Automotive
Amphenol is a leading supplier of advanced interconnect systems, sensors and antennas for a growing array of automotive applications. In addition, we have developed advanced technology solutions for hybrid and electric vehicles and are working with leading global customers to proliferate these advanced interconnect products into next-generation automobiles. Our primary solutions for automotive include antennas, electric vehicles, engine management and control, exhaust monitoring and cleaning, hybrid vehicles, infotainment and communications, lighting, power management, safety and security systems, sensing systems, telematics systems and transmission systems.
MEG-Array® R+
56GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM
Leveraging proven technologies, including an industry-leading BGA design, offering superior self-aligning and self-leveling. Next-generation differential pair contact design for up to 56Gb/s PAM4 and NRZ performance.
Metal Fabrication Components
Various build to print Metal Fabrication components and assemblies for Heavy Truck and Energy Storage system
Metal Injection Molding
Amphenol produces high-quality parts with over 90% metal density through our metal injection molding (MIM) process. The MIM process provides greater flexibility in design complexity, prevents corrosion, and provides a resistant polish. The MIM process is used on components of various applications including mobile phones, laptops, and industrial and automotive platforms.
Metal Substitution - Weight Reduction
Customer and application-specific molded components to replace metal parts for weight reduction. Consulting regarding plastic-specific design and structural requirements, tool design, and tool building.
Mezzostak® 0.50mm Pitch 5.2mm Stacked Height
Mezzostak® 0.50mm is a robust fine-pitch mezzanine connector suitable for a wide range of high-reliability applications and demanding environments. The innovative hermaphroditic design of these connectors provides a precise mating interface with extra housing guidance. Mezzostak® 0.50mm mezzanine connectors are available in 120 positions with other position options provided on request.
Mezzostak® 0.5mm Mezzanine Connectors
Mezzostak® is a robust 0.5mm fine pitch mezzanine connector suitable for a wide range of high-reliability applications and demanding environments. The hermaphroditic design of these connectors provides a precise mating interface with extra housing guidance. Mezzostak® 0.5mm are available in two versions, which offer a choice between supplemental PCB hold-downs and pegs for short overall length.
Micro-Bayonet
This series, a small footprint, lightweight, high contact density, stamped & formed crimp contact, IP54 rated metal bayonet coupling, signal connector. With three insert arrangements ranging from 7 to 15 contacts per connector and up to 3 amps possible with a standard operating temperature from -40°C to +125°C.
Micro SD and SD Card Sockets
MEMORY CARD CONNECTORS WITH SUPPORT FOR UHS-I AND UHS-II
Micro SD and SD card sockets are user-friendly and ideal for use in portable devices such as digital cameras and mobile phones. They are also suitable for server applications as well as automotive devices, notebooks, and servers.
Micro USB 2.0
Micro USB 2.0 connectors have power contacts of 1.8A and 3A current for fast charging. The plastic tongue and two-layer shells design ensure high reliability and prevent connector damage. Amphenol offers customized designs to suit various customer requirements. These connectors also offer high-speed signal stability of up to 480Mb/s transmission.
Micro USB 3.1 GEN 1
USB 3.1 Gen 1 now operates with full-duplex signaling over two differential pairs, improving host-directed simultaneous-bidirectional communication. USB 3.1 Micro offers a 5Gb/s signaling rate offering a 10x performance increase over Hi-Speed USB 2.0. SuperSpeed USB is backward compatible with USB 2.0 and will provide optimized power efficiency.