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Figure 3. 4. Place the plinth on the pad, aligning the mounting holes on the bottom of the plinth with the holes in the gasket and the concrete pad. Secure the plinth to the pad using the 1/2” -13 hex head bolts. Tighten all bolts securely. 5. Open the CUBE to allow access to mounting holes.

The following figure and tables give the general outline dimensions of the general purpose low profile load cells with optional tension base. ∅ Bottom Loading Load Cell Mounting ∅∅ Model Series Dimensions 1203/1403 1204/1404 1208/1408 1211/1411 (see Figure 1) (in) (mm) (in) (mm) (in) (mm) (in) (mm)

module (Figure 1). 1.2 Document Status This is a first printing document. 1.3 Equipment Function The 410-00 Transfer Relay is a plug-in printed circuit board module which provides three independently-operated relays. These relays may be used in a variety of applications, as explained in Application Guidelines.

3424 Walden Avenue, Depew, New York 14043-2495 Phone (716) 684-0003 Fax (716) 684-3823 Toll Free Line 1-800-959-4IMI Piezoelectric ICP® Accelerometers Operating Guide . General OPERATING GUIDE ... supply (as shown in Figure 2). The signal conditioner consists of a well-regulated 18 to 30 VDC source (battery or line-powered), a

3425 Walden Avenue Depew, NY 14043. Sensorline SM 716.684.0001. info@pcb.com +1 800-828-8840

Model K2004E01:Miniature shaker with integrated amplifier with BNC input, 4.5 lbf pk sine force, 0.2" pk-pk stroke, supports payloads to 2 lbs. Inclu

Figure 6 Backfill Levels Inside the Base 15 Install backfill soil, moisture barrier and pea gravel. Referring to Figure 6, alternately backfill the base, inside and outside, tamping the soil as it is added. The soil on the inside of the base should cover the second rib from the bottom. On the outside, the

condition of the connector system and the chamfer of the edge card. Please see figure 4 and table 3 for explanation. Figure 4 X Y X Y X Y 0.50 1.85 ± 0.125 1.00 2.35 ± 0.125 1.50 2.85 ± 0.125 Both Side are in Stationary Condition 0.15 ± 0.056 0.115 ± 0.07 Insertion Angle Allowance (Î) 1.60 ± 0.13 3 Connector Mating Condition One Side is in

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PCB工业监视和测量设备 - 中国RoHS2公布表 PCB Industrial Monitoring and Measuring Equipment - China RoHS 2 Disclosure Table 部件名称 铅 有害物质

PAD, and the other selects the –16dB XMT PAD. Refer to Figure 5 for the location of the 4201–00 options and the first four line circuit options of the 4202–00. Refer to Figure 6 for the option locations of circuits five and six of the 4202–00. Figure 5. 4201–00 And 4202–00 (Circuits One Through Four) Option Locations Figure 6.

Specifying the product performance, our expertise is to imagine and create the hardware solutions with cost effective architecture, find the components, optimize for manufacturing, reuse qualified blocks and prototype the new ones. We also manage external laboratories for qualifications and certifications on our products.

Figure 2. Critical semiconductor errors. [3] All these poten al errors can be induced by unwanted vibra on during manufacturing. Let’s examine one of the most cri cal manufacturing steps—lithography—and consider how vibra on might distort a chip layer patern. Figure 3. shows a schema c of a lithography machine. The wafers are loaded onto a

Recommended operating voltage to 600 VAC (RMS) at sea level; Complete environmental sealing includes interfacial seal and a triple-webbed grommet design

located on the rear panel, as is a connector for the optional line adapter/charger, See Figure 1 in the appendix. The P702BF-1 is identical to P702B, except that the frequency response of the P702BF-1 is specified as ... Research. A new set of 9 volt alkaline batteries are mounted in the unit. Typically, the batteries have an operational life ...

• New topic: About Time Variable Gain on page 39 • Installation Principles on page 68: added indications on roll angles according to tilt of doors. V3 07/06/18 • New troubleshooting topic: Sensor cannot connect in wireless connection on page 87 • Interference Check on page 78: more detailed information about Spectrum page. V4 11/30/18

To modernize your plant, revamping and debottlenecking (increasing capacity) restores competitiveness and allows your facility to fulfill demanding market requirements regardless of industry.Pinpointing and removing existing bottlenecks will help to achieve optimal results between your investment costs and plant output, thus increasing the quality, quantity and safety of your products.

3424 Walden Avenue, Depew, New York 14043-2495 Phone (716) 684-0003 Fax (716) 684-3823 Toll Free Line 1-800-959-4IMI Piezoelectric ICP® Accelerometers Operating Guide . General OPERATING GUIDE ... supply (as shown in Figure 2). The signal conditioner consists of a well-regulated 18 to 30 VDC source (battery or line-powered), a

on the screen (Figures 8, 9, 10 and 11 below). Figure 8: New Hardware Found – USB Serial Converter Figure 9: New Hardware Found -- USB Serial Port Figure 10: New Hardware Found – Iterated Serial Port Figure 11: New Hardware Found ― Ready to Use The iterated communications port balloon shown in Figure 10 above may or may not be displayed.

AHDP04-18-08PR-WTA 8 Position Receptacle, Pin, Shell Size 18, Reduced Diameter Seal (Blue), Wide Thread Adapter. Comparable to PN# HDP24-18-8PE-L024