Search Results for barklip

Amphenol Communication Solutions, Amphenol Advanced Sensors, and Amphenol RF will be participating in the LightFair 2023 event at The Javits Center in New York City on May 21 st through May 25 th. At booth #1963, Amphenol’s products will be exhibited from 10 AM to 6 PM on May 23 rd and 24 th, and from 10 AM to 3 PM on May 25 th.. LightFair is a premier global trade show and conference for ...

Amphenol ICC’s OverPass ™ cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface. The system transfers high-speed signals to twinax cables shortly after they are launched from the chip and delivers a direct link to the external port when compared ...

BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases ...

Three new products were added to the Amphenol product array in February. FCI Basics BergStak HS ™ connector family known for its fast data transmission, high signal quality, and time-proven reliability was extended with two new additions including BergStak HS ™ 0.80mm and BergStak ® 0.50mm self-alignment connectors.

DesignCon provides an unparalleled opportunity to check out the latest and most innovative products in the market. Throughout the event, you have access to more than 5,000 design engineers and other industry experts, demonstrations and presentations.

Finding the right connector based on your requirements is much easier now using our product configurators. You can select different parameters such as pitch sizes, plating options, terminations, mating length, tail length, pin style, signal and power pins, amongst many key product attributes.

As the electric vehicle market continues to grow, the importance of the battery pack and its component parts cannot be overstated. At the heart of the battery pack is the cell connection system (CCS), which plays a critical role in ensuring the reliable performance and longevity of the battery.

The BarKlip ® BK150, a power solution busbar connector, features 10 independent points of contact with low resistance and high reliability. JavaScript seems to be disabled in your browser. For the best experience on our site, be sure to turn on Javascript in your browser.

Amphenol Communications Solutions Pioneers Innovation: Launches Two Made-in-India Tech Solutions at Bharat Mobility Global Expo 2025 Jan 22, 2025

Come visit us at OCP CHINA DAY, Booth #B09 at the Beijing Kerry Hotel, on August 10th, 2022. Please use our special invite code “AMPHENOL” to register for the conference.

With a 2.00mm pitch, Minitek ® is compatible with all types of connections between cables, wires, and PCBs. This design has helped to save up to 38% space compared with the conventional 2.54mm design. Minitek ® product range is so extensive and modular that it can be used for all types of wire-to-board, board-to-board, and cable-to-board interconnections on this pitch size.

DesignCon, North America's largest chip, board, and systems event is returning to Silicon Valley for its 26th year. It continues to be the premier educational conference and technology exhibition for high-speed communications and semiconductor industries.

BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact ...

Depth, Speed-Through-Water, Water Temperature, Boat Attitude. The new DST810 Smart Multisensor, featuring the new Gen2 paddlewheel and AIRMAR's CAST ™ app, delivers a powerful combination of best-in-class speed performance and a simple, reliable way to calibrate accurate speed using your wireless device.

Amphenol's BarKlip BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar

System designers are encountering new architectural challenges as single lane data rates are continuing to increase. Next generation SerDes devices d, will soon be scaling to 112Gbps PAM4. A major obstacle in system design is the challenge of passing 112Gb/s high frequency signals through PCB withou

DesignCon, the largest event for Chip, Board, and Systems Design Engineers, brings together the brightest talents across the world. This premier gathering has the legacy of more than two decades in solving the signal and power integrity challenges and creating innovative design solutions for tomorrow.

Features. Current rating to 113A/contact without exceeding a 30°C temperature rise in still air Design is compliant with the Hard Metric (HM) Equipment Practice and compatible with the ZipLine ®, AirMax VS ® and Millipacs ® connector series ; Connector housing does not overhang the board edge so the board-to-board spacing can be adjusted if needed

The data and communication industry is under constant development to introduce many innovative technologies that makes our lives hassle free. From a simple activity like sending an instant message to advanced operations combining AI and machine-to-machine communication, the performance of all smart devices we handle each day is based on data transfer among these operations.

The global forklift market is being projected to grow at a CAGR of 13.2% from 2023 to 2030. The demand for forklifts has raised due to the growing e-commerce industry and evolving warehouse management practices that require handling heavy loads and navigating through narrow spaces.