Search Results for barklip
IT Datacom | Markets | Amphenol
BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases ...
RAM Advancements - From SDR to DDR4 and More
BarKlip BK150 (1) BarKlip BK500 (1) BergStak ExtremePort DDR5 SO-DIMM (1) BergStak Secure (1) Blockchain (1) Board-to-Board Connector (1) C2E (1) CCS (1) CTW Fan Module Connectors (1) Cable Management (1) Cabled Backplane (1) Circular Connectors (1) ComboStak and PowerStak (1) Computing (1) Conan Lite (1) Connectors (1) Cool Edge PCIe ...
5 Connector Features That Ensures Secure Mating - Amphenol CS
Secure mating is a crucial factor when it comes to connectors. Mating is the process of assembling a connector with the right counterpart. Depending on the size, shape, and application, there are different mating techniques, and the mating cycle of each connector has a lot to tell about its quality and durability.
All Products | Products | Amphenol
BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases ...
Understanding HVAC Systems | Heating, Ventilating and Air Conditioning ...
HVAC stands for heating, ventilating and air conditioning systems. Various HVAC systems are used for air conditioning homes to large industrial complexes, shopping malls, and apartment blocks.
D-Sub Interconnects - Still Going Strong!
The D-Subminiature (D-Sub) interconnect system made its debut over 70-years ago in 1952 and while many technologies of the era have long since been retired, the d-sub continues to show its relevance today as one of the world’s most adaptable and reliable I/O platforms.
Zhaga Book 18 FLS Series for Outdoor Smart Lighting - Amphenol CS
Zhaga Consortium is a leader in the lighting industry that defines standards for lighting solutions to meet the trends like smart lighting, and create inter-operable components so that they can be serviced, replaced, or upgraded with improvements in technology.
Amphenol Communications Solutions releases Internal High-Speed Link ...
Amphenol Communications Solutions releases Internal High-Speed Link Input Output Connectors Performing to PCI-SIG Gen 6 Specifications - Designed for Next Generation Enterprise Server Equipment
Amphenol New Product Updates – March 2021
The FLB series cover couples with the base to provide IP66 protection (per IEC 60529) for the mated photocell/control assembly. Domes are available in Grey, Clear, Red, Black, White and Translucent colors in 35mm, 50mm, 60mm, 75mm, 100mm & 130mm heights. The mating gaskets and O-rings on the bases ensure IP66 rating performance to protect equipment from moisture ingress.
The 2021 Optical Fiber Communication Conference and Exhibition (OFC ...
Amphenol will be exhibiting at OFC as they host global visionaries and technology innovators in an interactive, all-virtual format this year. With a focus on telecom and data center optics, there will be technical sessions and a virtual exhibition featuring industry-focused programs, with both live and on-demand content.
cLGA- The Highly Adaptive Compression Solution - Amphenol CS
The cLGA Land Grid Array socket system is a low cost, high signal integrity, and high reliability offering from the Amphenol ICC family to bring conventional connector material construction to high-performance chip-to-board applications.
Amphenol product demonstrations at DesignCon 2023
DesignCon, the largest event for Chip, Board, and Systems Design Engineers, is a three-day engineering event showcasing advanced designs, modern technology updates, and unparalleled networking opportunities for high-speed communications and semiconductor communities.
Millipacs®- Cost-effective upgrade solution for Data Rates up to 25Gb/s
Millipacs ® 2.00mm Hard Metric (HM) backplane connectors were launched during the 1990s when most of the applications required few hundreds of Gigabit data rates.. With special signal pinning and adequate provision of ground pins, data rate enhancement up to 3Gb/s was possible. Due to the need for improved signal integrity and higher bandwidth, Telecom and Data markets demanded connectors ...
48v connector power | Amphenol Global Search | Amphenol
OCP 48V BarKlip ® BK500 and BK150 are the latest additions to the Busbar family. These power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards and OCP 48V BarKlip ® BK500 provides a convenient method of distributing up to 500A per contact between busbars, cables, and circuit boards.
The Evolution of PCI Express® - Amphenol CS
Earlier in 2019, PCIe® introduced its latest version, PCIe® 5.0, with 32GT/s transfer rate and 30Gb/s throughput per lane. It also has improved signal integrity and is backward-compatible with CEM connectors for add-in cards.
Cool Edge – High Speed & High Power Card Edge - Amphenol CS
Come see our latest Storage & Server Interconnect Solutions on Flash Memory Summit 2018 at booth #600, Santa Clara Convention Center from 7to 9 August.
IT Datacom | Markets | Amphenol
BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact ...
Automotive | Markets | Amphenol
BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables, and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire & contact increases ...
Visit Amphenol at DesignCon 2020 | Booth #731 | 28 - 30 January 2020
Amphenol will be highlighting five innovative product demonstrations this year, including 56G OverPass™, 112G Mini Cool Edge, and 56GB compliance through co-planar Lynx™ QD. Come visit us at booth #731.
Enter the Automotive Ethernet Era - Amphenol CS
BarKlip BK150 (1) BarKlip BK500 (1) BergStak ExtremePort DDR5 SO-DIMM (1) BergStak Secure (1) Blockchain (1) Board-to-Board Connector (1) C2E (1) CCS (1) CTW Fan Module Connectors (1) Cable Management (1) Cabled Backplane (1) Circular Connectors (1) ComboStak and PowerStak (1) Computing (1) Conan Lite (1) Connectors (1) Cool Edge PCIe ...