Search Results for barklip

BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases ...

InfiniBand stands tall as a stalwart in the realm of high speed computing interconnect solutions. With its high bandwidth, low latency, and support for multiple topologies, InfiniBand is a go-to choice for clusters handling intensive computational tasks.

The FlexFast™ Flex-to-Board connector has a compact design that meets the increasing demands for flex-to-board solutions in automotive applications. It is compliant with USCAR T3V2 and LV-214 S1 specifications and features gold-plated terminals to reduce mating force. The connector has a low mating and un-mating force, a maximum height of 8.0mm, and is space-saving.

Amphenol contributes high-performance interconnects for OCP-specified server components, including acceleration modules, system security, and control modules, and I/O board NICs.

Amphenol Communications Solutions Pioneers Innovation: Launches Two Made-in-India Tech Solutions at Bharat Mobility Global Expo 2025 Jan 22, 2025

BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases ...

BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases ...

The BarKlip ® BK300 connector features 14 independent conducting beams that maintain contact with the mating busbar in common misaligned positions with low resistance.

Amphenol Communications Solutions Pioneers Innovation: Launches Two Made-in-India Tech Solutions at Bharat Mobility Global Expo 2025 Jan 22, 2025

The invention of modular jacks is considered to be a significant event in the history of communications connectors. Originally introduced in the 1970’s, modular jacks were first used to facilitate the growing complexity of telephone systems in North America. Prior to the arrival of modular jacks, te

Amphenol’s OSFP product portfolio offers customers a comprehensive and integrated link solution that features DAC copper cables, AOCs, stacked and ganged board connector and cage solutions.

Amphenol's BarKlip XP connectors feature independent points of contacts that provide overall lower resistance and greater overall efficiency. BarKlip XP series is capable of distributing anywhere from 150 to 1000A of power to busbar power distribution

ms3108e32-17p | Amphenol Global Search | Amphenol applicable housing pn: 10129443-* ,10128858-*, 10128887-*. part number description plating dim a1 dim b1 dim c1 dim a2 dim b2 dim c2 dim m dim p dim h dim l dim n 10135689-091102lf formed 10-12awg mfbl contact gxt 2.80 5.60 6.3 4.20 7.30 7.40 25.9 14.7 4.0 10.6 2.5

Types of Power Cables at Amphenol OCP ORv3 AC Input Connector and Cable Assemblies. Created in accordance with the OCP's (Open Compute Project) V3 Universal Input power distribution architecture standards, Amphenol’s AC input cable assemblies are a convenient solution to channel power from the grid to the power shelf inside of a V3 rack.

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets.

High-performance data center and AI workloads are power-intensive, outpacing efficiency improvements in air-cooling technology.

Furthermore, the BarKlip ® BK 220 Nano, a new variant to the BarKlip ® series will also be on showcase. Amphenol will also present the OCP ORv3 AC Input Connector and Cable Assemblies , designed to meet OCP’s V3 Universal Input power distribution architecture standards, providing a convenient method of routing power directly from the busway ...

Data and its associated storage are fundamental to any computing application, ranging from notebooks and laptops to sophisticated servers and data centers.

OCP 48V BarKlip ® BK500. OCP 48V BarKlip ® BK500 and BK150 are the latest additions to the Busbar family. These power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards and OCP 48V BarKlip ® BK500 provides a convenient method of distributing up to 500A per contact between busbars, cables, and circuit boards.

Amphenol's BarKlip XP connectors feature independent points of contacts that provide overall lower resistance and greater overall efficiency. BarKlip XP series is capable of distributing anywhere from 150 to 1000A of power to busbar power distribution