Mobile Devices
Amphenol designs and manufactures an extensive range of interconnect products, antennas and electromechanical components found in a wide array of mobile computing devices. Amphenol’s capability for high-volume production of these technically demanding, miniaturized products, combined with our speed of new product introduction, are critical drivers of our long-term success in this market. Our solutions address consumer electronics, e-readers, laptops, mobile phones, mobile phone accessories, mobile computing devices, smartphones, tablets, ultrabooks and wearable and hearable devices.
Visit our global sites to learn more: Amphenol Mobile Consumer Products
Contact Pads
Amphenol's contact pads are used in contact areas and as spacers on PCBs. Durable plating includes a diffusion barrier. The contact pads connect with low resistance over the product's lifetime for use in sensitive connections of antennas, microphones, and carbon PCBs. They are available in a wide variety of shapes and sizes. Thickness: scalable ≥ 0.1 mm.
Cool Stack 0.80mm Hybrid Power & Signal Connectors
Cool Stack Hybrid Power and Signal connectors provide one-piece high speed and high power solutions while addressing multiple networking standards like PCIe, and SAS/SATA. It offers a maximum current rating of 16A per power pin, which aids in supporting applications with medium power requirements.
Cross-Mate™ 2.00mm Wire-to-Board Connector System
FCI Basics Cross-Mate™ series is a wire-to-board system that offers compact design and active latching for applications requiring good mating retention.The particular cross section of the mating area guarantees a reliable 4 point contact interface with an improved current rating from 2A to 4A per contact. Terminal-Position-Assurance (TPA) guarantee that the contact is properly mounted into the cable housing
cStack™ 25Gb/s Compression-mount Mezzanine Interposer
The Amphenol cStack™ high speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit. With offerings in 1mm to 5mm housing heights and multiple sizes, Amphenol's cStack™ connector provides a solution for any application where space is tight and speed and...
C-Type USB Connector
Amphenol LTW offers a comprehensive range of rugged USB Type-C connectors delivering a high data transmission rate of up to 10 Gbps and superior power charging up to 5A current. Designed in various form factors with multiple termination options make it ideal to fulfill industrial harsh application【Quick Guide: https://amphenolltw.com/down.php?supp_download=111】
Customized Bearing APEA605
Customized bearings made of CNC components. Smooth handfeedlings.
Custom Terminal Blocks
Since 1945, EBY Electro has been the go-to for custom wire connectors, building a legacy of excellence and service. Our expert team is with you every step of the way, from innovative component design to seamless delivery and warehousing solutions. Experience the EBY Electro difference today!
DDR2 SO-DIMM Memory Module Sockets
DDR2 SO-DIMM sockets are designed to accept modules that conform to JEDEC MO-224. The sockets come with a small form factor which allows fitting into smaller chassis, aiding the development of smaller & lighter notebooks. It comes in two voltage options with different key-ID to prevent incorrect mating. It operates at a higher speed & bandwidth lowers power consumption.
DDR4 SO-DIMM Memory Module Sockets
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.
DDR5/LPDDR5 CAMM2 Connector
COMPLIES TO JEDEC SO-032 SPEC
The DDR5/LPDDR5 CAMM2 connector follows JEDEC standards with 644 pins/666 pins, has a pitch of 1.00x1.38mm, and a connector height of 1.0mm. It provides dual channel memory which could support higher bandwidth and can catch up all DDR5 capacities needed. This connector is developed to support lower-power DDR5 memory and does not require ground shielding.