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Backshells are available in different types for a variety of applications. In ground and naval applications, the robustness and the environmental sealing may be more important, whereas weight may be a prime consideration for space and Aerospace application. Military & Aerospace applications are governed by SAE, AS85049 standard, and our Backshells are designed to meet requirements of this standard

Backshell as per VG95319 as adapter with strain reliever shells for D38999 series 3. This forms a connection to a plug or a socket. This serves to seal or for continuing shielding. The backshells are available in various versions, straight or bent as tape adapters, individual cone adapters or mold adapters.

Bantam is a high-performance circular connector product range developed for aerospace applications where electrical performance must be met with affordability. High mating cycles along with excellent shell-to-shell electrical bonding for EMI are the benchmark of rugged connectors. Bantam provides a solution that meets your budget and performance goals.

High-quality fiber end faces, without connectors, ferrule, and coating, are a prerequisite and challenge at the same time for some applications due to their fragility. With our possibilities and experience, your fiber ends get an optimal surface according to your requirements.

HIGH POWER OCP-COMPATIBLE CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE Amphenol's BarKlip® BK1000 HD I/O power cable assemblies feature an OCP-compatible design, compliant with ORv3 power distribution architecture standards. Barklip® BK1000 HD IO can distribute up to 1000A per contact, load and return, and up to 2000A total. Designed similarly to other ORv3 busbar connectors

Amphenol's BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition

HIGH POWER OCP-COMPATIBLE CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE Amphenol's BarKlip® BK1200 HD I/O power cable assemblies feature an OCP-compatible design, compliant with ORv3 power distribution architecture standards. Barklip® BK1200 HD I/O can distribute up to 1250A per contact, load and return, and up to 2500A total.

The BarKlip® BK150 connector features 10 independent conducting beams that maintain contact with the mating busbar in common misaligned positions, therefore significantly lowering overall resistance. BarKlip® BK150's contacts include a stainless- steel helper spring to ensure that proper mating force is maintained and contact resistance is minimized throughout the life of the connection.

BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition.

Amphenol's BarKlip® BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition