Search Results for 安费诺ultrapass

UltraPass™ enables arrayed connector layouts for near-chip and on-package IO solutions, providing the highest differential pair count interconnect offering in the market. Full support of up to 224G signaling speeds; Reduced overall system cost; Lower loss interconnect from chip site to external port; Lower loss interconnect from chip site to ...

UltraPass™ Internal High Speed IO. Near an ASIC to a card or board’s location in the system. Delivering a simple, low-loss, direct link to pluggable modules or anywhere in the system; High speed, low profile and high density (bandwidth / mm 2) near chip and on package solutions, the successor to our microLinkOVER™ and DensiLink™

Our UltraPass™ Internal High-Speed IO solution offers low-loss arrayed connector layouts for a direct link from chip to pluggable modules, anywhere in the system. With support for signaling speeds of up to 224G, UltraPass™ is the epitome of high-speed, high-density connectivity.

Amphenol is one of the world’s largest providers of high-technology interconnect, sensor and antenna solutions. Our products Enable the Electronics Revolution across virtually every end market including Automotive, Broadband Communications, Commercial Aerospace, Defense, Industrial, Information Technology and Data Communications, Mobile Devices and Mobile Networks.

Amphenol has been designing and manufacturing electrical and electronic connectors since the company’s inception in 1932. For nearly a century, we’ve been helping customers transmit power, data and signal in the harshest environments, from subsea applications to the outer reaches of space and everywhere in between.

我们为机器人和自动化应用制造定制电缆组件和定制连接器。 我们是一些世界顶级机器人制造商值得信赖和可靠的供应商。

Enter UltraPass ™ OverPass ™ Assemblies by Amphenol, a game-changing technology that is set to redefine data transmission as we know it. UltraPass ™ represents a paradigm shift in interconnect design, offering arrayed connector layouts for near-chip and on-package IO solutions.

Amphenol Aerospace designs and manufactures QPL Mil-spec and custom circular and rectangular electrical and electronic connectors for the military and aerospace industries. We also specialize in designing and building high-speed cable assemblies, media converters and Ethernet switches, fiber optic connectors and cable assemblies, high power and high voltage connectors, EMI/EMP filter ...

Board-to-board, board-to-cable, PHD2 cable-to-cable, and PHD2 cable-to-Ultrapass (224Gb/s) Maximized routing channels; Route 2 or more high speed differential pairs per layer; Mechanically matched and electrically balanced signals within each differential pair

我公司是安费诺集团在中国的全资子公司，隶属于安费诺汽车产品集团，成立于2004年。我公司产品涵盖安全气囊连接器及线束、汽车内外饰照明连接器及线束、新能源汽车连接器及线束、汽车安全带线束、汽车天窗线束、汽车信息及娱乐系统线束以及其它各类汽车不同部位的小型线束。

Our wide array of electrical and electronic connectors come in multiple form factors and are designed to meet the latest market needs, including high power requirements, higher speeds, size and weight reduction, EMI shielding, hermeticity, high pressure, and improved board retention.

In today's fast-paced digital landscape, where speed, reliability, and efficiency are paramount, the demand for cutting-edge interconnect solutions has never been greater. UltraPass™ OverPass™ Assemblies by Amphenol is a game-changing technology that is set to redefine data transmission requirements of the future.

根据空间要求定制的坚固可靠的互连解决方案. 了解 Amphenol Socapex 用于太空应用的尖端互连解决方案。我们的连接器可靠、经过测试、坚固耐用，能够满足航空航天工业的严格要求。

DensiLink OverPass products remove high speed signaling from the PCB and create a double ended, high performance cabling interconnect. These cables support 56G and 112G signaling in hardware system designs as well as technology for future 224G signaling s

Amphenol's ExtremePort™ OSFP 224G interconnect system is comprised of a 60 position, 0.6mm pitch connector built for use in high-speed serial applications.

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets.

Paladin's revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mat

Amphenol OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high speed serial applications. The connector is en

From the New Products Introduction page, users can easily find and get information about Amphenol CS's latest products, tools, videos and articles. Stay connected!

With a speed twice as much as the industry standard, Paladin’s ® game-changing 112 Gb/s backplane interconnect technology sets the benchmark for signal integrity performance in backplane interconnects. It has no stub resonance from signal contacts and demonstrates a smooth linear transmission beyond 40GHz.