Search Results for hdmi

Amphenol's BarKlip ® BK600 I/O power cable assemblies feature an OCP-compatible design, meeting ORv3 power distribution architecture standards.

MicroSpaceXS™ Crimp-to-Wire connectors with a unique design meeting LV214 up to Severity-3 and USCAR-T2V2 specs. Ideal for higher power applications with a 1.27mm pitch and 4A per contact rating.

OSFP Cable Assembly, Linear Active, 32AWG, 1M, 112G / Lane, Flex Sleeve

DDR5/LPDDR5 CAMM2 Connector COMPLIES TO JEDEC SO-032 SPEC The DDR5/LPDDR5 CAMM2 connector follows JEDEC standards with 644 pins, has a pitch of 1.00x1.38mm, and a connector height...

SUPPORTS 57.8GB/S DATA RATE & LOW POWER. The module is Compatible with 64G FC-PI-7. Low power - 1.5W; Mature COB technology; Outstanding BER and sensitivity

Mezzostak® 0.5mm from FCI Basics is a robust 0.5mm fine pitch mezzanine connector suitable for a wide range of high-reliability applications and demanding environments.

Amphenol CS brings a broad array of innovative technology and solutions to support the growth for Information, Communications and Commercial electronics markets, particularly in plating, signal integrity performance, and power management.

FEATURES BENEFITS; Broad offering of: Pitch sizes: 0.4mm - 2.0mm Positions: 2 - 200 Heights:1.5mm - 20mm FPC lengths: 100mm to 500mm Special FPC shapes

Amphenol is one of the leading manufacturer of Memory and Media Card Sockets. The product range includes smart card connectors, SIM Card Connectors and Flash memory products.

FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS . FCI Basics BergStak ® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 9 sizes up to 200 positions.. Housing and terminal profile guarantees support of up to 12Gb/s . Vertical versus vertical mating configuration

Amphenol's ExtremePort QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high speed serial applications. Each port offers 4 channels to increase port density which allows for more board real estate and cos

Environmentally-protected enclosure designed for maximum flexibility and multiple fiber, copper or coaxial applications Amphenol’s new CFIT-Flex ™ Series of universal enclosures were designed around the principal of “flexibility.” These versatile enclosures may be wall, pole, strand or pedestal mounted and configured to meet a variety of fiber, copper or coaxial distribution applications.

A. AgilBrick™ 1.27mm Board-to-Board Header G802 ; AgilBrick™ 2.00mm Board-to-Board Header G825 ; AgilBrick™ 2.54mm Board-to-Board Header G800

HDPE Below Grade Enclosure . The Amphenol HDPE Below Grade Enclosures (HBGE) are lightweight, molded polyethylene handholes.

ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 6-Pair, 6 column, 120 position, Vertical Receptacle, No Guide Pin.

FCI Basics is the leader in Wire-to-Board Signal Solutions. Building on the strengths of FCI connectors, whom Amphenol acquired in 2016, FCI Basics continues this legacy providing robust, modular, compact connector solutions to anticipate and meet the needs of exponentially rising data rates and minimising signal losses at the time of insertion.

PwrBlade®, Power Connectors, 3ACP 2P 24S 4P Right Angle Header, Solder To Board

Amphenol is one of the leading manufacturers of Input Output Connectors. Contact us today for more details of USB 2.0 CONN (Type A and B) Part Number, UE27AC54100.

BergStik® 2.54mm unshrouded headers are available in surface-mount (SMT), through-hole (THT), press-fit, stacking and pin-in-paste (PIP) versions. Contact our Live Chat for more info.

Amphenol is one of the leading manufacturers of MICRO USB. Contact us today for more details of MICRO USB 2.0, part number 10118192-0001LF.