Amphenol is one of the world’s largest designers, manufacturers and marketers of connectors and interconnect systems, antennas solutions, sensors and high-speed cable. Our connector and connector system solutions include fiber optic interconnect, harsh environment interconnect, high-speed interconnect, power interconnect, power distribution and busbars and radio frequency (RF) interconnect products. Our sensors and sensor-based product solutions include gas and moisture sensors, level sensors, position sensor, pressure sensors, temperature sensors and vibration sensors. Our value-added cable assemblies include cable assemblies and harnesses, cable management products and backplane interconnect systems. Our cable solutions include coaxial cable, power cable and specialty cable. We also provide combiner/splitter products, flexible and rigid printed circuit boards, hinges and molded parts.
Originally developed for the aerospace industry during the development of MIL-C-38999. The lightweight, space-saving design also qualified to MIL-DTL-27599. Series II and commercial JT series connectors meet or exceed the Mil-Spec requirements and are available in aluminum or stainless steel as well as several different finish options.
Amphenol JT Series subminiature cylindrical hermetic connectors are qualified to MIL-DTL-38999 Series II. These connectors were developed to meet the needs of the aerospace industry. With the lightweight & space-saving design, these connectors are 100% scoop-proof and available in Stainless Steel with several shell styles and contact options.
Amphenol Tri-Start MIL-DTL-38999 Series III Connectors offer the highest performance capabilities for both general duty and severe environment applications. Meeting or exceeding MIL-DTL-38999 Series III requirements, Amphenol's Tri-Start connector is available in aluminum, stainless steel, or composite with several finish options.
MIL-DTL-38999 Series III Connectors offer the highest performance capabilities for both general duty and severe environment applications meeting or exceeding MIL-DTL-38999 Series III requirements. Our glass-to-metal sealed qualified connectors and MIL-equivalent connectors are available in Stainless Steel with several shell styles and contact options available.
This crimp, rear-release high-power series provides an improved alternative to the older MIL-C-5015 solder type. It bridges the gap between an old connector standard and the environmental and high-performance needs of current technologies.
Low Mating Force Rectangular Connector series is one of the highest performing board-level connectors in the world with proven performance on the ground, in the air, and at sea. Utilizes the B³ brush contact system known for low mating force, stable electrical performance in high vibration, and extended service life.
The Amphenol MIL-DTL-83723, Series III family of connectors includes styles from PYLE National, which have proven technology for severe environments and are widely used in common and military aerospace markets. With a unique threaded coupling mechanism, these hermetic connectors eliminate the need for safety wiring.
Medium-sized, environmentally resistant circular connector. MIL-DTL-83723 is used for both general-purpose and high-temperature applications in commercial aerospace. With three coupling style choices- bayonet, threaded and quick-disconnect - the versatility of this family makes it increasingly popular for panel mount, box mount and line-to-line applications in aircraft.
Includes styles from Pyle National, with proven technology for severe environments in commercial and military aerospace markets. These have proven technology for severe environments and are widely used in commercial and military aerospace markets. high-temperature styles are capable of operation at 260° C/500°F.
MIL-HD2 Next-Gen SOSA™/VITA 91 Aligned Connector Series
Developed in alignment with The Open Group Sensor Open Systems Architecture™ (SOSA) technical standard, MIL-HD2 provides developers with a readily available, robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical.