Industrial
Amphenol is a technology leader in the design, manufacture and supply of high-performance interconnect systems, sensors and antennas for a broad range of industrial applications. Our core competencies include application-specific industrial interconnect solutions utilizing integrated assemblies. Our primary end applications for industrial include agriculture equipment, alternative and traditional energy generation, batteries and hybrid drive systems, entertainment, factory automation, heavy equipment, instrumentation, internet of things (IoT), LED lighting, marine, medical equipment, oil and gas, power distribution, public safety, rail mass transit, smart manufacturing (IIoT), and transportation.
Visit our global sites to learn more: Amphenol Industrial Products Group and Amphenol Global Interconnect Systems
![Product Ball & Land Grid Array Socket System for 0.0394 [1.0mm] Adapters](https://staph.blob.core.windows.net/images-products/Ball-And-Land-Grid-Array-Socket-System-for-0-0394-[1-0mm]-Adapters-6532.png)
Ball & Land Grid Array Socket System for 0.0394 [1.0mm] Adapters
BGA sockets; which are high density and have superior electrical performance: Thermal Performance: Operating Temperature Range: -55 to 140C; Glass Transition Temperature Range: 150 to 200C; Electrical Performance: Maximum Voltage: 75 VAC / 100 VDC; Maximum Current: 1 Amperes per contact Contact Resistance: Dry Circuit: .01ΩMax. @ .01 Amps/5VDC Insulation Resistance, @ 500VDC: 10,000 MOhms Min.
![Product Ball & Land Grid Array Socket System for 0.050 [1.27mm] Adapters](https://staph.blob.core.windows.net/images-products/Ball-And-Land-Grid-Array-Socket-System-for-0-050-[1-27mm]-Adapters-6768.png)
Ball & Land Grid Array Socket System for 0.050 [1.27mm] Adapters
BGA sockets; which are high density and have superior electrical performance: Thermal Performance: Operating Temperature Range: -55 to 140C; Glass Transition Temperature Range: 150 to 200C; Electrical Performance: Maximum Voltage: 75 VAC / 100 VDC; Maximum Current: 1 Amperes per contact Contact Resistance: Dry Circuit: .01ΩMax. @ .01 Amps/5VDC Insulation Resistance, @ 500VDC: 10,000 MOhms Min.
Ball & Land Grid Array Socket System for .8mm, 1mm, 1.27mm, and 2.54mm Adapters
BGA sockets; which are high density and have superior electrical performance: Thermal Performance: Operating Temperature Range: -55 to 140C; Glass Transition Temperature Range: 150 to 200C; Electrical Performance: Maximum Voltage: 75 VAC / 100 VDC; Maximum Current: 1 Amperes per contact Contact Resistance: Dry Circuit: .01ΩMax. @ .01 Amps/5VDC Insulation Resistance, @ 500VDC: 10,000 MOhms Min.
Bare Fiber Optic Cables
High-quality fiber end faces, without connectors, ferrule, and coating, are a prerequisite and challenge at the same time for some applications due to their fragility. With our possibilities and experience, your fiber ends get an optimal surface according to your requirements.
BarKlip® BK200 I/O
BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition.
BarKlip® BK300 Connector
The BarKlip® BK300 connector features 14 independent conducting beams that maintain contact with the mating busbar. BK300's contacts are plated with Amphenol's proprietary silver-based AGT® plating technology to further reduce contact resistance and eliminate fretting corrosion commonly found in tin-plated connectors.
BarKlip® XP Connectors
HIGH POWER AND LOW RESISTANCE BUSBAR CONNECTOR
Amphenol's BarKlip® XP connectors feature independent points of contact that provide overall lower resistance and greater overall efficiency. BarKlip® XP series is capable of distributing anywhere from 150 to 1000A of power to busbar power distribution applications.
Barrier Terminal Block
In structure, they comprise panel feed-through type, baffle type, and pluggable type, and can connect all kinds of conducting wires whose cross-sections are 0.32mm² to 53.5mm². The spacing between 7.62mm and 11mm can be selected. It can provide covered or uncovered styles. Product design in line with IEC60998, UL1059, CSA C22.2 No.158, and other international standards.
