Search Results for barklip

Automotive Industry Standards are standards that define the connector requirements in terms of temperature, vibration, sealing and many other characteristics in an automobile application.

Amphenol contributes high-performance interconnects for OCP-specified server components, including acceleration modules, system security, and control modules, and I/O board NICs.

The PCI-SIG is making waves with its latest offering in computing standards with the PCI Express ® Gen 7.0 which specifies a data rate of 128 GT/s. This is double of the previous PCI Express ® Gen 6 which had a data rate of 64 GT/s. PCIe ® Gen 7.0 utilizes PAM4 (Pulse Amplitude Modulation with 4 levels) signaling, the same as Gen 6.0 to achieve the high data rates.

BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables, and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire & contact increases ...

Amphenol Communications Solutions Pioneers Innovation: Launches Two Made-in-India Tech Solutions at Bharat Mobility Global Expo 2025 Jan 22, 2025

Amphenol will showcase its innovative interconnect solutions at SPS 2024 in Nuremberg (Nov 12-14). Visit us at Hall 10, Booth 210 to explore our wide range of products designed to enhance automation and connectivity in various industries.

OCP ORv3 48V BarKlip ® BK500 IO. OCP ORv3 48V BarKlip ® BK150 IO. OCP AC Input Connectors & Cable Assemblies. Multi-Trak™ to Direct Attach CEM assembly. ExaMAX2 ® OSFP OverPass™ Experience Center. Amphenol will participate in the OCP Summit Experience Center.

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets.

BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases ...

BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact ...

The D-Subminiature (D-Sub) interconnect system made its debut over 70-years ago in 1952 and while many technologies of the era have long since been retired, the d-sub continues to show its relevance today as one of the world’s most adaptable and reliable I/O platforms.

BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables, and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire & contact increases ...

Amphenol Communications Solutions Pioneers Innovation: Launches Two Made-in-India Tech Solutions at Bharat Mobility Global Expo 2025 Jan 22, 2025

The FlexFast™ Flex-to-Board connector has a compact design that meets the increasing demands for flex-to-board solutions in automotive applications. It is compliant with USCAR T3V2 and LV-214 S1 specifications and features gold-plated terminals to reduce mating force. The connector has a low mating and un-mating force, a maximum height of 8.0mm, and is space-saving.

Data and its associated storage are fundamental to any computing application, ranging from notebooks and laptops to sophisticated servers and data centers.

USB 3.2 Gen 1 (5Gb/s), USB 3.2 Gen 2 (10Gb/s), USB 3.2 Gen 2x2 (20Gb/s), USB Type C compliant, high-speed solution. USB 3.2 high-speed Type C is a standard interface that is expected to spread to a wide variety of devices in the consumer, industrial, and automotive markets.

The BarKlip ® BK150, a power solution busbar connector, features 10 independent points of contact with low resistance and high reliability. JavaScript seems to be disabled in your browser. For the best experience on our site, be sure to turn on Javascript in your browser.

The EDSFF 2-piece cable solution supports data rates of up to PCIe ® 5.0 at 32Gb/s. It utilizes the EDSFF standard interface Mini Cool Edge 1C/2C connectors on one cable end, offering flexibility in connector form factor selection such as MCIO, Multi-Trak ™, Backplane connectors, and more on the other end.. Ideal for high-speed computing data center server systems, this solution eliminates ...

BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases ...

The quest for speed, reliability, and innovation is relentless in the ever-evolving landscape of connectivity solutions. As industries race toward the future, the demand for high-speed interconnects capable of handling the data deluge becomes more pressing.