Search Results for baseband chipset
5G Applications | Baseband Unit - Amphenol CS
Amphenol offers interconnect solutions ranging from high speed input output connectors, high speed cable assemblies, rugged connectors to power connectors and more for designing efficient functioning baseband units.
5G Networks
Amphenol ofers interconnect solutions ranging from high-speed I/O connectors and cable assemblies, harsh environment connectors to power connectors and more for designing eficient functioning baseband units.
PwrBlade® MiniMezz for 5G New Radio - Amphenol CS
What is 5G NR or New Radio? The New Radio interface and radio access network known as 5G NR is capable of delivering a significantly faster and more responsive mobile broadband experience in terms of power usage and spectrum.
10-Gigabit Ethernet Backbone Interface Options: Which One Should I ...
To mitigate the problems associated with bandwidth and ANEXT, Category-6a Cables utilize three principles: Pair Separation, Shielding and Tight Tolerance. Pair separation involves placing a plastic x-shaped insulator in the middle of the cable itself.
RF Antenna Embedded Wi-Fi/BT/BLE Chip 2400-2500MHz
Compliant with Exemption 6C - View Certificate. Additional compliance information is available in our Compliance Center.
PCIe ® Gen 6 High Speed Interconnect Solutions - Amphenol CS
Amphenol introduces to the market the next generation interconnect solution – ExtremePort™ Swift is a 0.60mm pitch, extremely low-profile connector capable of transmitting high-speed signal up to PCIe ® Gen 5 and target for PCIe ® Gen 6 under extreme mechanical condition.
Mini Cool Edge 0.60mm Connectors | GenZ, EDSFF, OCP NIC 3.0, SFF-TA ...
MEETS SFF-TA-1002, GEN Z, EDSFF, OCP NIC 3.0 AND PCIE® ENCLOSURE COMPATIBLE FORM FACTOR (PECFF) SPECIFICATION. Mini Cool Edge is a 0.60mm high density, high speed card edge connector for new generation small form factor system.
Connectors and Cages - High Speed Input Output - Amphenol CS
Amphenol's CFP4 series offers a 56 position, 0.6mm pitch connector and is used in multi-hundred Gb/s... DETAILS. Amphenol's ExpressPort ® QSFP+ interconnect system is comprised of a 38 position 0.8mm... DETAILS. Have any questions? Talk with us directly using LiveChat.
Open Compute Project Solutions - Amphenol CS
Amphenol offers a comprehensive portfolio of plug-and-play interconnects ranging from 50A to 1000A catering to Open Rack ORv2 and ORv3 specifications, to empower businesses to achieve cost savings, seamless implementation, and enhanced energy efficiency.
ExtremePort Z-Link Connector - Amphenol CS
Baseband Commercial Systems; Networking; Radio Units. High-end Computing System Server and Storage Systems. TECHNICAL INFORMATION; OverPass ™ Applications; Miplane to Motherboard Chip to Chip; Backplane to MB; Backplane to add in card; Chip. Chip. Chip. Chip. Chip to External IO; Cable solution; Cable solution; Supports Card Connection ...
Board to Board | High Speed Backplane - Amphenol CS
Amphenol-BSI provides a set of resources, capabilities & tools that are unique in the backplane industry. They can support development programs early in the system concept / simulation stage, at mechanical and signal layout, and later provide DFM / DFT feedback on full turnkey design to Backplane assembly and test.
OverPass™ Internal High Speed Interconnect - Amphenol CS
Bypass lossy board traces when transmitting signals in next generation board-to-board, system-to-system, or chip-to-chip applications requiring high bandwidths; Supports data rates up to 112Gb/s+ with low resonance and VSWR
Leading the Evolution of High-Speed Interconnect -DesignCon 2025
DesignCon 2025 is a premier event focused on high-speed communications and system design. It is a must-attend event for chip, board, and systems design engineers to network, source, and stay ahead of industry change. At Booth 833, attendees can interact with our experts and explore these demos:
Mini Cool Edge IO Connectors for 5g and Datacenters - Amphenol CS
Mini Cool Edge IO connectors find applications in High-end Computing Systems, Server, and Storage Systems. These connectors are also used as an integral part of the internal mechanism of the BBU (Baseband Units) of 5G networks. Click here to read more on Amphenol’s Mini Cool Edge IO connectors.
224G High-Speed Solutions - Amphenol CS
High speed, low profile and high density (bandwidth / mm 2) near chip and on package solutions, the successor to our microLinkOVER™ and DensiLink™ Solutions available at 28G, 56G, 112G and 224G signaling speeds
Check Out the Latest Server Connectors at DesignCon 2020 - Amphenol CS
DesignCon being the largest chip, board, and systems event in the industry witnesses the launch of many innovative products. Amphenol ICC will be is launching three high-speed server connectors at DesignCon 2020: Right Angle PCIe ® Gen 4 CEM connectors, Gen Z 4C-HP Mini Cool Edge connectors and Double Density Cool Edge connectors.
ExtremePort Flash | High Speed IO | Amphenol
NEXT-GENERATION NEAR CHIP HIGH SPEED SOLUTION - UP TO 56G PAM4. Amphenol introduces the next-generation OverPass™ solution - ExtremePort™ Flash.
High Bandwidth Connectors for New Technologies - Amphenol CS
Smart applications and intelligent environments abound with high bandwidth connectors. From 56G to 112G to 224G, the connector industry strives to meet the challenges put forth by new technologies every day.
OverPass™ Interconnects – Your high speed , Low Loss Chip-to-Module ...
Amphenol ICC offers a wide selection of high-speed external interfaces including SFP, QSFP, QSFP DD, OSFP, mini-SAS HD, cabled backplane interfaces such as ExaMAX ® and Paladin ® along with providing an extensive range of internal near chip interfaces like low profile SlimSAS and Mini Cool Edge IO.
cLGA- The Highly Adaptive Compression Solution - Amphenol CS
The cLGA Land Grid Array socket system is a low cost, high signal integrity, and high reliability offering from the Amphenol ICC family to bring conventional connector material construction to high-performance chip-to-board applications.