Search Results for high power connectors

High power contact options for mil-spec type connectors to increase ampacity by up to 50%. High Speed Contacts Wide variety of high-speed copper contacts for HDMI, USB 3.0, Gigabit Ethernet and other high-speed applications

Amphenol’s PowerSafe MIL-DTL-38999 Series III High Power Connector uses first mate/last break and last mate/first break technology and is designed for transmitting high power with voltages up to 500V in harsh environments, all while keeping user safety in mind. PowerSafe offers six contact arrangements for three phase and single-phase ...

The MIL-DTL-38999 series of connectors was born in the 1960’s to provide a ruggedized military solution featuring smaller contacts and higher density insert patterns than the already popular MIL-DTL-5015.

The High Power 38999 connector series incorporates two key technologies, RadSok and Temper-Grip High Current contacts, paired with the proven performance of the MIL-DTL-38999 connector series. View Download. MGT-5015 Data Sheet The MGT line of connectors is an expansion of the GT-5015 series, offering a rugged environment connector in new ...

Amphenol's shielded high-speed Minitek™ MicroSpeed board-to-board connector supports high speeds of up to 25Gb/s. Power Connectors. Amphenol's power board-to-board connectors provide a cost-effective system for DC power output from embedded AC/DC power supplies or for power distribution between boards within an enclosure.

We extend the product offerings beyond the standard mil-spec connectors by designing and manufacturing high-power options, lanyard release or quick disconnect connectors, BACC63 and EN2997 connectors, Dualok high-vibration connectors, connectors with printed circuit board contacts, bulkhead feed-throughs, RoHS-compliant platings, and many more ...

ROBUST, VERSATILE AND HIGH CURRENT PERFORMANCE. Minitek ® Pwr 3.0 High Current Connector (HCC) is designed for power applications with a current rating of up to 12A per contact and a wire gauge range from 16AWG to 30AWG for Wire-to-wire and Wire-to-Board applications. It is available in 2 to 24 circuits for dual rows and 2 to 12 circuits for single rows.

Amphenol high power connectors lead the way with modern high-powered electric-driven technology in a world that’s trending toward more electric power. As the world pivots toward the electrification of everything, global industries require connectors that can reliably and safely facilitate high currents and high voltages to power today's and ...

Amphenol doesn’t just offer connectors within standard MIL-SPEC boundaries; customization beyond MIL-SPEC standards to craft any interconnect solution to meet your unique needs is available through our 38999 Plus catalog.. Whether it’s signal connectors, power connectors, hybrid or high-speed connectors, 38999 Plus presents a massive inventory of MIL-SPEC styles and options to overcome any ...

The Amphenol Tri-Power connector series incorporates your choice of RadSok contacts, Temper-Grip High Current contacts, or standard high power contacts. Paired with the proven performance of the MIL-DTL-38999 connector series, the Tri-Power series offers a variety of tooled arrangements specifically designed to carry high current (70 to 250 amps per contact, 240 to 1000 amps per connector).

High Power 38999, High Voltage 38999, HVDC, and custom busbars to meet the latest power needs for electric and hybrid-electric military vehicles, and all-electric urban air mobility and commercial aircraft.

HVDC is a low mating force, high mating cycle connector that achieves enhanced performance due to multiple points of contact vs. standard 2 or 4 tine contacts. Features & Benefits: Weight savings with a composite shell and hollow pin design threaded or lug termination

The Matrix MIL-DTL-5015 is a crimp, rear-release high power connector that provides an improved alternative to the older MIL-C-5015 solder type. It bridges the gap between an old connector standard and the need for environmental and high-performance standards in current technologies.

The PowerSafe connector from Amphenol Socapex is a high-performance solution designed for transmitting high power with voltages over 500V, meeting the most stringent requirements of the market regarding user safety. It is certified according to EN61984 and EN60664, ensuring that it is safe for use in even the most demanding applications. The PowerSafe connector is ideal for use in I/O power ...

The High Power Card Edge (HPCE ®) connector is a next-generation power card edge connector for demanding applications requiring high linear current density and low power loss. HPCE ® incorporates an innovative power contact and a housing design that permits a more compact and lower profile package for demanding AC and DC power supply and/or ...

eHPCE® connectors offer a 15% increase in power density with the same footprint as classic HPCE®. The all-new power contact design offers lower contact resistance and higher current carrying capacity compared to classic HPCE ® connectors. eHPCE connectors are designed to extend the life of power supplies using card edge output power connectors.

Cool Edge is a high speed and high power card edge connector system that supports most BTB applications in electronics market. These versatile solutions address multiple standards like PCIe, SAS, SATA, Gen 4/5, OCP 3.0, EDSFF, NGSFF/NF1, Gen Z and offer multiple BTB configurations such as mezzanine, coplanar, midplane and backplane.

Rhino 38999 connectors are being utilised across a wide range of critical power applications. High Power Connector Series Amphenol is the foremost manufacturer of both connectors and interconnect systems specifically for applications within military, aerospace and industrial markets.

The MIL-DTL-38999 series of connectors was born in the 1960’s to provide a ruggedized military solution featuring smaller contacts and higher density insert patterns than the already popular MIL-DTL-5015.

Developed in alignment with The Open Group Sensor Open Systems Architecture™ (SOSA) technical standard, MIL-HD2 provides developers with a readily available, robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical.