Search Results for amphenol communications solutions 20-way idc connector header

Quickie ® IDC Cable-to-Board Connector System, Shrouded Header, Vertical, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.

Amphenol offers the FCI Basics Minitek® series of IDC connectors for board-to-board and wire/cable-to-board connections with a pitch of 2.00mm. It offers a fully modular system that facilitates various types of connections among PCBs, wires, and flat cables.

FCI Basics Quickie® is a complete solution for flat cable-to-board connections using 2.54mm pitch IDC technology. The highly durable connectors feature polarization, plating, and structure.

Amphenol . Communications Solutions. Quickie ® Value Proposition • Quickie ® is the industry proven standard interconnect system for flat ribbon cable to board connections on 2.54mm pitch • Quickie ® is a dual row system, offering 6 up to 64 positions • Quickie ® selective gold plating performances guarantees 100 mating cycles ...

It includes straight and right angle, surface mount and through-hole, pin headers and board receptacles in different plating variations, customized stacking headers, IDC version, available in up to 100 positions.

Amphenol offers the FCI Basics Minitek® series of IDC connectors for board-to-board and wire/cable-to-board connections with a pitch of 2.00mm. It offers a fully modular system that facilitates various types of connections among PCBs, wires, and flat cables. DESIGNED IN ACCORDANCE WITH DIN 41612.

4 contact point IDC configuration; Provides excellent electrical and mechanical properties; Fully modular system; Flexible, robust and standardized solution; Customized modules; Enhances connector suitability and flexibility; A wide variety of standard accessories such as latches, hoods/covers, and keys; Improved adaptability and polarization

The swappable custom battery connector solutions with cable assemblies are offered in 2 power & 6 signal configurations. These connectors can carry a continuous current up to 100A with 10,000 mating cycles.

Whether through-hole or surface-mount, single or double-row, straight or right angle orientation, these connectors provide reliable solutions for applications requiring precise board-to-board, wire-to-board, or flat cable connections.

FCI Basics Griplet® Miniature IDC Connector offers a robust solution for miniature IDC wire-to-board connections. Its low profile and compact design helps in saving space.

AgilBrick™ 2.54mm Board-to-Board Header G800 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol can be customized to meet various customer requirements.

AgilLink™ 2.00mm Wire-to-Board Header G823 Series is the most common solution for transfering power and signal. It can mate with both wire to board and board to board application. This series can carry a maximum current rating of 4A.

Millipacs ® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards.

EconoStik ™ 2.54mm is a standard 0.64mm square header with high-temperature resin and 1μ" gold plating in contact and tail. It supports up to 50 mating cycles. Suitable for mid-end applications, EconoStik ™ 2.54mm can be used in various board-to-board applications such as industrial control, test equipment, metering, POS machines, set-top box,…

FCI Basics Millipacs ® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards.

Amphenol's FCI Basics Minitek® 2.00mm range consists of modular board-to-board connectors suitable for parallel, perpendicular, and coplanar applications as well as wire-to-board connectors featuring crimp-to-wire and IDC capabilities.

Mates with G823H and G823F/C WTB headers; Mutually compatible with other wire to board connectors

Integrated engineering and manufacturing support – from R&D, stamping, plating, moulding and assembly all in one site, tailor make your connector solutions at ease with Amphenol. Simulate how parts are filled early in the design process to reduce molding defects, retooling, and redesign.

Industry proven, modular connector system . One connector family covers multiple board to board and IDC to board connection needs: Space saving 1.27mm pitch. 40% less board space compared with 2.00mm : Lowest profile eject latch header . Meets your specific design requirements: Lowest coplanarity at 0.1mm