Amphenol is a technology leader in the design, manufacture and supply of high-performance interconnect systems, sensors and antennas for a broad range of industrial applications. Our core competencies include application-specific industrial interconnect solutions utilizing integrated assemblies. Our primary end applications for industrial include agriculture equipment, alternative and traditional energy generation, batteries and hybrid drive systems, entertainment, factory automation, heavy equipment, instrumentation, internet of things (IoT), LED lighting, marine, medical equipment, oil and gas, power distribution, public safety, rail mass transit, smart manufacturing (IIoT), and transportation.
FCI Basics Cross-Mate™ series is a 2.00mm pitch wire-to-board system that offers a compact design and active latching for applications requiring good mating retention. The Terminal-Position-Assurance (TPA) guarantee that the contact is properly mounted into the cable housing eliminating functional problem due to wrong connector assembly.
The Amphenol ICC cStack™ high-speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit.
Piher Sensing Systems designs and manufacturers current sensors based on Hall-effect and TMR technology for accurate measurement of currents in automotive battery management and motor control applications.
Piher’s 3-phase precision current sensors improve motor or solenoid control applications and grid monitoring.
SV Microwave has released a line of D38999 pin and socket contacts that are aligned to the latest specification set forth by SOSA™. These coaxial contacts fit both standard and series III housing and are offered in BMB size 8 and SMPM size 12. These contacts are ideal in an embedded system that transitions from the chassis to an out-of-the-box application.
DDR2 SO-DIMM sockets are designed to accept modules that conform to JEDEC MO-224. The sockets come with a small form factor which allows fitting into smaller chassis, aiding the development of smaller & lighter notebooks. It comes in two voltage options with different key-ID to prevent incorrect mating. It operates at a higher speed & bandwidth lowers power consumption.
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.
Amphenol's DensiShield® I/O system is designed to support the transmission of high-speed, serial differential signals while taking customers' equipment packaging requirements into consideration. Combining high density, mechanical robustness, and ease of PCB assembly with excellent shielding and signal integrity performance means that system designers no longer have to compromise.
DHR (Down-hole Rotatable ) is made from high-temperature material (200°C operations) with gold-plated BeCu contact bands. Our process enables the creation of 1-piece contacts, from the ring- through the back end. 4, 8, and 10 Contacts available. These solid connectors have eliminated solder and laser-weld failure points within the connector, and have increased the strength and life.
FCI Basics DIN IDC cable connectors are available in 4 connector sizes as 96, 42, 21, and 9 positions. Available in wire sizes 30AWG to 24AWG, their unique insulation displacement design grants the lowest installed cost for users. Standard accessories are also offered to make up a fully modular system.
Amphenol LTW's distributor boxes are designed in multiple ports with different connector or cable terminations. The embedded LED indicators provide you an overview data, signal or power delivery, especially in industrial automation applications.