Search Results for 24 well plate area
Dry Heat Tunnel and Oven Solutions - KAYE
Hot air sterilization, also known as dry heat sterilization or depyrogenation, is a critical process for the removal of pyrogens and microorganisms from materials such as glassware and metal parts. This method is frequently used in the pharmaceutical and biotech industries and operates at high temperatures, typically up to 350+ ºC/ 662+°F or more.
High Temperature Clamping
plastic surfaces. The plate enlarges the C1-B contact area. For applications that require side to side stability. Cross tab prevents clip and package C1-C from moving sideways. For applications that require reduced width at the contact point. Contacts can be C1-D modified to fit unique widths. This clip was developed for large side brazed
AE-AN-SK-008 - SK SERIES - PCB FOOTPRINT AND MOUNTING SPECIFICATIONS
Recommended plating for pads is 0.00508 mm (0.0002”) nickel under 0.00127 mm (0.00005”) hard gold minimum. ENIG and ENEPIG are both acceptable as well. For alternative methods, please contact support@ardentconcepts.com. Any via in pad circle must be filled and coplanar to 0.025 mm (0.001”) with pad and mounting donut.
RNJ Reduced Flange - Amphenol Socapex
• Available in Aluminum with OD. Cadmium, Nickel or Black Zinc Nickel Plate or Stainless Steel Passivated or Nickel plated • Higher density on panel & lower weight than Standard RNJ • Reduced Flange deviation : • F312 for Crimp or Standard PC Tail version / F311 with safety Castle nut
Ardent Concepts
For G-S-G configurations, a signal pin surrounded by grounded pins is selected for the signal transmission. For G-S-S-G configurations, two adjacent pins are used and all other pins are grounded. Measurements in both frequency and time domain form the basis for the evaluation.
Accelerometer Mounting Accessories | PCB Piezotronics
Using Accelerometer Mounting Accessories by PCB® is a best practice for quality accelerometer installation. When you install your accelerometers with these accessories you can avoid time consuming errors. These vendor manufactured mounting accessories are field-proven, engineered devices. Guidelines for Mounting Test Accelerometers.
APPLICATION NOTE - Amphenol Ardent Concepts
This plate should be installed when transporting, shipping and handling of the socket. This plate also doubles as a vacuum manifold assembly fixture. The stiffener assembly can be comprised of a single metal plate with support posts or the metal plate and a detachable plastic stiffener pad.
CFIT-FlexTM Compact Universal Enclosure General Description and ...
The CFIT- Flex™ is a compact enclosure (15”H x 12”W x 5”D) that accommodates up to 24 fiber ports. Features include: Interchangeable, removable bottom “feed and drop” cable port plates with variable entry grommets maximize in/out flexibility
RD SERIES UL File #E140980 RHAPSO-D SERIES TECHNICAL CHARACTERISTICS
MATERIALS AND FINISHES: Insulator: Glass filled DAP per ASTM-D-5948, SDG-F, UL 94V-0, green color. Contacts: Precision machined copper alloy. Contact Plating: Military performance - 0.000050 inch [1.27 µ] gold over nickel plate. IEC 60807-3, Performance Level One - gold flash over
ARMORIPX Family - Amphenol Sine
Available in two (2) sizes, as well as three (3) different material types: Ultem® (Amber), Thermoplastic (Black) or Polycarbonate (Clear). Simplified installation is accomplished via a rugged, tandem, through-hole design for ease of mounting and includes optional environmental venting.
ArmorIPX Series™ Enclosures - Amphenol Sine
Amphenol Sine Systems’ Armor IPX™ Family of Sealed Enclosures provides superior protection for printed circuit boards and electronic control modules in harsh environments and off-road applications. Available in two (2) sizes, as well as three (3) different material types: Ultem® (Amber), Thermoplastic (Black) or Polycarbonate (Clear).
SIM EN4165 Mono-Module Connectors - Amphenol PCD
SIM mono module series uses electroless nickel plating on a thermoplastic shell. This provides electrical continuity and shielding effectiveness between plug, receptacle, backshell and shielding braid of the cable.
Microduct Manifold - Amphenol Broadband Solutions
Microduct manifold kits have been created for both 24 and 72 tube installations. Other kit configurations available upon request. The microduct manifold is designed to seamlessly interface with multiple ABS wall mount enclosures such as our FDE (Fiber Demarc EnhancedBox).
Cable Assemblies | Products - Amphenol
Amphenol’s cable assemblies include simple point-to-point cables, custom high-power and high-speed data cable assemblies and complex multi-branch harness assembly for large systems across a broad range of end markets.
Pedlock BDO CTFT Series Brownfield Fiber Distribution Pedestals
• Multi-position bond plate with #6 ground lug meets requirements for bonding and grounding of copper and fiber service wires and cable sheaths • Lift-off dome provides 360º access to internalsplicing area • Dome attaches securely to the base using a self-locking 216-hex head bolt lock • Vault mount base available CTFT Pedestal Side 1
Ardent Concepts
Ardent Concepts 4110-1674 test socket 0.50 mm pitch Measurement and Model Results prepared by Gert Hohenwarter 10/27/2010 GateWave Northern, Inc. 1
CFIT-Flex Compact Hub 2017_CFIT-Flex - charlesindustries.com
Charles’ Flex Compact Hub (FCH) Enclosures were designed around the principal of “flexibility.” These versatile enclosures may be wall or pole mounted and configured for low density Multi-Dwelling Unit (MDU) fiber distribution applications.
Variable Capacitance MEMS Accelerometers | PCB Piezotronics
Variable capacitance MEMS (VC MEMS) accelerometers are DC-response sensors for measuring low frequency vibration, motion (constant acceleration) and tilt. Micro-Electro-Mechanical Systems (MEMS) technology is the backbone of VC accelerometers.
Amphenol Aerospace
With the cooling plate at 70°C, all components remain below their maximum temperature rating for the SNC and 10G scenarios. Note that the Transceiver overheats for the worst-case power dissipation scenario; the temperature is 2°C higher than the maximum limit for worst case. Max. Limit, °C.
Solving Cooling Interconnects for Next-Gen Data Centers and AI Applications
Amphenol’s liquid-cooled solution for front-panel pluggables is available for OSFP in a 1x8 ganged configuration and QSFP-DD in a 2x8 ganged and stacked configuration, enabling increased switch density. These cages are complaint with respective MSA specifications and are compatible with OSFP and QSFP-DD products on the general market. 2.