Commercial Aerospace
Amphenol is a leading provider of high-performance interconnect systems and components to the commercial aerospace market. In addition to connector and interconnect assembly products, we also provide rigid and flexible printed circuits as well as high-technology cable management products. Our products are specifically designed to operate in the harsh environments of commercial aerospace while also providing substantial weight reduction, simplified installation and minimal maintenance. Our solutions primarily address aircraft and airframe power distribution, avionics, controls and instrumentation, engines, in-flight entertainment, in-flight internet connectivity, lighting and control systems, and wire bundling and cable management.
Visit our global sites to learn more: Amphenol Military & Aerospace
Leap-AHRD
The 300Gb/s Leap-AHRD High-Speed Optical Module is faster, smaller, more cost, and power-efficient than most conventional data center interconnects. The on-board transceiver rugged device is capable of speeds up to 25Gbps and distances up to 100 meters. The optical cable can be routed above and around other components in the integrated heat-sink design.
Lightening Hole Bushing
QuickSNAP Lightening Bushings are made to help guide wired bundles through the aircraft’s frame and stringers. QuickSNAP Lightening Bushings significantly reduce installation times and the amount of foreign object debris (FOD). Made with smooth edges in order to reduce wire chaffing, available in various standard configurations and sizes, customization is always an option.
Lightweight C-Clamps
Lightweight C-Clamps provide routing, support, and fixing for cable harnesses of various diameters. They are used in the wing sections of aircraft, in the fuselage for power and electrical cables, as well as inside the cabin for in-flight entertainment or cabin service systems. Different materials and configurations are available depending on the temperature and routing of the conduits.
Lightweight Ground Modules
New, lightweight grounding modules are suitable for a wide variety of military and airframe power distribution and grounding system applications. A convenient footprint for mounting on airframe or vehicle frames. High altitude operating specifications, low outgassing, and a high degree of salt spray resistance make the modules suitable for space & near-space applications.
LMD and LMS
Designed to provide flexibility in the assembly of wire harnesses that are used in instrumentation and avionic control environments. The modular design of the LMD provides rack and panel or cable to cable attachment. Supplementing the LMD connector family, the LMS in-line splice connector; a low-cost interconnect that incorporates the LMD modules and contacts.
Low Cost LRM
Low-cost LRM variation for cost savings from traditional LRMs. Family of connectors designed for Secondary Power Distribution Systems.
Low Inductive Laminated Busbars
In power conversion systems, low inductance interconnects allow lower commutation losses and increased switching frequency. Amphenol Auxel dedicated project management teams and engineers design and manufacture custom state-of-the-art Laminated Busbars.
Low Profile RF Cable Assemblies
SV Microwave just released a new line of Low Profile RF cable assemblies that incorporate a unique ferrule design that protects the cable from overbending while maintaining a shorter distance from the front of the coupling nut to the back of the cable bend than standard offerings. The ferrule radius prevents the cable's overbending, which can cause defects that can lead to rework.
Low Profile Solderless PCB Edge Launch Connectors
SV’s new low profile RF solderless edge launch connectors are ideal for high frequency PCB applications. These rugged and reusable connectors occupy a smaller footprint on your board with a flange that is 30% smaller than the standard. Able to accommodate multiple PCB thicknesses, these connectors do not damage your board. Available in SMA, 2.92mm, 2.4mm and 1.85mm series.
LRM Connectors
Line replaceable module connectors are for motherboard/daughterboard chassis enclosures and have multiple options for contact count and termination methods. The utilization of Brush contacts with low mating force, ESD shields for Level II Maintenance, and lateral float for ultimate cold wall heat dissipation, make this board-to-board mating scheme the best solution for ruggedized chassis.