Amphenol designs and manufactures an extensive range of interconnect products, antennas and electromechanical components found in a wide array of mobile computing devices. Amphenol’s capability for high-volume production of these technically demanding, miniaturized products, combined with our speed of new product introduction, are critical drivers of our long-term success in this market. Our solutions address consumer electronics, e-readers, laptops, mobile phones, mobile phone accessories, mobile computing devices, smartphones, tablets, ultrabooks and wearable and hearable devices.
Amphenol's HDMI 2.1 supports a range of higher video resolutions and refresh rates including [email protected] HZ and [email protected], and resolutions up to 10K. Dynamic HDR formats are also supported, and bandwidth capability is increased up to 48Gbps. Amphenol's HDMI2.1 cable has passed the certification, and the mechanical interface is compatible with HDMI2.0 and HDMI1.4.
FCI Basics HDMI™ (High-Definition Multimedia Interface) is a smaller, user-friendly version of DVI for high definition audio-video transfer in consumer entertainment devices. Backward-compatible with DVI, the connector system supports uncompressed video and audio data transmission at 5Gb/s along a single cable.
Amphenol's inductive charging coils can be integrated into laptops, tablets, wearables, and other mobile computing devices. It complies with typical standards such as Qi, and can be customized to comply with other standards. The coil is made with FPC or wire wrapping . Generally, it is mounted on the battery.
Laser Direct Structuring (LDS) has led to vast opportunities in innovative design. The laser activation technology produces thinner lines and smaller features than previously made possible by other molded interconnect device processes without compromising consistency and repeatability. Surface mounting components on LDS antennas is also possible.
Mezzostak® is a robust 0.5mm fine pitch mezzanine connector suitable for a wide range of high-reliability applications and demanding environments. The hermaphroditic design of these connectors provides a precise mating interface with extra housing guidance. Mezzostak® 0.5mm are available in two versions, which offer a choice between supplemental PCB hold-downs and pegs for short overall length.
Micro Board-to-Board 0.60mm Stack Height - 103 Series (0.35mm pitch)
Amphenol's 103 series are 0.35mm pitch micro board-to-board connectors designed for high-density applications. They support an extreme low profile 0.60mm stack height and a high current rating up to 5A. These connectors are offered in 4 to 60 positions. These meet USB 3.1 Gen 2 signal transmission rates and are ideal for consumer applications.
Micro SATA connectors from Amphenol enable smaller 1.8inch SATA drive form factors for hard disk drives (HDDs) or solid-state drives (SSDs). The connectors comply with the Serial ATA specification issued by the Serial ATA International Organization (SATA-IO). Micro SATA signal and power contacts consist of 16 contacts on a 1.27mm pitch size.
MEMORY CARD CONNECTORS WITH SUPPORT FOR UHS-I AND UHS-II
Micro SD and SD card sockets are user-friendly and ideal for use in portable devices such as digital cameras and mobile phones. They are also suitable for server applications as well as automotive devices, notebooks, and servers.
Amphenol is the first in the industry to offer card sockets for both microSD Express and Micro SD cards (UHS-I). The 17 pin microSD Express connector is capable of achieving high speeds up to 985MB/s and meeting PCIe® 3.0 requirements. The connector enables microSD Express platform to reach its full potential; making microSD Express card possible to serve as a removable Solid State Drive (SSD).
Micro USB 2.0 connectors have power contacts of 1.8A and 3A current for fast charging. The plastic tongue and two-layer shells design ensure high reliability and prevent connector damage. Amphenol offers customized designs to suit various customer requirements. These connectors also offer high-speed signal stability of up to 480Mb/s transmission.
FCI Basics Micro USB 2.0 connectors deliver a data transfer rate up to 480Mb/s and are characterized by their high-speed signal stability. This smaller version of the Mini USB 2.0 connector while complying with the physical, electrical, and environmental standards of the micro form factor, supports 1.8A and 3A currents for fast charging.
USB 3.1 Gen 1 now operates with full-duplex signaling over two differential pairs, improving host-directed simultaneous-bidirectional communication. USB 3.1 Micro offers a 5Gb/s signaling rate offering a 10x performance increase over Hi-Speed USB 2.0. SuperSpeed USB is backward compatible with USB 2.0 and will provide optimized power efficiency.
Amphenol creates high quality Micro USB connectors for today’s high definition media. These connectors can be customized to meet your specific needs. Special modifications may include customized configurations and customized mounting options.
Amphenol's 3.5mm diameter miniature jack connector is a family of connectors used for analog signals, primarily audio. Available in 3 to 5 contacts, the connector comes with an innovative contact design for robustness and high mating cycles. This solution is used for composite video & audio output in consumer electronics devices such as digital cameras, camcorders, and portable DVD players.
FCI Basics Mini USB 2.0 connector delivers a data transfer rate of up to 480Mb/s. The connector takes up only about 1/8 of the space of a standard USB Type B interface, and has five circuits, with one circuit reserved for future use in host identification between devices. Amphenol offers customized designs of the Type B connector to suit various customer requirements.
Amphenol offers market-leading expertise in the design and production of antennas for wireless devices. Our single and multi-band solutions cover all wireless bands: USGSM, GSM, PCS, DCS, UMTS, GPS, CDMA, DVB-H, Bluetooth, WLAN, WiMAX, and 802.11a, and 802.11b/g.
Amphenol's Near field communications (NFC) coils are integrated into laptops, tablets, wearables, and other mobile computing devices. The coils are thin and can be mounted on metallic surfaces such as PCBA, metal sheet, battery , etc. It complies with the Forum and EMVco standards.