Search Results for gfl grid following
Millipacs ® High Temperature Backplane Connectors - Amphenol CS
Amphenol's Millipacs is a 2.00mm grid Interconnection system in hard metric configuration designed in accordance to IEC 917, IEC 61076-4-101, Telecordia GR-1217-CORE standards and fulfills Compact PCI bus architecture.
cLGA- The Highly Adaptive Compression Solution - Amphenol CS
The cLGA Land Grid Array socket system is a low cost, high signal integrity, and high reliability offering from the Amphenol ICC family to bring conventional connector material construction to high-performance chip-to-board applications.
cLGA® | Mezzanine Connectors | Spring Contact - Amphenol CS
The Amphenol cLGA ® land grid array socket system was designed to bring conventional connector material construction to high-performance, low-cost chip-to-board applications. Gold over nickel-plated copper alloy spring contacts guarantee long-term connector performance, contact retention, and ruggedness.
Revision “A” - Amphenol Aerospace
1.1.1 This specification covers the performance, test, and quality requirements for the XCede HD2 backplane interconnect system. These connectors are two-piece devices that connect two printed circuit boards. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts.
Next Generation High-Speed Backplane Interconnect Systems - Amphenol CS
Amphenol offers the most comprehensive backplane connector and cable portfolio in the industry. With supporting speeds up to a staggering 224G and compatibility with PCIe ® Gen7, these innovative interconnects redefine the benchmarks of connectivity.
Card Edge Connectors | Cables | High-Speed Cable Assemblies - Amphenol CS
Card edge cable assemblies are electronic cabled interconnects that mate with the edges of single-sided or double-sided printed circuit boards (PCBs). These connectors have a smooth mating surface area and are built in such a way that reduces wear and tear on contacts.
SFU and MDU Solutions - amphenol-ns.com
Amphenol Network Solutions provides a wide range of solutions for Single-Family Units (SFU) and Multi-Dwelling Units (MDU) designed to optimize fiber connectivity. Offerings include indoor wall-mount enclosures such as:
termination-instructions-sae-circular-gt-series-amphenol-industrial
Crimp type contacts in size 4/0,1/0,0,4,8,12,16 and 16S are available for use in these insert arrangements. This publication contains information for proper crimping, insertion and removal of crimp contacts as well as applicable tool information. Cleaning:
Hyper Cool Edge Connectors | Storage and Server Systems - Amphenol CS
108 signal pins+ 156 signal pins with 2 power… Support single-ended, high-speed diff pairs up to 64G PAM4. Upgradeable up to 112G PAM4. Have any questions? Talk with us directly using LiveChat.
NUMBER GS-12-445 PRODUCT SPECIFICATION - Amphenol CS
Specification for Two-part Modular Connectors, Basis Grid of 2mm, with Terminations on a multiple Grid of 0.5mm 4.2.2 EIA616 2 Millimeter, Two-Part Connectors for use with printed ... Specification BUS-03-114 and the following details: a. Spécification requirement 2.2 pF max. b. Sample test conditions Frequency 1mhz Amplitude 1volts
10128417-11JLF | ExaMAX® | Amphenol
ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 3-Pair, 10 column, 110 position, Right Angle Receptacle, Right Guide Pin. The information below is for reference only. For more technical details, refer to product specification and application specification. Have any questions? Talk with us directly using LiveChat.
NUMBER GS-12-447 PRODUCT SPECIFICATION - Amphenol CS
Specification for Two-part Modular Connectors, Basis Grid of 2mm, with Terminations on a multiple Grid of 0.5mm 4.2.2 EIA616 2 Millimeter, Two-Part Connectors for use with printed ... Specification BUS-03-114 and the following details: a. Spécification requirement 2.2 pF max. b. Sample test conditions Frequency 1mhz Amplitude 1volts
UltraPass OverPass Assemblies | High Speed Input Output - Amphenol CS
224G CONNECTION DIRECTLY FROM CHIP SITE TO EXTERNAL PORTS. UltraPass™ enables arrayed connector layouts for near-chip and on-package IO solutions, providing the highest differential pair count interconnect offering in the market. Beginning of dialog window. Escape will cancel and close the window. This is a modal window.
AMPHENOL TCS
Each 4-Pair wafer has 18 connections – 8 signals and 10 grounds. The 6-Pair wafer has a total of 26 connections - 12 Signals and 14 Grounds. The wafer construction allows for the contacts to be spaced on a 1.15mm x 2.3mm interstitial grid. The connector can be specified in multiple separation heights – see section 2.1.
98424-G52-06ALF | Minitek ® 2.00mm BTB/WTB | Amphenol
Minitek ®, Board/Wire to Board Connector, 2.00mm (0, 079in), Shrouded Vertical Header, Surface Mount, Double Row, 6 positions. We may offer limited quantity of sample for this part. Click on the Check Sample (if available) button to check the allowed sample quantity in the cart.
Table of Contents - Amphenol CS
ExaMEZZ connectors use compliant tails to provide a reliable press-fit electrical connection between the connector and plated through hole (PTH) of the PCB. The compliant tails in ground positions are larger than in signal positions for robustness in application.
Sundy - Amphenol CS
Scope - This specification covers the insulation piercing QuickieTM Connector designed for printed wiring board-to-flat cable (round conductor) interconnection in low power applications. In all applications the mated system (male to female) plating should be gold to gold or GXT to GXT. The specification is composed of the following sections.
GIG-Array | Mezzanine Connectors | Amphenol FCI
Amphenol's GIG-Array ® connectors are designed to meet the needs of applications up to 10Gb/s requiring up to 296 signal pins per connector. Amphenol's long tradition as a BGA connector innovator assures expertise and reliability in the GIG-Array ® BGA design.
ExtremePort™ OSFP-XD 112G Connectors | High Speed I/O | Amphenol
Amphenol's ExtremePort™ OSFP-XD 112G interconnect system is comprised of a 120-position, 0.6mm pitch connector built for use in high-speed serial applications. Each port supports up to 1.6Tb/s in aggregate over a 16 x 112Gb/s electrical interface. The OSFP-XD footprint is optimized for signal integrity performance.
AgilLink™ 1.0mm Wire-to-Board - Amphenol
AgilLink™ 1.0mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including Single Row V/T SMT, R/A SMT and Dual Row V/T SMT, R/A SMT to meet various customer requirements.