Amphenol is a world leader in the design, manufacture and supply of high-performance interconnect systems for harsh environment defense applications including vibration, pressure, humidity, nuclear radiation and severe temperature changes. We have unparalleled product breadth ranging from military specification connectors, customized high-speed board level interconnects, flexible to rigid printed circuit boards, backplane systems and integrated assemblies. Our solutions span most defense end markets including avionics, communications, engines, ground vehicles and tanks, homeland security, naval, ordnance and missile systems, radar systems, rotorcraft, satellite and space programs and unmanned aerial vehicles (UAV).
As part of our commitment to continuous quality improvement, SV has re-designed a line of thru-hole PCB connectors with current design standards to improve performance at higher frequencies. These connectors feature a contact that goes through the PCB and can launch directly to transmission lines on the opposite side. Current configurations include straight and right-angle SMP male connectors.
The HPC connector is a traditional backplane interface providing rugged mechanical and electrical performance. It enables 3 and 4-row daughter cards to the backplane interface. On-board connector guiding and keying are available to control and discriminate daughter-card engagement with the backplane card slot.
High Power 38999 incorporates RadSok, Temper-Grip, or standard high power contacts. Paired with the proven performance of the MIL-DTL-38999 connector series, High Power 38999 offers a variety of tooled arrangements specifically designed to carry high current (70 to 250 amps per contact, 240 to 1000 amps per connector).
Features high-current RadSok or Temper Grip socket contacts for a current-carrying capacity increase of up to 40%. Utilizing two proven connector mating designs (Matrix 5015 and MGT-5015) and a host of new contact termination methods, the High Power Series offers custom connector performance in a standard catalog offering.
Amphenol BSI (ABSI) are the trusted technology leader for more than 30 years in the Backplane & Midplane business. We design, build and test customised Backplane & Midplane solutions for most of the global leaders in IT Datacom and Telecoms technology systems. We have products performing to 56gb/s today in the production environment with speeds up to 112 Gb/s PAM4 in development.
High Temperature Series Five connectors are the ideal solution for interconnect and electrical wire assemblies near engines, firewalls, and other high-heat sources. Built for applications with higher temperatures such as hyper-sonic weapon systems, small module nuclear reactors, space launch vehicles, and other advanced aircraft.
An expansion of the MIL-DTL-38999 series to provide solutions for next-generation aircraft power requirements. Future power distribution architecture is moving toward higher voltages above what standard connectors are designed to accommodate. Amphenol HV38999 has been tested up to 1200 VAC / 1500 VDC* to remain partial discharge free @ 50,000 ft.
HVDC is a low mating force, high mating cycle connector that achieves enhanced performance due to multiple points of contact vs. standard 2 or 4 tine contacts. Weight savings with a composite shell and hollow pin design threaded or lug termination. Temperature rating: 180°C. Current Rating: 365 Amps
Iguana is intermateable with MIL-DTL-38999 Series III and is waterproof up to IP68 in both mated and unmated conditions. The series is optimised for PCB applications and is pre-loaded with pin-tail contacts and includes integrated moulded stand-offs to facilitate inspection and cleaning. Optional integral ground pins provide low-impedance shell-to-ground connections for improved EMI performance.
Piher Sensing System's high-accuracy eMotor inductive rotor position sensors (IPS) offer a cost-effective, reliable, and ASIL-D-compliant alternative to resolvers and other sensors for position sensing of high-speed motors. Inductive sensors use the physical principle of induction to detect the position of a solid metallic target, enabling reduced parts and higher design flexibility.