Amphenol is one of the world’s largest designers, manufacturers and marketers of connectors and interconnect systems, antennas solutions, sensors and high-speed cable. Our connector and connector system solutions include fiber optic interconnect, harsh environment interconnect, high-speed interconnect, power interconnect, power distribution and busbars and radio frequency (RF) interconnect products. Our sensors and sensor-based product solutions include gas and moisture sensors, level sensors, position sensor, pressure sensors, temperature sensors and vibration sensors. Our value-added cable assemblies include cable assemblies and harnesses, cable management products and backplane interconnect systems. Our cable solutions include coaxial cable, power cable and specialty cable. We also provide combiner/splitter products, flexible and rigid printed circuit boards, hinges and molded parts.
Our product range is approved according to the standard VG96940-6 and includes all its variants: Seals for square flange sockets for installation type: Front wall and back wall, seals for sockets with single hole mounts, seals for protective caps, seals for D-SUB connectors.
Electrical plates for busses, electrobusses, trolleybusses, railway vehicles, including fuses, circuit breakers, relays, and ECUs connected by wire harnesses.
Full integration, in-house LRU capabilities include aluminum enclosures, rigid, flex, and panel circuit card assemblies, internal/external cable assemblies, integration, and final assembly, and fully functional testing and environmental stress screening (ESS) in order to support our customers with full turnkey solutions.
Capabilities include automated select solder, press-fit, and hand solder for through hold, single and double-sided BGA's and uBGA's, high-density packages, chip on board, lead-free, and conformal coating (UR, UL, Parylene). Process validation capabilities: 3D Solder Paste Inspection (SPI), Pre and Post-Reflow Automated Optical Inspection (AOI), 3D X-ray, and aqueous and non-aqueous cleaning.
ECUs allow for monitoring and controlling of critical applications such as Flight Controls, Avionic suites, Instrumentation, and Sensors. Electronic circuits are segregated and incorporate Front Face Panel, FPGA, MicroProcessors, and Software. We hold Part21G and PART145 certificates for production and maintenance.
ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION
Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.
Any type of antenna that is
surface mounted on the PCB. Most common antenna types are ceramic chip antennas,
composite material chip antennas and sheet metal antennas. The antenna design is often monopole, loop, IFA or PIFA antennas.
SV Microwave streamlines this with our innovative Embedded Phase Tuner. This component allows customers to independently adjust the phase of cable assemblies without external vendor involvement. The Embedded Phase Tuner operates by adjusting the transmission line length using a threaded coupling nut, simplifying the process.
SV Microwave has just released a series of SMA and 2.92mm cable connectors and adapters with built-in electromagnetic interference (EMI) shielding. These interconnects feature a gasket that improves EMI shielding over similar products, resulting in minimal to no electromagnetic interference.
This series, is an EMI shielded, ruggedized harsh environment, metal reverse bayonet coupling, high power connector utilizing RADSOK® socket contact technology. With a single-pole 18mm RADSOK® contact and up to 800 amps possible with a standard operating temperature from -40°C to +125°C.
