Amphenol designs and manufactures an extensive range of interconnect products, antennas and electromechanical components found in a wide array of mobile computing devices. Amphenol’s capability for high-volume production of these technically demanding, miniaturized products, combined with our speed of new product introduction, are critical drivers of our long-term success in this market. Our solutions address consumer electronics, e-readers, laptops, mobile phones, mobile phone accessories, mobile computing devices, smartphones, tablets, ultrabooks and wearable and hearable devices.
Amphenol has in-house capabilities to create application-specific mobile phone acrylic sheet lenses to fit our customer's precise needs. The sheet lenses are available as plastic or glass. Amphenol has over 10 years of acrylic sheet lens experience. Our lens capacity is over 12 million per month.
AgilBrick™ 1.27mm Board-to-Board Header G802 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.
AgilBrick™ 2.00mm Board-to-Board Header G825 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.
AgilBrick™ 2.54mm Board-to-Board Header G800 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.
AgilLink™ 2.00mm Wire-to-Board Header G823 Series is the most common solution for transferring power and signal. It can mate with both wire-to-board and board-to-board applications. This series can carry a maximum current rating of 4A. Amphenol ICC offers a comprehensive range of these headers including, V/T DIP, V/T SMT, R/A DIP to meet various customer requirements.
Amphenol's Audio Jacks are widely used in mobile phone applications. These connectors are available in different configurations, e.g. compressed type or for SMT solderable versions, and fully customized to the application requirements.
Amphenol’s comprehensive offering of battery connectors for mobile phones comes in single and multi-contact versions with straight and right-angle mountings. They feature stamp and form contacts with additional solder tags for high reliability and conductivity. Amphenol offers right angle and direct compression type, Wire to Board, board to board, blade type and float, or SMT versions.
BergStak+™ 0.80mm is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is compatible with the existing BergStak® 0.80mm product recommended by the OCP. It guarantees to support up to 16Gb/s performance. Customers can upgrade its board-to-board performance from PCIe 3.0 to PCIe 4.0 while leveraging BergStak+™'s backward compatibility and same footprint feature.
The BergStak® product range is expanded to include 0.5mm mezzanine connectors. Available in 3mm to 6mm stack height options in 0.5mm increments, this connector is offered in 10 to 60 positions in 10 position increments. Designed with scoop-proof housing the terminals are protected from damage when parts are mated.
FCI Basics BergStak® product range is expanded to include a 0.50 mm BergStak® FX10 board-to-board connector known for its fast data transmission and high signal quality. This connector is offered in 144 positions and is available in 4.30mm and 6.00mm stack height options.
BergStak® FX10 supports speed performance up to 15Gb/s+ and is available in vertical SMT configuration.
Amphenol's BergStak® Lite 0.8mm is a comprehensive, versatile, and flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 4 sizes up to 100 positions. This is an economical version that uses Gold Flash plating that can meet up to 50 mating cycles while extending the mechanical advantage of the standard BergStak® 0.80mm.
Board-to-Board Connectors - B401/B402 Series (0.80mm pitch)
HIGH DENSITY VERTICAL BOARD-TO-BOARD CONNECTORS
Amphenol's B401/B402 series is 0.80mm pitch board-to-board connectors designed for high-density applications. They support stack heights up to 10mm and 100 positions. These connectors feature surface mount terminations and are available in a comprehensive range to satisfy different customer requirements.
FCI Basics Boltrack™ connector promotes signal and PoE++ transmission over Cat 5e and 6 cables in a wide range of datacom and industrial applications. It offers lightning protection, EMI shielding, and is field-installable. Boltrack™ connector comes in a 4-pair right-angle board receptacle and cable plug mating combination. The connector can resist voltages up to 2,500V.
The BTFW Series is a floating board-to-board connector system consisting of plugs and receptacles with two rows of staggered contacts on 1.00mm (0.039in.) centerlines. This connector system is designed for applications that require high density, and high reliability interconnects with higher pin counts and surface mount termination, such as audio-video (AV) and navigation systems in automobiles.
Amphenol's cable assemblies are widespread in the market for wearable products. These cable assemblies are used for data transfer and power charging. Amphenol's Charger Cable Solutions provide highly flexible customized connection solutions from standard USB 2.0/3.0 to the device side with Pogo pins or Spring. The connection mechanisms include magnetic, buckling, clamping, cradle, etc.
Amphenol has developed an extensive range of SIM and micro SD card readers which come in several different configurations including Simlocks, wing and bridge blocks, standard sim and SD blocks, with options of shielding protection, integrated detect switch, float, or SMT mounting.
The Amphenol ICC cLGA® land grid array socket system was designed to bring conventional connector material construction to high-performance, low-cost chip-to-board applications. cLGA® sockets are used in applications ranging from handheld computer products to supercomputer systems. The cLGA® socket is fully qualified under Telcordia GR-1217-CORE specifications.
FCI Basics the Clincher™ 2.54mm pitch connector family includes single-row pin-and-receptacle connectors designed for termination to flat flexible circuitry. All receptacle connectors use the same customer-preferred and patented Clincher™ contact and are ideal for applications where shock or vibration are concerns.
The ComboLock® Wire-to-Board connector's compact design for the limited space application needs carries power and signal requirements. The connector system has hybrid 1.00mm pitch signal and 3.00mm pitch power configuration with an active latching feature. The connector has a nominal current carrying capacity of 10A/pin max for power and 1.5A/pin max for signal. Power wire sizes from 26 to 18AWG
Amphenol ICC's Conan® 1.00mm is a mezzanine connector designed for industrial applications and harsh environments. Conan® 1.00mm provides a mechanically secure, high-density electrical interface between parallel printed circuit boards. Its unique design with an audible 'click' sound enhances the security and ease of use. It has good mating performance, rugged design, and is under 70 positions.
Conan® Lite 1.00mm connectors come with a robust metal down feature that helps in establishing a reliable connection with the PCB in both parallel and perpendicular board-to-board applications. These connectors also feature an audible "click" sound ensuring mating in place. Conan® Lite vertical headers, receptacles, and right-angle headers are offered in 9-69 positions.
Amphenol's contact pads are used in contact areas and as spacers on PCBs. Durable plating includes a diffusion barrier. The contact pads connect with low resistance over the product's lifetime for use in sensitive connections of antennas, microphones, and carbon PCBs. They are available in a wide variety of shapes and sizes. Thickness: scalable ≥ 0.1 mm.
Cool Stack 0.80mm Hybrid Power & Signal Connectors
Cool Stack Hybrid Power and Signal connectors provide one-piece high speed and high power solutions while addressing multiple networking standards like PCIe, and SAS/SATA. It offers a maximum current rating of 16A per power pin, which aids in supporting applications with medium power requirements.
The Amphenol ICC cStack™ high-speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit.
DDR2 SO-DIMM sockets are designed to accept modules that conform to JEDEC MO-224. The sockets come with a small form factor which allows fitting into smaller chassis, aiding the development of smaller & lighter notebooks. It comes in two voltage options with different key-ID to prevent incorrect mating. It operates at a higher speed & bandwidth lowers power consumption.
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR5 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. 262 positions SO-DIMM connector is available in 4.00mm height with the standard option. Sketching design of DDR5 SO-DIMM 8.00mm height with the standard option now.
FCI Basics DIN 41612 connector systems are the most popular backplane interconnect systems in IEC 603-2 specifications due to the widespread standard adoption, easy availability, cost-effectiveness, and durability. The product design for Board-to-Board and I/O solutions involve both standard mount and reverse mount mating combination.
HIGH-PERFORMANCE DIGITAL AUDIO/VIDEO INTERCONNECT SOLUTION
Amphenol DisplayPort connector system is a scalable solution that transmits 1, 2, or 4 lanes of High-Definition video at 2.7Gb/s per lane up to a maximum of 10.8Gb/s. DisplayPort also allows flexible allocation of available bandwidth between audio and video.
Amphenol’s series of miniature data cards and USB dongle antennas for 3G, 3.5G, and 4G LTE applications provide the performance to power high-speed mobile internet connectivity. With volumes less than 1.5cc and a customizable geometry, these multiband antennas are easily integrated into miniature data cards.
Amphenol's double-sided lapping process provides the best solution for mobile device metal decorative logos. We can control part flatness tolerance within +/- 0.03mm and maintain a 1000N+ Laser weld bond between metal components. Our high-quality logos reflect a high brand value to customer end products.
FCI Basics D-Sub Accessories complement FCI Basics D-sub offering by accounting for the moderate to severe mechanical stresses encountered, and preventing risks like pulling up and accidental mismating. The range of derived accessories includes plastic or metalized plastic hoods, EMI/RFI shielded two-part metal hoods, various cable clamps, locking devices, dust caps, and brackets.
FCI Basics D-Sub Cable Connectors span across signal and power applications in computer equipment, cash register, and high-end industrial cabinets. Signal connectors are available as removable crimp contacts, and power connectors in crimp, solder bucket, and wire wrap terminations.
Amphenol ICC's D-Subminiature product line offers a wide range of termination options for board and cable ends, bringing down the overall cost of cable assembly and connectors significantly. The terminations include Straight, Right Angle, SMT, Press Fit, and Slim Sunk for board side, and Solder Cup, Crimping, IDC Ribbon, Solderless Wire Wrap, and Screw Termination for cable side.
FCI Basics D-Sub Economy Range Board-Mount Connectors are proven solutions designed to meet less demanding applications while meeting all their design requirements. These connectors have guaranteed durability of 50 mating cycles. Board connectors are available in straight and right-angle versions, while cable connectors are available in solder bucket and crimp styles.
FCI Basics D-Sub High-Density Board-Mount Connectors, based on the compact-D form factor, complete your board and system designs by providing high-density and high-speed interfaces. The high-speed, power, assembly, and mechanical packaging expertise, aids in getting the signals out of the box at optimal cost and performance, while accommodating up to 78 positions in standard shell sizes.
Amphenol ICC's D-Subminiature high-density product line offers a wide range of termination options for board and cable ends, bringing down the overall cost of cable assembly and connectors significantly. The terminations include Straight, Right Angle, SMT, Press Fit, and Slim Sunk for board side, and Solder Cup, Crimping, IDC Ribbon, Solderless Wire Wrap, and Screw Termination for cable side.
ULTRA SLIM D-SUB CONNECTORS
FCI Basics has expanded the D-Sub connectors with a modified ultra-slim body with contact alignment in a single row. These are available both in SMT termination suitable for reflow soldering and solder tail version for standard wave soldering. These connectors also feature solderable retention pegs that absorb vibration.
FCI Basics D-Sub Standard Board Mount Connectors are standard density I/O products widely across various market segments. The stamp and rolled contacts complementing the full metal shells are available in solder, straight, and angled versions. They also come with single-shell (Delta-D) and double-shell designs.
Amphenol ICC's D-Subminiature standard density product line offers a wide range of termination options for board and cable ends, bringing down the overall cost of cable assembly and connectors significantly. The terminations include Straight, Right Angle, SMT, Press Fit, and Slim Sunk for board side, and Solder Cup, Crimping, IDC Ribbon, Solderless Wire Wrap, and Screw Termination for cable side.
Amphenol’s high-performance WIFI antenna solutions for entertainment systems such as PlayStation, TV, and wireless sound systems enable excellent connectivity and high speeds. Multi-antennas for the MIMO system allows better reception and data rates.
eSATA connectors are designed for external storage applications that require a single-lane Serial ATA cable connection up to approximately two metres in length. The connectors comply with the Serial ATA Specification issued by the Serial ATA International Organization (SATA-IO). eSATA connectors support both Gen 1 (1.5Gb/s) and Gen 2 (3Gb/s) SATA data rates.
The ExaMAX® 85Ohms backplane connector system is designed for higher bandwidth applications from 25Gb/s to 56Gb/s. Optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion loss. Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 56Gb/s.
Ferrite is a ceramic compound composed of iron dioxide (Fe203), combined chemically with one or more metallic elements. Ferrite shields the metal parts of mobile phones so they do not absorb an electromagnetic field which results in a weak signal.
0.50mm pitch flex connectors utilize 0.50mm contact spacing to terminate mobile devices across a variety of applications. These connectors are offered with top, bottom, dual beams & dual contact positions with both ZIF and Non-ZIF cable terminations. The connector series comes with a wide height range of 0.70mm to 5.80mm with 4 to 80 contact positions in both vertical and right angle orientations.
1.00mm pitch flex connectors utilize 1.00mm contact spacing to terminate displays and support complex board-to-board connections. These connectors are offered with top and bottom contact positions in both ZIF and Non-ZIF cable terminations. The connector series comes with a wide height range of 1.90mm to 5.04mm with 3 to 34 contact positions in both vertical and right angle orientations.