Search Results for barklip

BarKlip® XP series is capable of distributing anywhere from 150 to 1000A of power to busbar power distribution applications. Amphenol Communications Solutions Barrier Terminal Block In structure, they comprise panel feed-through type, baffle type, and pluggable type, and can connect all kinds of conducting wires whose cross-sections are 0 ...

Engineers around the world are eager to gather to discuss hot topics and new innovations in the electronics industry at DesignCon 2021, August 16th-18th, 2021 at the San Jose McEnery Convention Center. Decision makers will be able to learn about the wide range of Amphenol’s industry-leading connectivity solutions that are enabling the electronics revolution.

BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases ...

In this blog, we delve into the remarkable features, benefits, and significance of ExaMAX2®, the next-generation connector system that promises to redefine the standards of data transmission.

Many industries look for rugged connector solutions that can withstand high temperatures and different climatic conditions with high durability. Amphenol ICC offers a wide range of harsh environment connectors for such application requirements.

Amphenol's BarKlip XP connectors feature independent points of contacts that provide overall lower resistance and greater overall efficiency. BarKlip XP series is capable of distributing anywhere from 150 to 1000A of power to busbar power distribution

Power Busbar Connectors. OCP 48V BarKlip ® BK500 and BK150 are the latest additions to the Busbar family. These power cable assemblies are compliant with OCP V3 power distribution architecture standards and provide a convenient method of distributing up to 500A and 150A per contact between busbars, cables, and circuit boards respectively.

Amphenol will showcase its innovative interconnect solutions at SPS 2024 in Nuremberg (Nov 12-14). Visit us at Hall 10, Booth 210 to explore our wide range of products designed to enhance automation and connectivity in various industries.

The D-Subminiature (D-Sub) interconnect system made its debut over 70-years ago in 1952 and while many technologies of the era have long since been retired, the d-sub continues to show its relevance today as one of the world’s most adaptable and reliable I/O platforms.

Plating technology defines the mating cycles, durability and performance of connectors. GXT ®, AGT ®, and GCS ® are innovative plating solutions that create durable, reliable, and economical connectors with increased efficiency.. GXT ® plating, a mix of palladium-nickel with gold flash was developed back in the 1980s. It has continuously met Telecordia performance requirements for the past ...

Amphenol ICC is excited to participate in the SPS show again in 2019. Our team will be showcasing the latest power products designed for the industrial market, including PwrBlade ULTRA ® and BarKlip ® I/O solutions.

Amphenol's BarKlip ® BK450 connector is designed to mate directly with a 3.18mm single pole busbar and provides a convenient method of distributing up to 450A between busbars Video The FCI Minitek® Pwr family is an optimized product sold as a complete solution including wire-to-wire and wire-to-board, in pitch sizes of 3.00mm, 4.20mm, and 5

Amphenol's OCP 48V compliant Barklip® BK500 IO power cable assemblies are designed to meet OCP V3 power distribution architecture standards and provide a convenient method of distributing up to 500A per contact between busbars, cables, and circuit boa

PCIe ® (peripheral component interconnect express) is an interface standard for connecting high-speed components in a computer or server. Basically, it is how all major components inside a computer talk with each other. Those components include CPUs, GPUs, SSDs, Hard Drives, Sound Cards, and Wi-Fi Cards, among others.

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets.

InfiniBand stands tall as a stalwart in the realm of high speed computing interconnect solutions. With its high bandwidth, low latency, and support for multiple topologies, InfiniBand is a go-to choice for clusters handling intensive computational tasks.

Amphenol Communications Solutions releases Internal High-Speed Link Input Output Connectors Performing to PCI-SIG Gen 6 Specifications - Designed for Next Generation Enterprise Server Equipment

Introduction. In an era where data speeds define technological progress, Amphenol's latest innovation, the PCI Express ® DirectAttached ® CEM Card Edge Connectors, emerges as a game-changer.Engineered with cutting-edge technology, these connectors are set to revolutionize the landscape of data transmission, offering unparalleled performance and flexibility.

In addition to these styles, there are many other board termination styles, including Land Grid Array (LGA) and the patented Ball Grid Array (BGA) that find applications in high-speed mezzanine connectors like cLGA ®, cStack ™, M-Series ™, MEG-Array ®, and Chameleon ®.There are also wire termination styles that deal with how the wire is attached to the contacts of the connector ...

The EDSFF 2-piece cable solution supports data rates of up to PCIe ® 5.0 at 32Gb/s. It utilizes the EDSFF standard interface Mini Cool Edge 1C/2C connectors on one cable end, offering flexibility in connector form factor selection such as MCIO, Multi-Trak ™, Backplane connectors, and more on the other end.. Ideal for high-speed computing data center server systems, this solution eliminates ...