Search Results for axi interconnect
FCI Basics | Wire-to-Board, Board-to-Board | Input/Output, FFC/FPC ...
FCI Basics Products provides a modular interconnection platform of high quality and innovative solutions with a fast and competitive service model that helps to increase the competitiveness of our customer's equipment. Our solutions include Wire-to-Board, Board-to-Board, Input/Output and FFC/FPC.
Data Center - Amphenol TPI (ATPI)
ATPI's power & signal connectors and busbar solutions ensure optimal power distribution, signal integrity, and fast installation, making them the perfect choice for modern data center applications. Solutions available for power distribution, modular fast swap connections and signal interconnects.
SFP | High Speed Interconnects | Amphenol
Amphenol's SFP product family supports applications for up to 6 Gbps per channel. The connector accepts multiple transceivers per INF-8074i and combines, transmits, and receives functions in a low cost, compact format. The assemblies are designed to maximize valuable space on the PCB.
Products | Our Expertise | Amphenol Interconnect Product Corp
Amphenol IPC offers a complete interconnect product portfolio and engineering support for IT and industrial power systems including both power distribution and power conversion applications.
ExtremePort QSFP+ | High Speed Interconnects | Amphenol
Amphenol's ExtremePort™ QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high speed serial applications. Each port offers 4 channels to increase port density which allows for more board real estate and cost optimized solutions.
Board to Board | High Speed Backplane - Amphenol CS
Amphenol solves system design challenges with integrated interconnect solutions for applications in the networking, communications, storage, and computer server markets.
Optical Interconnect for Hyperscale Data Center with AI / ML ...
These solutions involve leveraging optical I/O technologies to provide high-performance interconnect solutions for large-scale data centers and address the challenges associated with interconnect bottlenecks in AI workloads.
ExpressPort SFP+ | High Speed Interconnects | Amphenol
Amphenol's ExpressPort ® SFP+ interconnect system provides data transfer speeds of up to 16Gb/s. The design of the ExpressPort ® SFP+ connector minimizes impedance discontinuities and reflections at high data rates and provides a 10 to 20 dB improvement in Near-End Crosstalk.
FCI Basics - Product Portfolio - Amphenol CS
Today, BASICS offers a broad, modular interconnect platform of high quality and innovative solutions for all main industries and applications. The BASICS portfolio offers the right mix between industry proven solutions and state of the art connector technology.
PowerPoint Presentation
Deep understanding of interconnect, PCB materials, and the latest in design practices lead to high performing assemblies at the best possible cost. Customers can take advantage of our full design capabilities or use our resources as technical advisors during the design process.
eQSFP | High Speed Interconnects | Amphenol
The eQSFP interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, and a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 28 Gbps/Channel, and replacing up to 4 standard SFP+ receptacles.
OverPass™ Interconnects – Your high speed , Low Loss Chip-to-Module ...
Amphenol ICC’s OverPass™ cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface.
FCI Basics - Programmable Logic Control - amphenol-cs.com
Today, BASICS ofers a broad, modular interconnect platform of high quality and innovative solutions for all main industries and applications. The BASICS portfolio ofers the right mix between industry-proven solutions and state-of-the art connector technology.
Amphenol Connectors | Cable Assemblies | Interconnects | Mobile, RF, Optics
Amphenol's ExtremePort™ OSFP 224G interconnect system is comprised of a 60 position, 0.6mm pitch connector built for use in high-speed serial applications. Amphenol introduces the next-generation OverPass™ solution - Mini Cool Edge IO.
Industrial Backplane | Embedded Computing Board Connectors ...
Millipacs ® is a 2.00mm modular board to board or cable to board Interconnection system... FCI Basics Millipacs ® is a 2.00mm modular, Board-To-Board and CableTo-Board Interconnection... FCI Basics Millipacs ® is a 2.00mm modular board to board or cable to board Interconnection...
Future Industrial Ethernet Communication Designs with ix Industrial ...
Amphenol ICC is launching the next generation high-speed ruggedized connectors for future industrial ethernet communication designs. We have collaborated with key interconnect technology partners Hirose Electric and Harting Technology Group to release the new ix Industrial™ series of connectors.
FCi Basics - Amphenol CS
More Reliability, Low Mating Force, Automotive Grade Connector System . Configurations . The Wirelock® Wire-To-Board connector design addresses the growing need for automotive grade, compact interconnect.
A Deep Dive into High-Speed Computing Server Interconnect Solutions
Amphenol comes up with the EXAMAX2 ® backplane connector system supporting 112Gb/s PAM4 industry specifications. This ultra-fast interconnect technology enhances data transfer rates and reduces communication latency, enabling high-performance systems to process AI workloads more efficiently.
Input Output | High Speed I/O - Amphenol CS
Amphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high...
Solving Cooling Interconnects for Next-Gen Data Centers and AI Applications
Watch how Amphenol advocates a fluid cooled environment for a better data center carbon footprint through its successful demo of interconnects achieving near perfect transmission of electrical and optical data while immersed in single phase liquid.