Search Results for 2250272824u90a1x11想、

2250272824u90a1x11想、 | Amphenol Global Search | Amphenol Description. USB 3.2, Type A, Receptacle, Right Angle, 9 Pins, Shell with Nickel Plating, 30μin Gold, Dip 2.4mm, Blue High Temperature Housing, Tray Packaging.

2250272824u90a1x11想、 | Amphenol Global Search | Amphenol Amphenol's ExtremePort™ QSFP-DD 224G interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high-speed serial applications.

These 1.00mm pitch, vertical and right angle card edge connectors enable all generations of PCI Express® signaling in desktop PCs, workstations, and servers. The connector designs support 2.5GT/s (Gen 1), 5.0GT/s (Gen. 2), 8.0GT/s (Gen 3) and the recent upgrade to 16GT/s (Gen. https://www.amphenol.com/search/10146065.

Amphenol is one of the leading manufacturers of pcie m.2 connector. Contact us today for more details of part number 10146065-113X0LF

10146065-113X0LF | PCI Express | Amphenol Amphenol is one of the leading manufacturers of pcie m.2 connector. Contact us today for more details of part number 10146065-113X0LF

MIL-DTL-38999 Series II connectors with fast, 1/3 turn bayonet coupling and a glass to metal seal achieving mil-spec sealing requirements. D38999 Series I Hermetic MIL-DTL-38999 Series I connectors with fast, 1/3 turn bayonet coupling, scoop proof design to protect the contacts, and a glass to metal seal achieving mil-spec sealing requirements.

PCI Express®x16 vertical Card Edge Connector, 164 Positions, 1mm (0.039inch) Pitch

Amphenol's PCIe ® M.2 Gen 3 and Gen 4 connectors support higher data rates and are also compatible with USB 3.0 and SATA 3.0 applications. These PCI express card edge connectors with 67 contacts on 0.50mm pitch are fully compliant with PCI-SIG PCIe ® M.2 specifications and offer design flexibility with 75 positions with 8 connector key options.

The Amphenol Cool Express Link™ is a range of EDSFF E3 2C Hybrid Orthogonal Press-fit PCIe® Gen 5/6 Cable Connectors that supports low latency, high bandwidth, and high throughput data transmission for existing and next-gen storage and CXL 3.1 applications.