ω solutions to meet a wide variety of application needs, including Ethernet and PCI.
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance computers.
XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®.
DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY
While maintaining the same mating interfaces with XCede® HD and XCede® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical.
The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures.
XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede® backplane header system provides the ruggedness and long-term reliability required by today's systems.
XFP is a 30pos 0.8mm pitch SMT receptacle designed to support 10 Gigabit Fibre Channel and Gigabit Ethernet with the ability to extend performance to 14 Gbps. It is constructed from a metal frame and the cage assembly is to be bezel-mounted to an I/O panel with compliant pins for pressing onto the host PCB. Its single row cage configuration requires less space & is cost-optimized.