Search Results for cisco umbrella sig

The Open Compute Project (OCP) Global Summit is set to be a pivotal event for Amphenol, a leading global interconnect solutions provider. From October 17 th to 19 th, Amphenol will be at the San Jose Convention Center, unveiling an array of innovative products designed to revolutionize the world of data center connectivity.. Unveiling Next-Generation Solutions

In the ever-evolving landscape of robotics, the heartbeat of these autonomous systems lies within their power source – the battery. Much like in electric vehicles, the Battery Management System (BMS) emerges as a critical player, ensuring the efficient utilization of energy and the safeguarding of batteries against potential hazards.

The 2024 OCP Global Summit, scheduled for October 15-17 in San Jose, California, is poised to be a landmark event in the Open Compute community.Under the theme "From Ideas to Impact," the summit will bring together industry leaders, researchers, and innovators. It will be an engaging arena of dynamic discussions and workshops aimed at transforming theoretical concepts into practical solutions.

The PCIe ® Gen 5 Flip CEM is a newly introduced vertical card edge connector that adheres to the PCIe ® standard mating interface. Its unique design features "JJ" or "LL" type contacts, resulting in a significant reduction of up to 19.5% in the keep-out area compared to traditional CEM connectors. Amphenol’s Flip CEM connectors can support bandwidths up to 32GT/s (Gen5) and can mate with ...

The FlexFast™ Flex-to-Board connector has a compact design that meets the increasing demands for flex-to-board solutions in automotive applications. It is compliant with USCAR T3V2 and LV-214 S1 specifications and features gold-plated terminals to reduce mating force. The connector has a low mating and un-mating force, a maximum height of 8.0mm, and is space-saving.

Mini Cool Edge 0.60mm orthogonal connectors meet SFF-TA-1002, GEN Z, EDSFF, and OCP NIC 3.0 specification.

High-performance data center and AI workloads are power-intensive, outpacing efficiency improvements in air-cooling technology. Power requirements for AI model training are increasing to over 100kW per rack in some use cases, of which air-cooling fans alone account for up to 15% of server power cons

Minitek ® and BergStak ®. Amphenol's Minitek ® and BergStak ® series provide modular board-to-board connectors suitable for a wide range of applications, including medical wearables. These connectors offer various pitch options and stack heights, allowing flexible design configurations. With high-speed data transmission capabilities and reliable connectivity, they can benefit from portable ...

Optical fibers are being redefined with the continuous requirement for increased bandwidth. This evolution is showcased at the ECOC Exhibition. The European Conference on Optical Communication (ECOC) continues to be Europe's largest Optics event and one of the most esteemed events on optical communi

Amphenol is making its presence felt in the world of Artificial Intelligence and Machine Learning as it gets ready for the AI Hardware & Edge AI Summit 2024. It’s set to be a landmark event in the AI and machine learning (ML) calendar.

Energy storage has been a critical focus since electricity's inception, aiming to store power efficiently and regulate its use in accordance with demand. As we transition towards sustainable energy, the importance of short and long-term energy storage becomes paramount. Connected to renewable source

Amphenol ICC is launching the next generation high-speed ruggedized connectors for future industrial ethernet communication designs. We have collaborated with key interconnect technology partners Hirose Electric and Harting Technology Group to release the new ix Industrial ™ series of connectors. The IEC 61076-3-124 compliant ix Industrial ™ connectors are ideal for various applications in ...

PCI Express® GEN 5 Card Edge, Storage and Server Connector, Vertical, straddle mount, x16, 164 Positions, 1.00mm (0.039in) Pitch

PCIe® Gen 7.0 Doubles Data Rate to 128 GT/s For Data-Intensive Markets Feb 6, 2025

D-Sub in Data Communication and Consumer Applications. Amphenol offers a wide range of D-subminiature connectors in standard, high density and double density form factors especially in data communication sectors and consumer applications.From regular datacom devices like desktops, laptops, UPS and printers to routers, servers, base stations and Asymmetric Digital Subscriber Lanes (ASDL), you ...

Introduction of Cool Edge connectors is a revolutionary move by Amphenol ICC in data center engineering. The Cool Edge family started to expand with different pitches and higher performance with each new addition to the product series range.

Serial Attached SCSI (SAS) connectors are one of the most popular interconnects available in the enterprise storage industry today. These Small Form Factor (SFF) standard connectors support high performance and differential signaling.

With a speed twice as much as the industry standard, Paladin’s ® game-changing 112 Gb/s backplane interconnect technology sets the benchmark for signal integrity performance in backplane interconnects. It has no stub resonance from signal contacts and demonstrates a smooth linear transmission beyond 40GHz.

BergStak ® 0.80mm board-to-board connectors are an essential part of medical monitoring equipment, helping to realize space-saving and high-speed board-to-board connections between main boards and add-on boards. Featuring optional shielding to minimize EMI and meets the increasing trend to use BergStak on FPC cables for flexible connections to solve medical board design challenges.

Amphenol QSFP DD (Double Density) passive copper cable assemblies double the number of channels from 4 to 8 lanes when compared to the existing 100G QSFP cabling systems, enabling more bandwidth within the same mechanical envelope. Compatible with 25G/Lan