Search Results for flex lock

Memory modules can be defined as PCBs mounted with integrated-circuit-based memory. These are used in various computing applications ranging from notebooks and laptops to servers and data center. Memory module standards have evolved over generations to meet the growing demands of high-speed, data-hungry applications. Unlike earlier days when memory modules were designed specifically to meet ...

Throughout 2023, we actively participated in various events. Some of them include Smart Production Solutions, Open Compute Project US Summit, European Conference on Optical Communications, electronica India, 2nd Nepcon Japan, AI Hardware Summit, and many more.

In addition to the above-mentioned automotive connectors, we offer high-speed flex connectors in various pitch sizes, waterproof USB connectors, advanced Type C Gen 3 USB connectors, and memory and media connectors like the 2.70mm ultra-thin Micro SD and SD card sockets .

Amphenol ICC is First to Tool Up Production of PCIe ® M.2 Gen5 Connectors. Singapore – Amphenol ICC is pleased to announce today, the release of its PCIe ® M.2 Gen5 connectors. These connectors perform to PCI-SIG PCIe ® M.2 5.0 specifications supporting higher data rates up to 32Gb/s and it provides 67 gold plated contacts on 0.50mm pitch. With various connector height and keying options ...

Technology is always under constant update. New interfaces and protocols are being introduced to meet the dynamic changes across various markets and industries. Let us explore how we see this happening in industrial settings equipped with modern communication connectivity.

The stage is set, and Amphenol is all geared up to showcase its trailblazing technologies at Electronica India 2023, to be held from September 13 th to 15 th in Bangalore, India.This premier event promises to be an exhilarating showcase of the latest advancements in the electronics industry, and you can catch us in Hall 5 – Booth #EE91.. Unveiling India Manufacturing Capabilities:

The invention of modular jacks is considered to be a significant event in the history of communications connectors. Originally introduced in the 1970’s, modular jacks were first used to facilitate the growing complexity of telephone systems in North America. Prior to the arrival of modular jacks, te

FlexLock™ 3.20mm / 2.54mm • FPC system for easy assembly • USCAR-T2V2, LV-214 S3 compliant. • 2A per contact, TPA, CPA features. WireLock ® 1.80mm • Robust, low mating force. • USCAR-T2V2, LV-214 S3 compliant. • 2A per contact, TPA, CPA features. FlexFast™ Flex to Board . Connector Solution • Small size and low height flex to ...

FlexLock™ 3.20mm / 2.54mm • Easier assembly, less weight, lower cost • USCAR-T2V2 LV-214 S3 specifications • 3A per contact, TPA and CPA Minitek® Pwr Connector and Cable Assembly • Wire-to-wire and wire-to-board solutions • Current rating from 5A to 25A • Available in pitch sizes of 3.00mm, 4.20mm, and 5.70mm

Industry 4.0 and IIoT (Industrial Internet of Things) is enabling a shift from a hierarchical factory and process automation control model to a decentralized, fully IP addressable network like the Cloud to the factory floor.

TR Multicoax Equal Trace delivers superior signal integrity from multiple high speed channels in an arc footprint. This is an ideal solution for applications where equal and short trace lengths are imperative for performance tuning.

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Data usage is increasing every year, and the communications industry is working diligently to support the increased demand. This article discusses why we need more data, what data center physical layer architecture changes are needed to support higher data rates, and how Amphenol is well positioned

In addressing the specific needs of outdoor lighting applications, Amphenol introduces the FLA Series ANSI C 136.10/41 NEMA Receptacles & Caps and the FLB Series ANSI C 136.10/41 NEMA Bases & Domes. Engineered for ruggedness and durability, these connectors meet stringent industry standards, providing reliable connectivity in harsh outdoor environments.

As the electric vehicle market continues to grow, the importance of the battery pack and its component parts cannot be overstated. At the heart of the battery pack is the cell connection system (CCS), which plays a critical role in ensuring the reliable performance and longevity of the battery.

The D-Subminiature (D-Sub) interconnect system made its debut over 70-years ago in 1952 and while many technologies of the era have long since been retired, the d-sub continues to show its relevance today as one of the world’s most adaptable and reliable I/O platforms.

Come Join us at OFC Booth #2513 from 26th – 28th March 2024 at San Diego Convention Center, San Diego, California to experience these live demonstrations and to explore our extensive portfolio of advanced interconnects.

DesignCon, the largest event for Chip, Board, and Systems Design Engineers, brings together the brightest talents across the world. This premier gathering has the legacy of more than two decades in solving the signal and power integrity challenges and creating innovative design solutions for tomorrow.

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Come visit us at OCP CHINA DAY, Booth #B09 at the Beijing Kerry Hotel, on August 10th, 2022. Please use our special invite code “AMPHENOL” to register for the conference.