Search Results for lga module

BOARD/WIRE-TO-BOARD CONNECTORS PCI EXPRESS@CARD EDGE CONNECTORS Extend differential signaling to 8.0GB/S for new generation systems OVERVIEW These 1.0mm pitch, vertical card edge connectors trom FCI enable all generations ot PCI Express. signaling in desktop PCs, workstations, and sewers.

The cLGA Land Grid Array socket system is a low cost, high signal integrity, and high reliability offering from the Amphenol ICC family to bring conventional connector material construction to high-performance chip-to-board applications.

The low profile module connector (6.5mm) mounts to the board via an LGA connector to facilitate optics as an option. It is offered as a 4-channel transceiver, a 12 channel transmitter or a 12-channel receiver. All module connectors operate at up to 12.5 Gbps per lane from -40 to +85°C at ultra-low bit error rates of 10-15. The

Gold over nickel-plated copper alloy spring contacts guarantee long-term connector performance, contact retention and ruggedness. cLGA ® sockets are used in applications ranging from handheld computer products to supercomputer systems. The cLGA ® socket is fully qualified under Telcordia GR-1217-CORE specifications.

This specific power module takes 28VDC (nominal) input and outputs 12VDC at up to 300 Watts. Capable of extended temperature operation, EMI, and high shock/vibration environments. The unit meets MIL-STD-704F and provides a 50 millisecond hold up time.

Figure 3: BGA or LGA Interposer Subassembly with press fit alignment dowels pins. This is the modular component of the Ardent socket system which can be easily cleaned, repaired and replaced.

Amphenol AOP’s 192Gbps Leap® On-Board Transceiver is the fastest, smallest and most cost effective optical transceiver module in the military and aerospace industry. Supports non-standard protocols in this range of datarates. Please note that the above information is subject to change without notice.

High Performance BGA/LGA Socket Quick Setup Guide RC Spring Probe™ System Inserting the Device Preparing the Board • Be sure the PCB pads are gold plated. • Complete all solder rework before socket installation. • Clean the pads with 100% isopropyl alcohol • CLEAR THE PAD FIELD OF DEBRIS, RESIDUE, OR OTHER CONTAMINANTS. Mounting the ...

CAMM2 IS THE NEXT-GENERATION MEMORY INTERCONNECT. Amphenol is introducing the CAMM2 connector which is a JEDEC standard and comes in several stack heights and pin sizes. CAMM2 uses Amphenol cLGA ® direct-attach compression technology for high-performance and low stack height for today's thin laptops. Contact tips… Have any questions?

As Ardent’s custom LGA connector was proven in the test scenario, the R&D engineers became aware of the solution and leveraged Ardent’s proven technology for topside chip to diagnostic equipment and chip short haul electrical interconnect. Initial test environment challenges...

Amphenol's high density, cost effective cLGA and cStack solutions provide both a heat-sink opening and features for precise alignment of the interposers to the DMD and main PC Board. Use the documentation to the right to find the socket for the DMD for which you are designing.

highly configurable design, CR™ can be used for LGA and BGA applications, and is available in both compression mount and solder down configurations. The flexibility of CR™ allows engineers to design reliable interfaces for thermal applications with an all-metal contact interface for optimal reliability.

The types of memory modules available today can be broadly classified into Single In-Line Memory Module (SIMM) and Dual In-Line Memory Module (DIMM). SIMM was one of the earliest multichip memory modules used in PCs, generally with 30pins and 70pins, and a 32–bit data path.

tronics systems. Our core technology is the smallest, fastest, most electrically efficient compression mount connector tech. ology worldwide. As data rate requirements increase and devices and systems shrink, Ardent’s products deliver superior signal integrity in a dense footprint that can be reusable across programs to maxim.

In addition to these styles, there are many other board termination styles, including Land Grid Array (LGA) and the patented Ball Grid Array (BGA) that find applications in high-speed mezzanine connectors like cLGA ®, cStack ™, M-Series ™, MEG-Array ®, and Chameleon ®.

Performance BGA/LGA Socket using either our RC Spring Probe™ or our RC-Connect-R™ contact series. Introduction: Ardent Concepts utilizes our industry leading compression mount, solderless high performance contact technology to provide the ideal solution to whatever our customers’ needs and specific requirements may be. We have a long history

The Mezzanine Connector, SK Series Chip-to-Board Socket from Amphenol offers high performance with patented compression mount technology, supporting up to 40GHz speed and 0.4mm pitches for cutting-edge ICs.

FCI Basics offers Millipacs® series HM right angle receptacles in standard signal modules of 5 and 8 rows. Besides signal module, hybrid modules are available with signal pins, power and coax contacts.

At the core of Data Center functionality, Network Modules comprise Switching and routing components that orchestrate the intricate flow of data. Within Data Center racks, switches connect devices, enabling seamless communication, while routers establish connections between diverse networks.