Search Results for barklip

Join us at electronica China 2024, one of the leading international trade fairs for the electronics industry. This annual event will occur at the prestigious Shanghai New International Expo Centre in Shanghai from July 8 to July 10. As a proud exhibitor, Team Amphenol is excited to invite you to our

BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases ...

In September, Amphenol ICC launched 4 new products. PwrMAX ® G2 is the highest density blind mate power and signal connector available in the market today and Mezzostak ® 0.50mm with an innovative hermaphroditic design is a robust fine-pitch mezzanine connector solution. While IPS series offer an integrated cable solution for high-speed card edge connectors like PCIe, the new MXM connector ...

HIGH POWER AND LOW RESISTANCE BUSBAR CONNECTOR Amphenol's BarKlip ® XP connectors feature independent points of contact that provide overall lower resistance and greater efficiency. BarKlip ® XP can distribute anywhere from 150A to 1000A of power to busbar power distribution applications. BarKlip ® XP is a perfect power ...

Amphenol, a globally recognized leader in interconnect solutions, has developed a unique product line of rugged connectors designed to meet the diverse requirements of various market segments.

Amphenol ICC offers many solutions to support Programmable Logic Controllers (PLCs). While our connectors like OCTIS™ Outdoor I/O System, Boltrack™ Connector, SAS PCIe, DDR4 supports the data transferring units and communication with other systems in the network.

From the present era of 100 to 200G per second speeds, the networking industry is ready to witness a dramatic leap into 400G. The bandwidth demands in data centers, edge computing and cloud computing are constantly increasing the traffic in cyberspace, which is leading to the quick deployment of 400G.

DesignCon being the largest chip, board, and systems event in the industry witnesses the launch of many innovative products. Amphenol ICC will be is launching three high-speed server connectors at DesignCon 2020: Right Angle PCIe ® Gen 4 CEM connectors, Gen Z 4C-HP Mini Cool Edge connectors and Double Density Cool Edge connectors.. PCIe ® Gen 4 CEM Connectors (RA)

Amphenol is proud to announce that Yifan Huang and Stephen Smith will present a technical paper titled “PCIe Gen 5 CEM Connector and Add-In Card PCB design optimizations” at DesignCon 2019.

BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases ...

The need for high-speed connectivity is more pronounced than ever in this era of the Internet and interconnected systems. Cables and connector solutions have evolved to perform better than ever to support fast-paced information networks.

Amphenol's BarKlip ® BK450 connector is designed to mate directly with a 3.18mm single pole busbar and provides a convenient method of distributing up to 450A between busbars Video The FCI Minitek® Pwr family is an optimized product sold as a complete solution including wire-to-wire and wire-to-board, in pitch sizes of 3.00mm, 4.20mm, and 5

Industrial automation and digitalization are making revolutionary changes. We have already discussed in previous articles about the changes happening in factory floors with the implementation of Industry 4.0 and IIoT. From robots to CNCs and PLCs, we have learned about various types of machinery and how they help in making the manufacturing process precise and rapid.

From 56G to 112G to 224G, the connector industry strives to meet the challenges put forth by new technologies every day. Check out Amphenol’s high bandwidth connectors to learn more.

Memory modules can be defined as PCBs mounted with integrated-circuit-based memory. These are used in various computing applications ranging from notebooks and laptops to servers and data center. Memory module standards have evolved over generations to meet the growing demands of high-speed, data-hungry applications. Unlike earlier days when memory modules were designed specifically to meet ...

BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables, and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire & contact increases ...

The global automotive industry is passing through massive transitions each day. Driving is much more to consumers than a means of mobility. From high-speed data connectivity and infotainment to person-identification sensors and autonomous driving, the smart cars of today have a handful of features to offer.

Amphenol's BarKlip ® BK450 connector is designed to mate directly with a 3.18mm single pole busbar and provides a convenient method of distributing up to 450A between busbars. Video. Amphenol offers high-performing, low-resistance Busbar connectors with designs to conveniently distribute power between busbars, cables, and circuit boards. Webinar.

Energy storage has been a critical focus since electricity's inception, aiming to store power efficiently and regulate its use in accordance with demand. As we transition towards sustainable energy, the importance of short and long-term energy storage becomes paramount. Connected to renewable source

Zhaga Consortium is an international association that creates industry standards in the LED lighting industry to simplify the design and manufacturing of LED luminaires.