Search Results for high voltage
PCI Express ® DirectAttached™ CEM Card Edge Connectors
Amphenol's 1.0mm DirectAttached™ CEM is a hybrid card edge solution with high-speed signal and press-fit power pins. Reduce PCB trace loss and enhance rework.
High Speed FPC Connector - Amphenol CS
Title: High Speed FPC Connector Author: Amphenol Subject: High Speed FPC (Flexible Printed Circuit) is a connector with capability to transfer data rates up to 10Gb/s.
Temper-Grip | High Power 38999 - Amphenol Aerospace
High-Temperature Capability: For use in high-temperature (392 °F/200 °C+) applications, the Temper-grip socket has been tested to maintain current capability in high-temperature situations where standard mil-spec socket contacts can begin to relax
OverPass™- The High Speed Solution - Amphenol CS
Amphenol’s OverPass ™ cable system offers a broad range that allow customers to efficiently take high speed signal from near the ASIC to anywhere in their system.. Amphenol’s OverPass ™ cable system allows for the transfer of high-speed signals to twinax cables shortly after they are launched from the ASIC. This enables a simple, low-loss, direct link to pluggable modules or anywhere ...
CoolPower SDM | Power Solutions | Amphenol
CoolPower ® Slim Drawer Mini (SDM) Connectors offer a high level of mating configuration flexibility, current density, and a thin profile making it ideal for compact board-to-board power interconnects.
Hardline Connector - Amphenol Broadband Solutions
Revolutionizing Connectivity: Amphenol's Next-Generation Hardline Connectors . Solve Deployment & Maintenance Challenges for Today's Networks
Mounting hardware and accessories - Wilcoxon Sensing Technologies
buy.wilcoxon.com wilcoxon.com 4 info@wilcoxon.com Mounting studs Stud mounting is the most reliable mounting option because it can achieve the sensor’s maximum frequency range and is highly recommended for permanent monitoring
MicroSpaceXS™ 1.27mm Unsealed - Amphenol CS
MicroSpaceXS™ Unsealed 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, Staggered, Top Latch, 10 Ways
High Power 38999 Connectors with High Current Contacts
The Amphenol Tri-Power connector series incorporates your choice of RadSok contacts, Temper-Grip High Current contacts, or standard high power contacts. Paired with the proven performance of the MIL-DTL-38999 connector series, the Tri-Power series offers a variety of tooled arrangements specifically designed to carry high current (70 to 250 amps per contact, 240 to 1000 amps per connector).
TN-17 Accelerometer Selection Considerations - PCB
Cost-PE accelerometer cost is essentially the same as anequivalent ICP® design. However, since the PE accelerometer requires the use of low-noise cable and charge amplifiers, cost per-channel is higher than an ICP® voltage output channel. Cables and
Model 357B11 High temp., miniature (2 gm), ceramic shear, charge ... - PCB
Model 357B11 High temp., miniature (2 gm), ceramic shear, charge output accel., 3 pC/g, 12k Hz, 5-44 side conn.(-95 F to +500 F) Installation and Operating Manual
CFP8 | High Speed Interconnects - Amphenol
Amphenol CFP8 interconnect system has 124 contacts per port, with a 0.5mm contact pitch and 16 high speed channels. It is rated for 28Gb/s per channel with resonance dampening for improved signal integrity. It is comprised of insert molding assemblies for
The Fastest Ethernet Cables – A Preview of Cat-8 - Amphenol CS
Features of Cat-8. Backward Compatibility. One of the standout features of Cat-8 cables is their backward compatibility. A Cat-8 cable uses the same 4-pair, 8-conductor wiring arrangement as the previous generations and maintains the use of the RJ45 connector, backward-compatible with almost any RJ45 port.
QSFP-DD 200G Active Optical Cable - Amphenol
Amphenol QSFP DD to QSFP DD 200G Active Optical Cable assemblies increase the number of lanes from 4 to 8 and double the port density as compared to 100G QSFP28 AOC. The QSFP DD AOCs operate up to 25Gb/s NRZ modulation and provide solutions up to 200Gb/s
HCI Connector System | Power Solutions | Amphenol
The HCI connector system anticipates the continued trend toward increased system power demands that is driving the need for increased power density. The HCI ® connector system is designed to address requirements that extend beyond the capabi
IPC-M350 Connectors | Power Solutions | Amphenol
Amphenol's IPC-M350, an ideal battery solution interconnect, is capable of housing two separate 350MCM (185mm 2 ) contacts rated for up to 500A (UL rated).
SFP OverPass Assemblies | High Speed Input Output | Amphenol
SFP OverPass products remove high speed signaling from the PCB and create a direct connection between the ASIC site and the external IO port by overpassing the PCB. This helps to enable 28G and 56G hardware system designs.
1RU High Density Premises Bracket - Amphenol Broadband Solutions
This bracket takes advantage of the industry-leading density of Amphenol Broadband Solutions’s HiD4 cassette to pack much greater fiber capacity into 1RU of space.
Mini Power Plus 4.2 | Wire To Board Connectors | Amphenol
Amphenol's Mini Power Plus 4.2 connector system with a 4.20mm pitch, supports up to 13A per pin and 20-16AWG wire, ideal for wire-to-board power applications.
OverPass™ Interconnects – Your high speed , Low Loss Chip-to-Module ...
Amphenol ICC’s OverPass ™ cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface. The system transfers high-speed signals to twinax cables shortly after they are launched from the chip and delivers a direct link to the external port when compared ...