Defense
Amphenol is a world leader in the design, manufacture and supply of high-performance interconnect systems for harsh environment defense applications including vibration, pressure, humidity, nuclear radiation and severe temperature changes. We have unparalleled product breadth ranging from military specification connectors, customized high-speed board level interconnects, flexible to rigid printed circuit boards, backplane systems and integrated assemblies. Our solutions span most defense end markets including avionics, communications, engines, ground vehicles and tanks, homeland security, naval, ordnance and missile systems, radar systems, rotorcraft, satellite and space programs and unmanned aerial vehicles (UAV).
Visit our global sites to learn more: Amphenol Military & Aerospace
High Pin Count Backplane Connectors
The HPC connector is a traditional backplane interface providing rugged mechanical and electrical performance. It enables 3 and 4-row daughter cards to the backplane interface. On-board connector guiding and keying are available to control and discriminate daughter-card engagement with the backplane card slot.
High Speed Backplane (Customised)
Amphenol BSI (ABSI) are the trusted technology leader for more than 30 years in the Backplane & Midplane business. We design, build and test customised Backplane & Midplane solutions for most of the global leaders in IT Datacom and Telecoms technology systems. We have products performing to 56gb/s today in the production environment with speeds up to 112 Gb/s PAM4 in development.
High Speed RF Cable Assemblies
Amphenol SV Microwave offers a complete line of fixed length, high-frequency Ø.047" and Ø.085" cable assemblies in series: SMA, 2.92mm, 2.4mm, 1.85mm, SMP, & SMPM. These assemblies feature low solder wicking, and the high flexibility allows for tight bends behind the cable ferrule. Our low loss is your gain!
High Temperature Series Five Connectors
High Temperature Series Five connectors are the ideal solution for interconnect and electrical wire assemblies near engines, firewalls, and other high-heat sources. Built for applications with higher temperatures such as hyper-sonic weapon systems, small module nuclear reactors, space launch vehicles, and other advanced aircraft.
Iguana 38999
Iguana is intermateable with MIL-DTL-38999 Series III and is waterproof up to IP68 in both mated and unmated conditions. The series is optimised for PCB applications and is pre-loaded with pin-tail contacts and includes integrated moulded stand-offs to facilitate inspection and cleaning. Optional integral ground pins provide low-impedance shell-to-ground connections for improved EMI performance.
InstaBend 086
INSTABEND™ are flexible, coaxial microwave assemblies designed for interconnects between RF circuit cards, modules, and enclosure panels. The cable can be bent very closely behind the connector, simplifying cable routing.
JT - D38999 Series II
The JT connectors are in accordance with the MIL-DTL-38999 Series II standard. These connectors were developed to meet the needs of the aerospace industries. They offer a large variety of contact arrangements and shell styles, with maximum weight/space savings and reliability.
LC Field
The patented RJStop® system allows the use of a standard LC patch-cord in a metallic plug,
which will protect it from shock, dust, and fluids. There is no need for field termination.
This metallic plug connects to a receptacle, using a Tri-Start Thread coupling mechanism
(MIL-DTL-38999 Series III type) with an anti-decoupling device for high vibrations.
Leap-AHRD
The 300Gb/s Leap-AHRD High-Speed Optical Module is faster, smaller, more cost, and power-efficient than most conventional data center interconnects. The on-board transceiver rugged device is capable of speeds up to 25Gbps and distances up to 100 meters. The optical cable can be routed above and around other components in the integrated heat-sink design.
Lightweight Ground Modules
New, lightweight grounding modules are suitable for a wide variety of military and airframe power distribution and grounding system applications. A convenient footprint for mounting on airframe or vehicle frames. High altitude operating specifications, low outgassing, and a high degree of salt spray resistance make the modules suitable for space & near-space applications.