Search Results for cswa full form

Jan. 16, 2025 . The U.S. Air Force has authorized the F-15’s new electronic warfare system, the Eagle Passive Active Warning Survivability System (EPAWSS), for full-rate production, awarding a contract valued at nearly $616 million to Boeing.

Feb. 12, 2025 . Anduril Industries announced on Feb. 11 it will assume control over Microsoft's $22 billion contract to develop and produce the U.S. Army's Integrated Visual Augmentation System (IVAS).

The available detent systems, full, limited, and smooth bore, provide respective levels of engagement/disengagement forces. This family of interconnects addresses small package design needs. It can be utilized as a highly shielded interconnect for high data rate applications or in a board-to-board system using a floating bullet adapter.

Advanced Automotive Electronics is taking the automobile industry to the next level with vehicles rich in features like ADAS, Autonomous Driving, Intelligent Navigation, and Infotainment. Aiming for a greener and eco-friendly ride Electric Vehicles are also on trend.

The SwitchBlox Industrial is a small form factor 5 port 10/100Mbps (10BASE-T/100BASE-TX) Layer 2 unmanaged and lightly managed ethernet switch. Rugged SOM Rugged SOM is an ultra-compact embedded computer module for managed switch functionality and multicast in harsh environments. The Puck ...

The OCP NIC 3.0 specification covers cards of three form factors: Small Form Factor (SFF), Tall Small Form Factor (TSFF), and Large Form Factor (LFF). ... (HPM) optimized to fit the full width of a standard EIA-310 D rack-mountable server. While the design can be used outside of the EIA-310 Rack, it serves as a common template for its intended ...

Amphenol Optical Transceivers are rugged, small form factor devices designed for lightning-fast data transmission and reception in fiber optic systems. Engineered to excel in harsh environments, they are the go-to choice for high-speed, mission-critical applications. QEPT-25G

DirectAttaced™ CEM connector on one end of the cable allows the flexibility of a different connection on the other end of the cable, accommodating different PCB form factors such as MCIO, Multi-trak™, SlimSAS™, EDSFF, OCP NIC 3.0, Gen Z, or Backplane connectors.

CLASSIC HPCE® WITH ENHANCED PERFORMANCE eHPCE® connector offers a 15% increase in power density with the same footprint as classic HPCE®. The all-new power contact design offers lower contact resistance and higher current carrying capacity compared to classic HPCE® connectors. eHPCE® connectors are designed to extend the life of power supplies using card edge output power connectors.

0.5GB/S MICRO FORM-FACTOR CONSUMER INTERFACE FCI Basics Micro USB 2.0 connectors deliver a data transfer... DETAILS. D-Sub Standard Board Mount Connectors ... PERIPHERAL I/O CONNECTORS WITH FULL AND MIXED POWER CONTACTS Amphenol's D-Sub Power Board-Mount Connectors...

Contact Form. Mon-Thu 8 am - 4.30 pm Fri 8 am - 3 pm 919 460 8800. Mon-Fri 8:30 – 5:00 ET [email protected] 905 790 2200. M-F 8:30 – 4:30 ET [email protected] +49 2941 765-0 ... Enter full part number to target results. (ex: 242A24180X, 3W3C) If you do not obtain the desired results, try searching again by omitting the suffix and searching ...

SATA (Serial ATA connector) is one of the first interfaces adopted for an SSD. SATA SSDs come in 2.5-inch and 3.5-inch box-shaped form factors and have bandwidth up to 6GT/s. These are considered as the first form of enterprise SSDs and are less expensive compared to its counterparts.

Amphenol Aerospace's Quality Standards. Quality Standards. Amphenol Aerospace Quality Policy: "To satisfy the expectations and requirements of our customers by utilizing industry-leading practices in continuous improvement, automation and compliance to statutory and regulatory requirements."

The secure fit between the connector and the PCB edge ensures optimal RF performance throughout the connector's full frequency range. ... SIMTac08 modules are designed to receive 1 MT Ferrule packaged within a Size 8 Quadrax contact form factor. 2 versions are available: EN4165/M38999 cavities & Arinc 600 cavities. For boot or sealed sleeve. ...

Search Results for c10 -779621-0001 - Amphenol. Search Results for c10. Our wide array of electrical and electronic connectors come in multiple form factors and are designed to meet the latest market needs including high power, high speeds, size and weight reduction, EMI shielding, hermeticity, high pressure and improved board retention.

Amphenol’s full range of RF switches come in straight and right-angle mountings as well as miniature, low-profile, and lightweight versions for different phone design requirements. ... Newly designed into an even smaller form factor, these connectors feature our high frequency SMPS interface and deliver reliable performance up to 65 GHz.

Our wide array of electrical and electronic connectors come in multiple form factors and are designed to meet the latest market needs including high power, high speeds, size and weight reduction, EMI shielding, hermeticity, high pressure and improved board retention. ... Amphenol RF offers a full range of connector accessories designed for ...

0.5GB/S MICRO FORM-FACTOR CONSUMER INTERFACE FCI Basics Micro USB 2.0 connectors deliver a data transfer rate up to 480Mb/s and are characterized by their... VIEW PRODUCT ... MEMORY CARD CONNECTORS FOR FULL SIZE SMART CARD FCI Basics Smart Card connectors are 8- or 16-pin connectors primarily used as full-size smart card readers.... VIEW PRODUCT.

is a very small form factor Ethernet Switch designed for the harshest applications, which can operate from -50°C to 110°C. It runs from a wide input voltage range of 5 to 60V, features PoE injection onboard, and houses a microcontroller for custom firmware upload. The board is stackable so that two boards can be combined to create a 10 port ...

i.e. Report Full Material Composition Declaration (FMD) using our E-3467 form. Report bannedrestricted and reportable substances using , our E-3702 form for products/components/raw materials and E-3742 form for packaging materials. Third party analytical laboratory test report for the six banned substances in EU and China RoHS (lead,