Power Connectors

The HCI® High Power backplane/midplane connector series addresses applications demanding additional power at the interface between a daughter card and a backplane or midplane in chassis-based equipment platforms. HCI High Power modules are rated for up to 113A per contact without exceeding a 30°C temperature rise in still air.

HV/HP connector for applications >60V and aluminium housing. All connectors are sealed and equipped with EMC shielding. The aluminum housing ensures a robust structure in the vehicle, it can withstand higher temperatures and can dissipate high currents. The HEAVYSOK connectors are available with various codings.

High Power 38999 incorporates RadSok, Temper-Grip, or standard high power contacts. Paired with the proven performance of the MIL-DTL-38999 connector series, High Power 38999 offers a variety of tooled arrangements specifically designed to carry high current (70 to 250 amps per contact, 240 to 1000 amps per connector).

Features high-current RadSok or Temper Grip socket contacts for a current-carrying capacity increase of up to 40%. Utilizing two proven connector mating designs (Matrix 5015 and MGT-5015) and a host of new contact termination methods, the High Power Series offers custom connector performance in a standard catalog offering.

An expansion of the MIL-DTL-38999 series to provide solutions for next-generation aircraft power requirements. Future power distribution architecture is moving toward higher voltages above what standard connectors are designed to accommodate. Amphenol HV38999 has been tested up to 1200 VAC / 1500 VDC* to remain partial discharge free @ 50,000 ft.

The HPCE® BTB is a board-to-board high power connector for demanding applications requiring high linear current density and small connector size. It is part of Amphenol's HPCE® series family together with HPCE and HPCE cable assembly. HPCE® BTB is ideal for next-generation 1U/2U servers, storage enclosures, telecommunications equipment, and datacom/ networking equipment.

The High Power Card Edge (HPCE®) connector is a next-generation power card edge connector for demanding applications requiring high linear current density and low power loss. HPCE offers a low profile height (7.50mm) and is based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from Amphenol.

The HPCE® Mezzanine is a next-generation power board-to-board for demanding applications requiring variable stack heights and high linear current density. It offers both receptacle and recommended PCB Bridge. Both are based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from Amphenol.

HVBI specially designed for high power EV & Energy Storage, with ruggedized design, convenient push-pull operation in limited space, robust metal shells with excellent electromagnetism shielding, potting design for backshell provide excellent anti-vibration and waterproof performance, has a wide range of current from 60A to 250A. UL and TUV Certification.

HVCO GB/T Connectors are all compliant with GB/T 20234.1/2/3 standards.

HVCO IEC/CCS2 connectors are all compliant with IEC 62196-2, IEC 61851-1 standards.