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As the hyperscale community prepares to ramp up implementation efforts, Amphenol ICC Power Solutions has already designed the next generation of power distribution solutions to best fit hyperscale needs efficiently. Most importantly, our broad range of hyperscale compliant solutions such as Barklip ® IO,

Three high-speed products were introduced to the Amphenol ICC product portfolio in the month of August. Double Density Cool Edge Connectors and BergStak ® FX10 offers high-speed high-density board to board solutions and the microSD Express Connector uses PCI express 4.0 protocol rated up to 16Gb/s making it a high-performance memory card connector compliant to SD specification V7.1

BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases ...

BarKlip BK150 (1) BarKlip BK500 (1) BergStak ExtremePort DDR5 SO-DIMM (1) BergStak Secure (1) Blockchain (1) C2E (1) CCS (1) CTW Fan Module Connectors (1) Cable Management (1) Cabled Backplane (1) Circular Connectors (1) ComboStak and PowerStak (1) Computing (1) Conan Lite (1) Connectors (1) Cool Edge PCIe Connectors (1) CoolEdge (1) Copper DAC ...

BarKlip BK150 (1) BarKlip BK500 (1) BergStak ExtremePort DDR5 SO-DIMM (1) BergStak Secure (1) Blockchain (1) C2E (1) CCS (1) CTW Fan Module Connectors (1) Cable Management (1) Cabled Backplane (1) Circular Connectors (1) ComboStak and PowerStak (1) Computing (1) Conan Lite (1) Connectors (1) Cool Edge PCIe Connectors (1) CoolEdge (1) Copper DAC ...

BarKlip BK150 (1) BarKlip BK500 (1) BergStak ExtremePort DDR5 SO-DIMM (1) BergStak Secure (1) Blockchain (1) C2E (1) CCS (1) CTW Fan Module Connectors (1) Cable Management (1) Cabled Backplane (1) Circular Connectors (1) ComboStak and PowerStak (1) Computing (1) Conan Lite (1) Connectors (1) Cool Edge PCIe Connectors (1) CoolEdge (1) Copper DAC ...

Three new products were added to the Amphenol product array in February. FCI Basics BergStak HS ™ connector family known for its fast data transmission, high signal quality, and time-proven reliability was extended with two new additions including BergStak HS ™ 0.80mm and BergStak ® 0.50mm self-alignment connectors.

Electronica 2018 has begun at the Messe München on 13 November. We hope to meet you at our Electronica booth, if not, here are some key product highlights to share what you’ve missed.

The SSD market is expected to take a giant leap in 2020 with the increased demand for cloud applications and the improvement in technology like 5G connectivity. Amphenol offers a wide range of solutions to support different types of SSD.

BarKlip BK150 (1) BarKlip BK500 (1) BergStak ExtremePort DDR5 SO-DIMM (1) BergStak Secure (1) Blockchain (1) C2E (1) CCS (1) CTW Fan Module Connectors (1) Cable Management (1) Cabled Backplane (1) Circular Connectors (1) ComboStak and PowerStak (1) Computing (1) Conan Lite (1) Connectors (1) Cool Edge PCIe Connectors (1) CoolEdge (1) Copper DAC ...

electronica China is undoubtedly the industry’s one of the most important gatherings. This trade fair for electronic components, applications, and systems brings around the best players in the market and showcases some of the finest technologies of today and tomorrow.

The demand for increased speeds and greater bandwidth for data and communication industries for VoIP, Ethernet, WLAN, and other areas including medical and industrial applications have, in turn, increased the requirement for high-performing modular jacks.

The world is switching to renewable sources of energy for a greener living, among which wind energy is widely popular these days. As we all know, the basic functionality behind a wind turbine is to convert the kinetic energy from winds to electric power.

BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables, and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire & contact increases ...

Search Results for 10172147-001lf 10095340-001LF | HCI ® ... 10028917-001LF. AirMax® Power Connectors, Backplane Connectors, 2-Pair, 2 Column, Right Angle Header, Press-Fit.

The MRU series USB 2.0 Type A connector is the latest addition to the Amphenol ICC Harsh Environment connector family. With data rates up to 480Mb/s, the connector series provide IP67 protection for enclosures per IEC 60529 and provides a standard USB interface for harsh environments applications.

BarKlip BK150 (1) BarKlip BK500 (1) BergStak ExtremePort DDR5 SO-DIMM (1) BergStak Secure (1) Blockchain (1) C2E (1) CCS (1) CTW Fan Module Connectors (1) Cable Management (1) Cabled Backplane (1) Circular Connectors (1) ComboStak and PowerStak (1) Computing (1) Conan Lite (1) Connectors (1) Cool Edge PCIe Connectors (1) CoolEdge (1) Copper DAC ...

The improvements in data and communication are no more confined to smartphones or data centers. With the invent of 5G the a vast collections of nodes and sensors work simultaneously in processing thousands of signals through 5G antennas, baseband units, long haul fiber optic cabling, and edge-based data centers that control applications across commercial, transportation, medical sectors and ...

Amphenol is excited to announce we will join PIC-SIG in their upcoming webinar, "The Journey to CopprLink™ and Beyond: An Exploration of PCIe ® Cabling Solutions," where they will delve into the latest advancements in PCIe ® or PCI Express ® cabling technology.

Optical fibers are being redefined with the continuous requirement for increased bandwidth. This evolution is showcased at the ECOC Exhibition. The European Conference on Optical Communication (ECOC) continues to be Europe's largest Optics event and one of the most esteemed events on optical communi