Search Results for bk500

Amphenol is excited to invite you to the 30 th DesignCon, a premier event in the tech industry that will take place from January 28 th to 30 th, 2025, at the Santa Clara Convention Center in California.. DesignCon 2025 is a premier event focused on high-speed communications and system design. It is a must-attend event for chip, board, and systems design engineers to network, source, and stay ...

Many industries look for rugged connector solutions that can withstand high temperatures and different climatic conditions with high durability. Amphenol ICC offers a wide range of harsh environment connectors for such application requirements.

PCIe ® (peripheral component interconnect express) is an interface standard for connecting high-speed components in a computer or server. Basically, it is how all major components inside a computer talk with each other. Those components include CPUs, GPUs, SSDs, Hard Drives, Sound Cards, and Wi-Fi Cards, among others.

In today's rapidly advancing technological landscape, innovation continues to redefine our interactions with devices and systems. Among these innovations, Amphenol's Autolock FFC/FPC (Flexible Flat Cable/Flexible Printed Circuit) connector stands out.

In addition to these styles, there are many other board termination styles, including Land Grid Array (LGA) and the patented Ball Grid Array (BGA) that find applications in high-speed mezzanine connectors like cLGA ®, cStack ™, M-Series ™, MEG-Array ®, and Chameleon ®.There are also wire termination styles that deal with how the wire is attached to the contacts of the connector ...

High-performance data center and AI workloads are power-intensive, outpacing efficiency improvements in air-cooling technology. Power requirements for AI model training are increasing to over 100kW per rack in some use cases, of which air-cooling fans alone account for up to 15% of server power cons

OCP 48V BarKlip® BK500 IO. Amphenol's OCP 48V compliant Barklip® BK500 power cable assemblies are designed to meet OCP V3 power distribution architecture standards and provide a convenient method of distributing up to 500A per contact between busbars, cables, and circuit boards.

Amphenol will be taking part in the prestigious Bharat Battery Show from January 19-21, 2025. This expo is a key segment of India's leading automotive global mobility show, Bharath Mobility Global Expo 2025.Amphenol will be making an impact with its industry-leading products from the E-mobility segment, particularly the 2/3-wheeler market.

Amphenol provides USB Type C that supports a variety of protocols such as USB2.0/3.0/3.1.The Lite version of USB 2.0 Type C connectors come with top and middle mount options in 16 pins.

The invention of modular jacks is considered to be a significant event in the history of communications connectors. Originally introduced in the 1970’s, modular jacks were first used to facilitate the growing complexity of telephone systems in North America. Prior to the arrival of modular jacks, te

PCIe® Gen 7.0 Doubles Data Rate to 128 GT/s For Data-Intensive Markets Feb 6, 2025

Amphenol offers the most comprehensive backplane connector and cable portfolio in the industry. With supporting speeds up to a staggering 224G and compatibility with PCIe ® Gen7, these innovative interconnects redefine the benchmarks of connectivity. Designed to excel in all high-speed applications, these connectors and cables optimize space utilization without compromising performance along ...

In addition to the rest of the features of BK500, BK150 also has new sense pin contacts that enable mate last-first break capability. Click here to learn more about Amphenol’s latest and legacy power connectors for high-performance applications.

The introduction of 224G PAM4 technology plays a pivotal role in the evolution of data center connectivity. With unprecedented speed, enhanced bandwidth, and robust system architecture, this Gigabit Ethernet solution is set to redefine the capabilities of data centers, enabling them to keep pace with the rapidly advancing landscape of AI and data-intensive applications.

The contact pin’s shape, design and retentions are indeed among the key considerations for choosing a connector. Let us discuss about some of the most common and cost-effective pin retention designs that affect the performance of any connector.

Part Number. PowerStak ®, Vertical Receptacle, 2pos, Height=3.7mm 10159561-200121RLF PowerStak ®, Vertical Header, 2pos, Height=4.3mm 10159560-200421RLF

PCIe® Gen 7.0 Doubles Data Rate to 128 GT/s For Data-Intensive Markets Feb 6, 2025

Amphenol as an industry leader in the advancement of connector technology is a part of various standards committees, and actively engages to promote evolving standards by contributing our designs. Our interconnects are compliant with major industry standards in their respective areas.

In this blog, we’ll break down and understand OSFP connectors, their features, benefits, and specifications. What is an OSFP? Octal Small Form-factor Pluggable (OSFP) is a pluggable form factor developed by the OSFP MSA group, which was launched by Google and led by Arista Networks.

The Solid State Drive (SSD) market is expected to grow rapidly in 2019. Amphenol ICC’s 68 position SAS/PCIe 4.0, connectors come with 16GT/s (PCIe lanes) and 24Gb/s (SAS lanes) speeds to meet the demands of next-generation servers.