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Amphenol is one of the leading manufacturers of Minitek127 ® 1.27MM. Contact us today for more details of Minitek127 ® , part number 20021121-00010C4LF.

The 127/HE801 PCB connector from Amphenol Socapex is a reliable and robust connector designed for board-to-board and board-to-cable applications. It is cost-competitive and fully compatible with all the standard connectors on the market HE801. This connector has a medium density of 2.54mm [.100] staggered grid and many arrangements are available from 17 to 144 contacts.

Model TLD356A32:Triaxial, mini (5 gm) high sensitivity, ICP® accel., 100 mV/g, 1 Hz to 4k Hz, titanium hsg, 10 ft mating cable supplied, TEDS 1.0

AgilLink 2.00mm Wire-to-Board Header G823 Series is the most common solution for transfering power and signal. It can mate with both wire to board and board to board application.

Piezoresistive shock accelerometers, manufactured by MEMS technology, have low power consumption while still providing +/- 200 mV full scale output.

Model 605B61:Biaxial ring-style, industrial, ceramic shear ICP® accel, 100 mV/g, 0.5 to 5k Hz, side exit, 10-ft integral armor cable, biaxial single p

BLOOMINGDALE, Ill.--(BUSINESS WIRE)--Jan. 6, 2022-- PCTEL, Inc. (Nasdaq: PCTI), a leading global provider of wireless technology, today introduced its new 5G low-profile antenna platform for industrial IoT applications. The new Medallion™ II antenna platform has been designed to PCTEL’s high quality and performance standards. With its optimized multiband capabilities, the antennas are ...

AirMax ® power connector family comprises hard metric high power contacts. Amphenol also offers signal connector equivalents for these power interconnects.

EXAMAX2 Cable Backplane Systems offer high density cable assemblies for both internal and external applications that are capable of delivering high speed performance of 112Gb/s per channel. EXAMAX2 cable applications include internal OverPass cables, exte

Model 378C20:1/2" prepolarized random-incidence condenser microphone, 50 mV/Pa (+/-1.5 dB), with 1/2" ICP® preamplifier

Model 356A26:Platinum Stock Products; Triaxial, general purpose, ceramic shear ICP® accel, 50 mV/g, 1 to 5k Hz, 4-pin conn.

Search for Amphenol jobs by country by choosing from the dropdown below. Careers. Wilcoxon Sensing Technologies is a great place to work! We provide a welcoming atmosphere, competitive wages, comprehensive benefits, opportunities for growth, and a supportive, team-oriented environment.

Embark on a fulfilling career journey as a Production Technician I at Airmar Technology Corporation. Discover opportunities to grow your skills and make a meaningful impact in the dynamic world of marine and industrial sensor technology.

SMALL, FAST AND POWER EFFICIENT. Amphenol's 300Gb/s Leap ® High-Speed Optical Module is faster, smaller, and more cost and power efficient than most conventional datacenter interconnects.. Capable of speeds up to 25Gb/s and distances up to 100m; 300Gb/s total throughput requires only 1 sq in of board space and 5.4W of power

Job Vacancy. Post Department Location HC Published Details; IT Engineer: IT: Vietnam: 1: 05/07/2022: Details: Amphenol . Accountability Motivation People Honesty Energy Number Obligation Leadership. Solutions. IT Data com & Cloud Autonomous Driving 5G & Networking Consumer Electronics Harsh Industrial. News & Events.

Model 103B12:Acoustic ICP® pressure sensor, 10 psi, 500 mV/psi, 10-32 top conn., accel. comp.

Products; Features & Technologies Amphenol Aerospace Features & Technologies As a leading designer and manufacturer of state-of-the-art interconnect systems for commercial and military applications, Amphenol Aerospace offers an extensive selection of connectors and interconnect components for a multitude of different applications across land, air and sea.

High Performance to Industry Standards. Amphenol FCI Industrial backplane connectors perform to industry standards like IEC 61076-4-101, IEC 61076-4-104, IEC 603-2, IEC 917, IEC 603-2, EN 45545 Telcordia GR-1217-CORE standards and fulfills Compact PCI (cPCI) bus architecture.

The LEAP® OBT socket has been designed to host the LEAP OBT optical modules (standard & rugged). The socket is soldered onto the PCB. The socket is soldered via the corner solder pads and the electrical interfaces consists of 225 BGA solder balls.

Model HT622B01:High temperature, industrial, ceramic shear ICP® accel, 100 mV/g, 0.2 to 15k Hz, top exit, 2-pin conn., frequency sweep ISO 17025 accre