Search Results for fpc

Amphenol is one of the leading manufacturers of HPCE® HIGH POWER CARD EDGE CONNECTOR. Contact us today for more details of HPCE®, part number 101269330808204ALF.

Amphenol design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, networking, industrial, business equipment, and automotive.

Amphenol provides high speed, high reliability Active optical cables and transceivers supporting advanced applications.

ix Industrial™ connectors enable IoT connectivity for Ethernet and other Industrial protocols through all levels of an operation from the Enterprise/Cloud to the sensors/actuators on the factory floor. ix Mag Series connectors offer CAT6A performanc

Amphenol is one of the leading manufacturers of 0.80mm Board to Board/Wire Connectors. Contact us today for more details of BergStak ® , part number 61083-061402LF.

Amphenol harsh environment connectors are designed to meet a wide range of requirements in numerous market segments like Industrial, Telecommunication, Datacom, Medical, Energy, Transportation, Military, Aerospace, and Consumer.

Amphenol offers an array of high speed interconnect solutions, suitable for next generation speed and density requirements. Our extensive portfolio includes high speed backplane connectors, copper cable assemblies, loopback modules, OverPass ™ solutions, optical transceivers and more. Here is a quick review of some of our newest products.

Leap OPT Socket Assembly, 15x15, 225 pin, Lead Free Solder Balls

Amphenol's ExtremePort™ OSFP 224G interconnect system is comprised of a 60 position, 0.6mm pitch connector built for use in high-speed serial applications.

10142344-108KLF. MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, Staggered, Top latch, 8 Ways

FCI Basics Millipacs ® is a 2.00 mm grid Interconnection system in hard metric configuration designed in accordance to IEC 917, IEC 61076-4-101, Telcordia GR-1217-CORE standards and fulfills Compact PCI bus architecture. As one of the most popular Backplane connector series, Millipacs ® is feature-packed for rugged environments. Features like two-beam twisted tulip contact, header pin length ...

Mini Cool Edge IO(MCIO), SFF-TA-1016, PCIe Gen 5, 85Ω, Surfacemount, Vertical, 124 Pin, PCIe, SAS, SFP, NVMe, cable, dual, card.

The EDSFF 2-piece cable solution supports data rates of up to PCIe ® 5.0 at 32Gb/s. It utilizes the EDSFF standard interface Mini Cool Edge 1C/2C connectors on one cable end, offering flexibility in connector form factor selection such as MCIO, Multi-Trak ™, Backplane connectors, and more on the other end.. Ideal for high-speed computing data center server systems, this solution eliminates ...

Amphenol's D-Subminiature are standard-setting connectors. They are the most popular Input/Output interconnects with a wide variety of applications.

ABOUT Commercial IO. Amphenol is a global provider of interconnect solutions to the designers and manufacturers of electronic equipment worldwide. Together with Power Solutions and Storage & Server IO business units within the Amphenol group, Commercial IO addresses all types of electronic interconnect applications and challenges.

HSD Connector, right angle, DIP, HSD+0, 1X1, C Coding with North, tape and reel, Enhance Type

The ExaMAX I/O system offers cable assemblies and I/O connector solutions for both internal and external applications. ExaMAX I/O products are capable of delivering high speed performance of 25 Gb/s per channel with a path to 40 Gb/s and higher.

MicroSpace™ Crimp-to-Wire connector platform unique design enables LV214 Severity-2 and performs at 1.27mm, 1.50mm and 1.80mm pitch. MicroSpace™ will be available in single and double row versions, with top and side latch configuration.

10174399 (18/20p) 10169084 (28p) ©2024 Amphenol Communications Solutions 5 Image. Pitch. Description. Wire to Board : Max. Current (A) Wire size: Plating.

Open Compute Project, also known as OCP, is a community focused on redesigning hardware technology for hyper-scale data centers, telecom & colocation providers, enterprise IT users, and many more markets.