Automotive
Amphenol is a leading supplier of advanced interconnect systems, sensors and antennas for a growing array of automotive applications. In addition, we have developed advanced technology solutions for hybrid and electric vehicles and are working with leading global customers to proliferate these advanced interconnect products into next-generation automobiles. Our primary solutions for automotive include antennas, electric vehicles, engine management and control, exhaust monitoring and cleaning, hybrid vehicles, infotainment and communications, lighting, power management, safety and security systems, sensing systems, telematics systems and transmission systems.
Mechatronic Components
We manufacture mechatronic components such as switches and pushbuttons using highly automated production systems.
Mechatronic Sub Assemblies
Automated assemblies of molded components for functional subsystems in accordance with customer requirements on quality and functionality.
Media Hub
Tecvox delivers one of the broadest portfolios of Media Hubs with a wide range of protocols and configurations to many of the leading automotive and truck manufacturers around the world. Data communications and USB charging in highly efficient, dynamic thermal controlled, compact modules.
MEG-Array®
The MEG-Array® Mezzanine Connector provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly.
1.27x1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s. MEG-Array® is offered in a variety of PCB mezzanine stack heights
MEG-Array® R+
56GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM
Leveraging proven technologies, including an industry-leading BGA design, offering superior self-aligning and self-leveling. Next-generation differential pair contact design for up to 56Gb/s PAM4 and NRZ performance.
Metal Injection Molding
Amphenol produces high-quality parts with over 90% metal density through our metal injection molding (MIM) process. The MIM process provides greater flexibility in design complexity, prevents corrosion, and provides a resistant polish. The MIM process is used on components of various applications including mobile phones, laptops, and industrial and automotive platforms.
Metal Substitution - Weight Reduction
Customer and application-specific molded components to replace metal parts for weight reduction. Consulting regarding plastic-specific design and structural requirements, tool design, and tool building.
Mezzostak® 0.50mm Pitch 5.2mm Stacked Height
Mezzostak® 0.50mm is a robust fine-pitch mezzanine connector suitable for a wide range of high-reliability applications and demanding environments. The innovative hermaphroditic design of these connectors provides a precise mating interface with extra housing guidance. Mezzostak® 0.50mm mezzanine connectors are available in 120 positions with other position options provided on request.
Mezzostak® 0.5mm Mezzanine Connectors
Mezzostak® is a robust 0.5mm fine pitch mezzanine connector suitable for a wide range of high-reliability applications and demanding environments. The hermaphroditic design of these connectors provides a precise mating interface with extra housing guidance. Mezzostak® 0.5mm are available in two versions, which offer a choice between supplemental PCB hold-downs and pegs for short overall length.
Micro-Bayonet
This series, a small footprint, lightweight, high contact density, stamped & formed crimp contact, IP54 rated metal bayonet coupling, signal connector. With three insert arrangements ranging from 7 to 15 contacts per connector and up to 3 amps possible with a standard operating temperature from -40°C to +125°C.