Amphenol is a technology leader in the design, manufacture and supply of high-performance interconnect systems, sensors and antennas for a broad range of industrial applications. Our core competencies include application-specific industrial interconnect solutions utilizing integrated assemblies. Our primary end applications for industrial include agriculture equipment, alternative and traditional energy generation, batteries and hybrid drive systems, entertainment, factory automation, heavy equipment, instrumentation, internet of things (IoT), LED lighting, marine, medical equipment, oil and gas, power distribution, public safety, rail mass transit, smart manufacturing (IIoT), and transportation.
SV Microwave has released a line of high-performance adapters capable of excellent signal performance up to 65 GHz. These between-series adapters are configured with a reliable, easily-calibrated, and consistent threaded interface on one end and a convenient high-density push-on interface on the other, making them ideal for various applications.
As part of our commitment to continuous quality improvement, SV has re-designed a line of thru-hole PCB connectors with current design standards to improve performance at higher frequencies. These connectors feature a contact that goes through the PCB and can launch directly to transmission lines on the opposite side. Current configurations include straight and right-angle SMP male connectors.
Amphenol SV Microwave offers a complete line of extreme frequency (DC - 100 GHz) coaxial / RF edge launch PCB connectors that meet the need for high-performing, highly reliable precision connectors. Current RF test connector configurations include single and multiport 2.92 mm, 2.4 mm, 1.85 mm, SMA, SMP, SMPM, and SMPS variations.
SV Microwave’s high speed RF/coaxial solderless compression mount connectors are ideal for high frequency printed circuit board applications where precision is key. Our solderless application makes assembly fast, easy and without damaging the PCB board. Current interface configurations include our high frequency SMA, 2.92mm, 2.4mm, 1.85mm, SMP and SMPM series.
The HPCE® BTB is a board-to-board high power connector for demanding applications requiring high linear current density and small connector size. It is part of Amphenol's HPCE® series family together with HPCE and HPCE cable assembly. HPCE® BTB is ideal for next-generation 1U/2U servers, storage enclosures, telecommunications equipment, and datacom/ networking equipment.
The HPCE® cable assembly is a next-generation power cable assembly for demanding applications requiring high linear current density and low power loss. It offers both one-piece (cable to card edge) and two-piece (cable to header) solutions. Both have a low profile height (7.5mm) and are based on very cost-effective and highly reliable stamped-and-formed power contact.
The High Power Card Edge (HPCE®) connector is a next-generation power card edge connector for demanding applications requiring high linear current density and low power loss. HPCE offers a low profile height (7.50mm) and is based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from Amphenol.
The HPCE® Mezzanine is a next-generation power board-to-board for demanding applications requiring variable stack heights and high linear current density. It offers both receptacle and recommended PCB Bridge. Both are based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from Amphenol.
Amphenol LTW's HS-Lok Push-Lock Connectors provide IP68 protection and are rated to UL-F1 UV resistance, making them ideal for indoor or outdoor wet locations. HS-Lok features audible feedback and guided key design, ensuring error-proof and easy assembly for blind mating.
The HS-Lok is UL2238 and UL50e compliant and rated up to 5A【Quick Guide: https://amphenolltw.com/down.php?supp_download=98】
The Hybrid Distribution Panel enables the combination of copper and fiber optic cabling on just 1 height unit (U). The modular components and full accessibility from the front and rear make the system ideal for highly flexible data center and network infrastructures.