Search Results for barklip

PCIe® Gen 7.0 Doubles Data Rate to 128 GT/s For Data-Intensive Markets Feb 6, 2025

BergStak ® 0.80mm board-to-board connectors are an essential part of medical monitoring equipment, helping to realize space-saving and high-speed board-to-board connections between main boards and add-on boards. Featuring optional shielding to minimize EMI and meets the increasing trend to use BergStak on FPC cables for flexible connections to solve medical board design challenges.

Amphenol launches new configurations of Compact FLH Series IP67 Sealed Connectors and Cables NASHUA, N.H., Oct. 11, 2022 -- Amphenol Communications Solutions is pleased to announce today the release of more options in its FLH series of mini sealed 2.50mm pitch IP67 and IP20 connectors, including ne

Amphenol's OCP 48V compliant BarKlip ® BK220 power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards. The connector system supports up to 220A per contact between busbars, cables, and circuit boards.

BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables, and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire & contact increases ...

ix Industrial™ (10-pin rectangular connector compliant with IEC 61076-3-124) is now added to the list of CC-Link IE TSN Specifications Pennsylvania, USA – Amphenol Communications Solutions is pleased to announce today that the CC-Link IE TSN Specification List for March 2023 will now include ix Industrial™ (10-pin rectangular connector compliant with IEC 61076-3-124).

The PCIe ® Gen 5 Flip CEM is a newly introduced vertical card edge connector that adheres to the PCIe ® standard mating interface. Its unique design features "JJ" or "LL" type contacts, resulting in a significant reduction of up to 19.5% in the keep-out area compared to traditional CEM connectors. Amphenol’s Flip CEM connectors can support bandwidths up to 32GT/s (Gen5) and can mate with ...

Ever since, these flash memory cards have pedaled through various evolutions in the process of meeting the industry trends. The latest addition to this family is the microSD Express, which is expected to escalate the future of our data-hungry world to the next level.

In addressing the specific needs of outdoor lighting applications, Amphenol introduces the FLA Series ANSI C 136.10/41 NEMA Receptacles & Caps and the FLB Series ANSI C 136.10/41 NEMA Bases & Domes. Engineered for ruggedness and durability, these connectors meet stringent industry standards, providing reliable connectivity in harsh outdoor environments.

BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases ...

Technological advancements are pushing the boundaries of what robots can achieve. Vision and sensing technologies in robots are at the heart of these advancements, playing a crucial role in enabling intelligent decision-making and navigating complex environments

There are multiple factors that design engineers take into consideration when choosing a connector. This can vary from performance factors like speed and signal integrity to form factors like size and shape.

Amphenol BarKlip® BK450 connector is designed to mate directly with a 3.18mm single pole busbar and provides a convenient method of distributing up to 450A between busbars. The connector system features 36 independent points of gold-plated contact bea

Amphenol as a leader in the interconnect industry always looks forward to bringing technological developments in a sustainable way. This is one of the major reasons why we develop advanced interconnect solutions that support various components within electric vehicles.

Amphenol ICC’s OverPass ™ cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface. The system transfers high-speed signals to twinax cables shortly after they are launched from the chip and delivers a direct link to the external port when compared ...

Automotive Industry Standards are standards that define the connector requirements in terms of temperature, vibration, sealing and many other characteristics in an automobile application.

BarKlip ® XP200 features 10 independent conducting beams that maintain contact with the mating busbar in common misaligned positions which provides high reliability and low contact resistance. In addition, XP200 connectors are plated in Amphenol's proprietary AGT ® silver-based plating to… Beginning of dialog window.

The instruments used to test various parameters defining the flawless performance of an application or gears are commonly termed as test and measurement equipment.

From the present era of 100 to 200G per second speeds, the networking industry is ready to witness a dramatic leap into 400G. The bandwidth demands in data centers, edge computing and cloud computing are constantly increasing the traffic in cyberspace, which is leading to the quick deployment of 400G.

Amphenol ICC will be releasing two new product series supporting this developing market in Q1 2020, the ND9 series (ix IndustrialTM interface governed by IEC 61076-3-124), and MSPE series (Single Pair Ethernet per IEC 63171-6).