Barrier Terminal Blocks
EBY offers a complete selection of industry standard terminal blocks and barrier strips - which may be customized to your needs - support a broad range of wire-to-board and wire-to-wire configurations.
For bare or terminated wires
Wire-to-board or wire-to-wire feed-through styles
No special tools required for installation
Easy field termination
Flexible design options - contact us!
Battery and Miscellaneous Cables
Unlimited Services manufactures heavy-gauge battery and miscellaneous cables, often kitted with wire harnesses, for on-road and off-road specialty vehicles and military ground vehicles. Production volumes range from low to medium volume. Production resources are in the U.S. Our heavy cable processing capability and engineering design review delivers quality, with ITAR certification and DoD MLAs.
BergStak HS™ 0.50mm Mezzanine Connector
FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATIONS
BergStak HS™ 0.50mm connector is a flexible solution designed for high speed and high density, parallel board-to-board applications with various heights in different sizes.
The BergStak HS™ 0.50mm connector series meets the new 25Gb/s and 32Gb/s performance requirements.
BergStak HS™ 0.80mm Board-to-Board Connector
FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATION
FCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. BergStak HS™ 0.80mm connector family with 0.80mm pitch enables high-speed data applications with up to PCIe® Gen 5 32Gb/s.
BergStak® 0.40mm Self-Alignment Board-to-Board Connector
FCI Basics BergStak® 0.40mm self-alignment connectors come with a stack height of 3.50mm and 30 positions extendable up to 10 to 60 positions with 10 positions incremental. It has a unique self-alignment feature that supports blind mating, ensuring a reliable connection. The USCAR-2 compliant connector is also ideal for the automotive market.
BergStak® 0.50mm Mezzanine Connector
The BergStak® product range is expanded to include 0.5mm mezzanine connectors. Available in 3mm to 6mm stack height options in 0.5mm increments, this connector is offered in 10 to 60 positions in 10 position increments. Designed with scoop-proof housing the terminals are protected from damage when parts are mated.
BergStak® 0.50mm Self-Alignment Board-to-Board Connector
FINE PITCH SOLUTION WITH SELF-ALIGNMENT FEATURE
FCI Basics BergStak® 0.50mm self-alignment connectors come with a stack height of 3mm and 50 positions extendable across 20 to 60 positions in increments of 10. It has a unique self-alignment feature that supports blind mating.
BergStak® 0.80mm Pitch
FLEXIBLE SOLUTION FOR HIGH-DENSITY APPLICATIONS
FCI Basics BergStak® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 9 sizes up to 200 positions.
BergStak® 0.80mm Shielded Board-to-Board Connector
FCI Basics BergStak® 0.80mm connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. Bergstak® shielded connector with 0.80mm pitch supports high-speed data applications up to 10Gb/s.
BergStak® FX10 0.50mm Board-to-Board Connector
FCI Basics BergStak® product range is expanded to include a 0.50 mm BergStak® FX10 board-to-board connector known for its fast data transmission and high signal quality. This connector is offered in 144 positions and is available in 4.30mm and 6.00mm stack height options.
BergStak® FX10 supports speed performance up to 15Gb/s+ and is available in vertical SMT configuration.
BergStak® Lite 0.80mm Board-to-Board Connector
Amphenol's BergStak® Lite 0.8mm is a comprehensive, versatile, and flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 4 sizes up to 100 positions. This is an economical version that uses Gold Flash plating that can meet up to 50 mating cycles while extending the mechanical advantage of the standard BergStak® 0.80mm.
BergStak® Secure Connector
HIGH SECURITY/HIGH DENSITY/HIGH-SPEED BOARD-TO-BOARD CONNECTOR
The BergStak® Secure connector contains One-time-use and Multi-times-use solutions. Both solutions have unique shield designs to protect signal transmission. The 3-row contact design with 1.0mm pitch improves board surface utilization by 20%. The family can support high-speed data transmission up to 32Gb/s.