Search Results for amphenol icc

Amphenol OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high speed serial applications. The connector is en. Amphenol OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 ...

WALLINGFORD, Conn.--(BUSINESS WIRE)-- Amphenol Corporation (NYSE: APH), a leading global provider of high-technology interconnect, antenna and sensor solutions, today announced a definitive agreement to acquire the Carlisle Interconnect Technologies (“CIT”) business of Carlisle Companies Incorporated (NYSE: CSL) for $2.025 billion in cash, subject to customary post-closing adjustments.

Amphenol ICC Subject: Amphenol s MDBR series D-Sub Connectors serve many markets and applications across the globe includingAutomotive, Communications, Industrial, Medical and Military. Keywords: MDBR Connectors; Rugged D-Subminiature Connectors; Commercial Industrial Connectors Created Date: 11/19/2020 12:29:10 PM

The Amphenol QSFP DD 200G Active Optical Cable is a high-density connector. The 8 channel lanes double the port density when compared to 100G QSFP28 AOC connectors. Amphenol's QSFP DD 200G AOC connectors provide up to 200Gb/s aggregate bandwidth, making them the ideal connector for higher capacity networks and data center applications.

Amphenol ICC is excited to participate in the SPS show again in 2019. Our team will be showcasing the latest power products designed for the industrial market, including PwrBlade ULTRA ® and BarKlip ® I/O solutions.. PwrBlade ® ULTRA Connector System. PwrBlade ULTRA ® is the highest linear density, lowest profile 2-piece connector currently available. High power contacts are rated up to ...

Amphenol is one of the leading manufacturers of Input Output Connectors. Contact us today for more details of D-Subminiature, part number 8655GMCS3C11KLF

Amphenol offer a wide range of high-performance enterprise SSD connector solutions for M.2, EDSFF, NGSFF, SAS, U.2, U.3, SATA and PCIe applications. High-density, high-performance connectors like M.2, Mini Cool Edge, Micro Cool Edge come in right angle, mezzanine and coplanar configurations and support cable interconnect options.

Amphenol's floating connectors offer numerous advantages over traditional connectors, making them a preferred choice in the world of electronic interconnects. By absorbing misalignments, accommodating multiple connectors, reducing stress on PCBs, and providing design flexibility, these connectors contribute to enhanced performance and ...

55010706-000 amphenol | Amphenol Global Search | Amphenol 10162522-A004LF | Amphenol Global Search | Amphenol Search Results for 10162522-A004LF. The FCI Minitek® Pwr family is an optimized product sold as a complete solution including wire-to-wire and wire-to-board, in pitch sizes of 3.00mm, 4.20mm, and 5.70mm, with current ratings from 6.5A

AgilLink™ 1.50mm Wire-to-Board G886 series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 2.5A. Amphenol ICC offers a comprehensive range of these headers including, vertical and right-angle DIP, and vertical and right angle SMT, to meet various customer requirements.

D-Subminiature Economy Range, Input Output Connectors, Signal 9 way Pin Right Angle, Solder Europe standard, 50 cycles, Harpoons + Female Screw UNC 4 - 40 + Elec cont., 1.6 mm PCB thickness

Amphenol ICC backplane connector provides the highest bandwidth capabilities for applications in networking communications, data, industrial and instrumentation. JavaScript seems to be disabled in your browser.

The FCI Minitek® Pwr family is an optimized product sold as a complete solution including wire-to-wire and wire-to-board, in pitch sizes of 3.00mm, 4.20mm, and 5.70mm, with current ratings from 6.5A to 23A. In short, Minitek® Pwr is compact, robust and versatile, which suits different customer application needs.

The Amphenol ICC cStack™ high-speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit.

Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=8.08mm (0.318in), Row Pitch 2.84mm, 09 Pin, Flash Gold, Bright Tin Shell+Grounding Dimples, 4-40 Front Screwlock, Ground Tab with Boardlock

The Mezzanine Connector, SK Series Chip-to-Board Socket from Amphenol offers high performance with patented compression mount technology, supporting up to 40GHz speed and 0.4mm pitches for cutting-edge ICs.

Amphenol . Communications Solutions. BergStik ® Value proposition. 2 • BergStik® is a standard, proven unshrouded header family on 2.54mm pitch, available in through- hole; surface-mount, pin- in-paste and press -fit solder options • BergStik® comes in single and double row; straight or right -angle orientation with to 2 to 72 positions

Amphenol Mini-SAS High Density receptacle is the next generation SAS system; the SAS 2.1 standard meets SAS-3 next generation speed and density requirements that provides faster data transmission and more bandwidth for end users. The low-profile syste

Amphenol is one of the leading manufacturers of PV® Wire to Board connector system. Contact us today for more details of PV Receptacle Housing part number 65846-007ELF.

Amphenol is a leader in SD card sockets and has the . capability to support customized designs. The push-push eject feature is designed for ease of card extraction. The user-friendly SD card socket is ideal for use in portable devices such as digital cameras and mobile phone, server applications as well as automotive devices. TARGET MARKETS