Search Results for bk500

PCIe ® 6.0 Specififcations. Now PCI-SIG has announced its sixth generation, the PCIe ® 6.0, which is targeted to be released by 2021 and is designed to meet the evolving trends including Artificial Intelligence and Big Data. The new standards will be introduced with double the data rates i.e, it will take a leap to 64GT/s from the 32GT/s of PCIe ® 5.0.The earlier generation was following ...

Amphenol ICC’s BergStak ® family is known for its high speed and high signal integrity in a compact form factor. The portfolio of BergStak ® is now extended with the new BergStak ® 0.50mm connectors.These are 0.50mm fine pitch connectors with a unique self-alignment feature, making it easy to work by operators, especially for low stack height.

Amphenol offers an array of high speed interconnect solutions, suitable for next generation speed and density requirements. Our extensive portfolio includes high speed backplane connectors, copper cable assemblies, loopback modules, OverPass ™ solutions, optical transceivers and more. Here is a quick review of some of our newest products.

Amphenol Communications Solutions Pioneers Innovation: Launches Two Made-in-India Tech Solutions at Bharat Mobility Global Expo 2025 Jan 22, 2025

Amphenol Communications Solutions Pioneers Innovation: Launches Two Made-in-India Tech Solutions at Bharat Mobility Global Expo 2025 Jan 22, 2025

The FlexFast™ Flex-to-Board connector has a compact design that meets the increasing demands for flex-to-board solutions in automotive applications. It is compliant with USCAR T3V2 and LV-214 S1 specifications and features gold-plated terminals to reduce mating force. The connector has a low mating and un-mating force, a maximum height of 8.0mm, and is space-saving.

As the world converges at the Light + Building Trade Show in Frankfurt from 3 to 8 March 2024, Amphenol will be there showcasing its pioneering contributions to the lighting industry.Meet Amphenol at Hall #8, Booth #F46.

BarKlip® BK500 IO • Distributes up to 500A per contact • Simple configurable plug-and-play solutions • Fully compliant with ORv3 Power Output Specifications BarKlip® BK150 IO • Distributes up to 150A per contact between busbars, cables, and circuit boards • Simple configurable plug-and-play solutions • Fully compliant with ORv3 IT ...

The PCIe ® Gen 5 Flip CEM is a newly introduced vertical card edge connector that adheres to the PCIe ® standard mating interface. Its unique design features "JJ" or "LL" type contacts, resulting in a significant reduction of up to 19.5% in the keep-out area compared to traditional CEM connectors. Amphenol’s Flip CEM connectors can support bandwidths up to 32GT/s (Gen5) and can mate with ...

Pennsylvania, USA – Amphenol Communications Solutions is pleased to announce today, the release of its BarKlip ® BK500 IO and BarKlip ® BK150 IO busbar connectors. These high-current connectors are fully compliant with OCP ORv3 power output and IT gear specifications supporting 48V power rack architecture

Plug-and-Play Qi2 module to be available later this year. Shanghai, China and Chicago, IL – April 24, 2023 – Shanghai Amphenol Airwave Communication Electronics Co., Ltd, an operation within Amphenol Corporation (NYSE: APH) is bringing on NuCurrent, the global authority in wireless power systems, as a strategic IP partner.This partnership will address the urgent, industry-wide need for ...

ix Industrial™ (10-pin rectangular connector compliant with IEC 61076-3-124) is now added to the list of CC-Link IE TSN Specifications Pennsylvania, USA – Amphenol Communications Solutions is pleased to announce today that the CC-Link IE TSN Specification List for March 2023 will now include ix Industrial™ (10-pin rectangular connector compliant with IEC 61076-3-124).

The rapid acceleration of technology evolution can be seen in the disruptive products regularly entering the market today. Advanced datacenters, crypto currency mining, autonomous vehicles, deep learning, and artificial intelligence applications are upending their spaces.

Standards and specifications from various organizations provide a guideline to manufacturers in measuring the quality of their product. This helps to ensure end customers are purchasing a trustworthy and high performance product.

Amphenol Ardent Concepts is dedicated to leading the way in interconnectivity solutions within unique and challenging environments, including on your display.

Amphenol Power Solutions offer the largest range of connectors for power distribution in the market capable of supporting various application requirements from 10A to 1000A+.

In this blog, we’ll break down and understand OSFP connectors, their features, benefits, and specifications. What is an OSFP? Octal Small Form-factor Pluggable (OSFP) is a pluggable form factor developed by the OSFP MSA group, which was launched by Google and led by Arista Networks.

Industry 4.0, also called the 4 th industrial revolution, refers to the digital transformation of manufacturing; where humans, computers, and automation will come together and interact in entirely new ways.. The Industry 4.0 movement looks to re-shape the way factories are run today by converging autonomous machines and robotics with third platform technologies such as, Big Data/Analytics, the ...

Our high density, high speed Mini Cool Edge 0.60mm card edge connectors meet SFF-TA-1002, Gen Z, EDSFF and OCP NIC 3.0 specifications and are ideal for Solid State Drive, Network Interface Card, and Add-In Card.. Busbar Connectors. Apart from server and storage interconnects, Amphenol has a wide range of high power low resistance busbar connectors, ideally used in Datacenter applications.

With a speed twice as much as the industry standard, Paladin’s ® game-changing 112 Gb/s backplane interconnect technology sets the benchmark for signal integrity performance in backplane interconnects. It has no stub resonance from signal contacts and demonstrates a smooth linear transmission beyond 40GHz.