Mobile Devices
Amphenol designs and manufactures an extensive range of interconnect products, antennas and electromechanical components found in a wide array of mobile computing devices. Amphenol’s capability for high-volume production of these technically demanding, miniaturized products, combined with our speed of new product introduction, are critical drivers of our long-term success in this market. Our solutions address consumer electronics, e-readers, laptops, mobile phones, mobile phone accessories, mobile computing devices, smartphones, tablets, ultrabooks and wearable and hearable devices.
Visit our global sites to learn more: Amphenol Mobile Consumer Products

HDMI Connectors
FCI Basics HDMI™ (High-Definition Multimedia Interface) is a smaller, user-friendly version of DVI for high definition audio-video transfer in consumer entertainment devices. Backward-compatible with DVI, the connector system supports uncompressed video and audio data transmission at 5Gb/s along a single cable.

Inductive Charging (QI)
Amphenol's inductive charging coils can be integrated into laptops, tablets, wearables, and other mobile computing devices. It complies with typical standards such as Qi, or Qi 2.0 and can be customized to comply with other standards. The coil is made with FPC or wire wrapping . Generally, it is mounted on the battery.

Internal Antenna
Antennas that are assembled inside the device, but not surface mounted on the
PCB. Here, Flex and PCB antennas
with cable and connector is very common. Antenna design is usually a dipole.

MCX Connector Series
The MCX (Micro Coaxial) series is a 50 Ω series with broadband capability ranging from DC to 6 GHz. In addition, the MCX series features secure, fast and easy snap-on/ snap-off coupling.

Mezzostak® 0.5mm Mezzanine Connectors
Mezzostak® is a robust 0.5mm fine pitch mezzanine connector suitable for a wide range of high-reliability applications and demanding environments. The hermaphroditic design of these connectors provides a precise mating interface with extra housing guidance. Mezzostak® 0.5mm are available in two versions, which offer a choice between supplemental PCB hold-downs and pegs for short overall length.

Micro Board-to-Board 0.60mm Stack Height - 103 Series (0.35mm pitch)
Amphenol's 103 series are 0.35mm pitch micro board-to-board connectors designed for high-density applications. They support an extreme low profile 0.60mm stack height and a high current rating up to 5A. These connectors are offered in 4 to 60 positions. These meet USB 3.1 Gen 2 signal transmission rates and are ideal for consumer applications.

Micro SATA Connectors
Micro SATA connectors from Amphenol enable smaller 1.8inch SATA drive form factors for hard disk drives (HDDs) or solid-state drives (SSDs). The connectors comply with the Serial ATA specification issued by the Serial ATA International Organization (SATA-IO). Micro SATA signal and power contacts consist of 16 contacts on a 1.27mm pitch size.

microSD Express Connector
Amphenol is the first in the industry to offer card sockets for both microSD Express and Micro SD cards (UHS-I). The 17 pin microSD Express connector is capable of achieving high speeds up to 985MB/s and meeting PCIe® 3.0 requirements. The connector enables microSD Express platform to reach its full potential; making microSD Express card possible to serve as a removable Solid State Drive (SSD).

Micro USB 2.0 Connector
FCI Basics Micro USB 2.0 connectors deliver a data transfer rate up to 480Mb/s and are characterized by their high-speed signal stability. This smaller version of the Mini USB 2.0 connector while complying with the physical, electrical, and environmental standards of the micro form factor, supports 1.8A and 3A currents for fast charging.

Micro USB 3.0 Connector
Micro USB 3.0 (USB 3.1 Gen 1) SuperSpeed connector delivers 10x the data transfer rate of Hi-Speed USB as well as optimized power efficiency. This smaller version of the Mini USB 2.0 connector performs up to 5Gb/s and supports USB On The Go (OTG). It has full-duplex signaling over two differential pairs, improving host-directed simultaneous-bidirectional communication.