Search Results for barklip
Zhaga Book 18 FLS Series for Outdoor Smart Lighting - Amphenol CS
Zhaga Book 18 FLS Connectors. The FLS Receptacle is designed with 4 contacts for Power, DALI and Digital I/O, and mounts on a Luminaire, supporting smart lighting controls, sensor applications, and wireless communication. The housing for a Photocell/Sensor Module assembly is made of mating FLS Base /Extension Module and Dome.
DIN 41612; Up with Robust Design Improvements - Amphenol CS
DIN 41612; Enhanced Design to Improve Robustness. DIN 41612 is a comprehensive backplane offering from Amphenol ICC with a legacy of nearly five decades. With a broad range of DIN 41612 styles; these connectors has an edge over other backplane connector solutions in terms of mass deployment specifically in Industrial and Instrumentation sectors.
Industry-Proven Backplane Connectors to Suit Your Speed Requirements
Many industries and applications require connectors with speeds greater than 1Gb/s with reliable performance on a limited budget. This led to the introduction of mid-speed backplane connectors. These are presently very high in demand as they meet speed requirements of 4Gb/s to 5Gb/s which is sufficient for many of the modular complex server ...
Check Out the Latest Server Connectors at DesignCon 2020 - Amphenol CS
DesignCon being the largest chip, board, and systems event in the industry witnesses the launch of many innovative products. Amphenol ICC will be is launching three high-speed server connectors at DesignCon 2020: Right Angle PCIe ® Gen 4 CEM connectors, Gen Z 4C-HP Mini Cool Edge connectors and Double Density Cool Edge connectors.. PCIe ® Gen 4 CEM Connectors (RA)
Minitek MicroSpaceXS™ for Automotive Applications - Amphenol CS
Amphenol’s Minitek MicroSpace ™ Crimp-to-Wire connector offers a unique design that enables LV214 Severity-2 and performs at 1.8, 1.5, and 1.27mm pitch and is designed for use in many automotive applications. Now we have introduced an even advanced version; Minitek MicroSpaceXS ™ Crimp-to-Wire connectors, which offer many enhancements ...
The Crucial Role of Battery Management Systems (BMS) in Robotics
Feb 7, 2024. In the ever-evolving landscape of robotics, the heartbeat of these autonomous systems lies within their power source – the battery. Much like in electric vehicles, the Battery Management System (BMS) emerges as a critical player, ensuring the efficient utilization of energy and the safeguarding of batteries against potential hazards.
Amphenol 2021 in Retrospect
Amphenol 2021 in Retrospect. Dec 31, 2021. As another year wraps up, it makes us so proud to look back and see how fabulously we had managed the most challenging of our times. With over 40 new product launches, 8000+ parts created, and with a handful of advanced application solutions, 2021 had been a splendid year for Amphenol.
Amphenol New Product Updates – March 2021
The FLB series cover couples with the base to provide IP66 protection (per IEC 60529) for the mated photocell/control assembly. Domes are available in Grey, Clear, Red, Black, White and Translucent colors in 35mm, 50mm, 60mm, 75mm, 100mm & 130mm heights. The mating gaskets and O-rings on the bases ensure IP66 rating performance to protect equipment from moisture ingress.
Standards Enabling the Automotive Industry - Amphenol CS
These standards aim at developing better technologies. LVDS; LV214 and USCAR are three significant automotive standards. LVDS stands for Low-Voltage Differential Signalling. This is a generic interface standard for high-speed data transmission. LVDS is a global standard which is especially considered for automotive displays and digital cameras.
Open Compute Project (OCP) Global Summit - Amphenol CS
Feb 27, 2020. Open Compute Project (OCP) is making more efficient and scalable hardware and creating a new image for IT infrastructure. Every year OCP Global Summit will bring together expert developers, suppliers, engineers, executives and decision-makers around the globe to showcase and discuss the amazing technological enhancements happening ...
Connectors | Products | Amphenol
BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables, and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire & contact increases ...
What are the top differences between DDR4 and DDR5? - Amphenol CS
The DDR5 SODIMM connectors also have an improved seating depth of 3.95mm and a key notch width of 1.25mm, compared to 3.90mm and 3.50mm respectively for DDR4. Both DDR4 and DDR5 come with low power consumption and promote better thermal management. The different key positions help to align the connector and prevent mismating.
Amphenol will be at Smart Production Solutions (SPS) 2023
PwrBlade+ ® IO and BarKlip ® BK200 I/O demonstrate Amphenol's ability to cater to the evolving fields of robotics and industrial automation. Amphenol will also showcase the PwrBlade ® Mini Cable-to-Board, Board-to-Board, and Mezzanine connectors, designed to meet the demanding requirements of these sectors.
Tag Archives: FLA Series - Amphenol CS
Like previous years, Amphenol ICC is presenting an extensive range of products in SPS this year. Extensively recognized in numerous market segments like Industrial, Telecommunication, Datacom, Medical, Energy, Transportation, and Consumer, Amphenol ICC’s harsh environment and filter connectors are designed to meet a wide range of requirements.
Join Amphenol at Automotive World 2023
Automotive World is a leading global exhibition in automotive electronics, covering technologies like connected cars, autonomous driving, EV/HV/FCV, and MaaS. This year, 2023, the event will be held at Tokyo, Japan. Both Automotive OEMs and Tier 1 suppliers are among the 1,420 exhibitors, 70K visitors, and 170 speakers expected to attend the event.
OverPass™ Interconnects – Your high speed , Low Loss Chip-to-Module ...
Dec 3, 2018. Amphenol ICC’s OverPass ™ cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface. The system transfers high-speed signals to twinax cables shortly after they are launched from the chip ...
Millipacs® Hardmetric Connectors for Industrial Applications
Millipacs ® offers both low-speed and high-speed connectors of up to 25Gbps with mating compatibility between different versions and hybrid solutions (signal & power). Its hard metric configuration designed in accordance to IEC 917, IEC 61076-4-101, Telcordia GR-1217-CORE standards and fulfills Compact PCI bus architecture.
Amphenol Exhibits and Demos at DesignCon 2022
Amphenol Exhibits and Demos at DesignCon 2022. DesignCon, the largest event for Chip, Board, and Systems Design Engineers, brings together the brightest talents across the world. This premier gathering has the legacy of more than two decades in solving the signal and power integrity challenges and creating innovative design solutions for tomorrow.
Direct Orthogonal Architecture: Signal Speed Benefits, Mechanical Risks ...
Direct Orthogonal Architecture. Direct Orthogonal architectures face several design challenges compared to traditional backplane systems. By removing a backplane, the mechanical reference data is eliminated which can increase tolerance values between the two PCBs in the orthogonal architecture. Typical direct orthogonal systems are designed for ...
Automotive | Markets | Amphenol
BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables, and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact ...