Amphenol is a technology leader in the design, manufacture and supply of high-performance interconnect systems, sensors and antennas for a broad range of industrial applications. Our core competencies include application-specific industrial interconnect solutions utilizing integrated assemblies. Our primary end applications for industrial include agriculture equipment, alternative and traditional energy generation, batteries and hybrid drive systems, entertainment, factory automation, heavy equipment, instrumentation, internet of things (IoT), LED lighting, marine, medical equipment, oil and gas, power distribution, public safety, rail mass transit, smart manufacturing (IIoT), and transportation.
FCI Basics Minitek® Pwr 3.0 Blind Mate Interface (BMI) is a flexible and comprehensive solution designed for power applications with a current rating of up to 5A per contact. These connectors provide an ideal solution for wire-to-board applications. Minitek® Pwr 3.0 BMI is featured with scoop-proof housings that prevent terminals and headers from damage during angled mating.
FCI Basics Minitek® Pwr 3.0 is a flexible and comprehensive solution designed for power applications with a current rating oup to 5A per contact. It is available in 2 to 24 circuits for dual row and 2 to 12 circuits for single row. Crimp, snap-in header and receptacle contacts are used to terminate 30-20AWG wires. Header and receptacle housings allow wire-to-wire and wire-to-board configurations.
3.0MM HIGH CURRENT SOLUTION WITH CURRENT RATING UP TO 12A
FCI Basics Minitek® Pwr 3.0 High Current Connector (HCC) is designed for high-current, and power-dense applications with a current rating of up to 12A per contact and wire gauge range from 20AWG-16AWG. These are used for both wire-to-wire and wire-to-board applications. It is available in 2 to 24 circuits for dual row.
FCI Basics Minitek® Pwr 4.2 Blind Mate Interface (BMI) is a flexible and comprehensive solution designed for power applications with a current rating of up to 9A per contact. These connectors provide an ideal solution for wire-to-board applications. Minitek® Pwr 4.2 BMI is featured with scoop-proof housings that prevent terminals and headers from damage during angled mating.
FCI Basics Minitek® Pwr 4.2 is a flexible and comprehensive solution designed for power applications with a current rating ofup to 9A per contact. It is available in 2 to 24 circuits in dual row and 3 to 5 circuits in single row. Crimp, snap-in header and receptacle contacts are used to terminate 38AWG-16AWG wires. Header and receptacle housings allow wire-to-wire and wire-to-board configurations.
FCI Basics Minitek® Pwr 4.2 High Current Connector (HCC) is designed for high-current, and power-dense applications with a current rating of up to 13A per contact and wire gauge range from 20AWG- 16AWG. These are used for both wire-to-wire and wire-to-board applications. It is available in 2 to 24 circuits for dual row and 3 to 5 circuits for single row. Current rating up to 13A per contact.
FCI Basics Minitek® Pwr Hybrid 4.2 is designed for power and signal application with a current rating of up to 9A per contact, available for dual row and 2 to 24 power circuits, and 2 to 12 signals for wire-to-board applications. Crimp, snap-in receptacle contacts are used to terminate 30AWG-16AWG wires. Receptacle housings allow wire-to-board configurations.
Amphenol DC Electronics can manufacture custom overmolded cable assemblies designed for today’s sophisticated applications. We have the engineering, design facilitation, and technology resources to take a cable assembly concept and transform it into a solution that can be manufactured to meet the demands of your application.
Amphenol’s MotionGrade M23 and M40 products are ideally suited for advanced servo drive encoder feedback applications, packaging, robotics, printing, machine tool, medical and automation environments where control signal transmission or power are required in a robust and compact delivery system.
56GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM
Leveraging proven technologies, including an industry-leading BGA design, offering superior self-aligning and self-leveling. With a next-generation differential pair contact design for up to 56Gb/s NRZ and 112Gb/s PAM4 performance.