Search Results for barklip

San Jose, CA, USA – Amphenol ICC, the global leader in connector technology, design and manufacturing, and eTopus Technology, a pioneer of ultra-high-speed ADC/DSP-based SerDes for wireline applications including data center, cloud, edge, and 5G base stations, today announced the development of a 112Gb/s interconnect technology built on their products.

BarKlip BK150 (1) BarKlip BK500 (1) BergStak ExtremePort DDR5 SO-DIMM (1) BergStak Secure (1) Blockchain (1) Board-to-Board Connector (1) C2E (1) CCS (1) CTW Fan Module Connectors (1) Cable Management (1) Cabled Backplane (1) Circular Connectors (1) ComboStak and PowerStak (1) Computing (1) Conan Lite (1) Connectors (1) Cool Edge PCIe ...

BarKlip BK150 (1) BarKlip BK500 (1) BergStak ExtremePort DDR5 SO-DIMM (1) BergStak Secure (1) Blockchain (1) Board-to-Board Connector (1) C2E (1) CCS (1) CTW Fan Module Connectors (1) Cable Management (1) Cabled Backplane (1) Circular Connectors (1) ComboStak and PowerStak (1) Computing (1) Conan Lite (1) Connectors (1) Cool Edge PCIe ...

Amphenol is introducing its new Minitek® TPA connectors, which is enhanced with Terminal Position Assurance (TPA) features, making it a great choice for consumer applications, that require electrical continuity and safeguards against any issues caused by improper assembly.

Amphenol ICC Extends USB Portfolio with IP68 rated USB4™ Gen 3 Type-C® Connector; High Speed, Multi-protocol, Waterproof, Dustproof USB Solution for Next Generation Consumer Electronics Designs

BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases ...

BarKlip BK150 (1) BarKlip BK500 (1) BergStak ExtremePort DDR5 SO-DIMM (1) BergStak Secure (1) Blockchain (1) Board-to-Board Connector (1) C2E (1) CCS (1) CTW Fan Module Connectors (1) Cable Management (1) Cabled Backplane (1) Circular Connectors (1) ComboStak and PowerStak (1) Computing (1) Conan Lite (1) Connectors (1) Cool Edge PCIe ...

Amphenol’s Mini Cool Edge IO connectors are internal high-speed OverPass™ connectors that allow high-speed signal transmission in Data Centers, Network Routings, and 5G Telecommunications. These connectors offer more advanced and powerful features over the existing interconnect solutions.

Amphenol offers an array of high speed interconnect solutions, suitable for next generation speed and density requirements. Our extensive portfolio includes high speed backplane connectors, copper cable assemblies, loopback modules, OverPass ™ solutions, optical transceivers and more. Here is a quick review of some of our newest products.

Thermalized low noise cryogenic attenuators mate seamlessly with Amphenol Ardent Concepts TR Multicoax TM connectors. Hampton, New Hampshire . Amphenol Ardent Concepts, a leading supplier of ganged coaxial connectors for use in cryogenic environments, has released high-density Ganged Coaxial Attenuators for use in-line with the TR Multicoax TM series to support the many unique challenges of ...

BarKlip BK150 (1) BarKlip BK500 (1) BergStak ExtremePort DDR5 SO-DIMM (1) BergStak Secure (1) Blockchain (1) Board-to-Board Connector (1) C2E (1) CCS (1) CTW Fan Module Connectors (1) Cable Management (1) Cabled Backplane (1) Circular Connectors (1) ComboStak and PowerStak (1) Computing (1) Conan Lite (1) Connectors (1) Cool Edge PCIe ...

BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases ...

BarKlip BK150 (1) BarKlip BK500 (1) BergStak ExtremePort DDR5 SO-DIMM (1) BergStak Secure (1) Blockchain (1) Board-to-Board Connector (1) C2E (1) CCS (1) CTW Fan Module Connectors (1) Cable Management (1) Cabled Backplane (1) Circular Connectors (1) ComboStak and PowerStak (1) Computing (1) Conan Lite (1) Connectors (1) Cool Edge PCIe ...

BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases ...

A new application with advanced features using cutting edge technology is being introduced to the market every other day. This, in turn is mounting the requirement of high speed high reliable connector solutions. PCI Express (PCIe®) is a popular standard for various applications from small, mobile

Everything under computing undergoes rapid innovation to meet the demand of both speed- and performance-hungry technologies. High–speed Solid State Drives (SSDs) meeting the most modern and advanced memory standards are already in use.

Amphenol ICC’s OverPass ™ cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface. The system transfers high-speed signals to twinax cables shortly after they are launched from the chip and delivers a direct link to the external port when compared ...

BarKlip® XP series is capable of distributing anywhere from 150 to 1000A of power to busbar power distribution applications. Amphenol Communications Solutions Barrier Terminal Block In structure, they comprise panel feed-through type, baffle type, and pluggable type, and can connect all kinds of conducting wires whose cross-sections are 0 ...

Serial Attached SCSI (SAS) connectors are one of the most popular interconnects available in the enterprise storage industry today. These Small Form Factor (SFF) standard connectors support high performance and differential signaling.

Amphenol ICC’s solutions meet or exceed data center convergence expectations. HCI’s non-volatile memory specs call for connectors like U.3 based out of SFF-TA-1001 and Mini Cool Edge based out of SFF-TA-1002 standards.